公开(公告)号：EP0456982A1

公开(公告)日：1991-11-21

申请号：EP91103686.1

申请日：1991-03-11

Applicant: SHIPLEY COMPANY INC.

Inventor： Gulla, Michael ,  Sricharoenchaikit, Prasit

IPC: C23C18/28

CPC classification number: C23C18/28

Abstract: A process for metal plating characterized by use of an accelerator solution of a metal reducible by stannous tin between a step of catalysis and metal deposition.

Abstract translation: 一种用于金属电镀的方法，其特征在于在催化步骤和金属沉积之间使用可由亚锡锡还原的金属促进剂溶液。

公开(公告)号：EP0397988A2

公开(公告)日：1990-11-22

申请号：EP90105228.2

申请日：1990-03-20

Applicant: SHIPLEY COMPANY INC.

Inventor： Gulla, Michael ,  Sricharoenchaikit, Prasit

IPC: G03F7/40

CPC classification number: H05K3/185 ,  G03F7/265 ,  G03F7/40

Abstract: This invention describes methods for altering a substrate in a fine line image pattern using a microlithographic process including formation of a metal mask over a photoresist coating to protect the photoresist coating during dry development of the same. The invention also describes a method for formation of the metal mask. Briefly stated, the process of the invention comprises the steps of coating a substrate with a photoresist coating, exposing the photoresist coating so formed to a desired pattern of actinic radiation, catalyzing the entire surface of the photoresist coating with an electroless plating catalyst, developing the photoresist layer to a depth at least sufficient to remove the undesired catalyst layer in an image pattern, forming a metal pattern on the desired (remaining) catalyst layer and dry developing the remaning photoresist coating unprotected by the metal mask.

Abstract translation: 本发明描述了使用包括在光致抗蚀剂涂层上形成金属掩模的微光刻工艺来改变细线图像图案中的衬底的方法，以在其干燥显影期间保护光致抗蚀剂涂层。 本发明还描述了形成金属掩模的方法。 简要说明，本发明的方法包括以下步骤：用光致抗蚀剂涂层涂覆基材，将形成的光致抗蚀剂涂层暴露于期望的光化辐射图形，用化学镀催化剂催化光致抗蚀剂涂层的整个表面， 光致抗蚀剂层至少足以去除图案图案中的不需要的催化剂层的深度，在期望的（剩余的）催化剂层上形成金属图案，并干燥显影未被金属掩模保护的残留光刻胶涂层。

公开(公告)号：EP0180713A1

公开(公告)日：1986-05-14

申请号：EP85108493.9

申请日：1985-07-09

Applicant: SHIPLEY COMPANY INC.

Inventor： Cardin, William J. ,  Gulla, Michael ,  Newton, Charles L.

IPC: C23C18/40 ,  C23C18/50

CPC classification number: C23C18/1683 ,  C23C18/1617 ,  C23C18/36 ,  C23C18/405

Abstract: A controller for measuring the concentration of consumable ingredients in a plating solution characterized by the use of a plating poison introduced into the analysate stream to prevent autocatalytic decomposition and deposition of copper onto the walls and sensors of the controller.