公开(公告)号：EP3971946B1

公开(公告)日：2024-08-28

申请号：EP21783120.5

申请日：2021-06-15

IPC分类号： H01L21/027 ,  G03F7/095 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/40 ,  H01L21/311

CPC分类号： G03F7/095 ,  G03F7/168 ,  G03F7/38 ,  G03F7/2014 ,  G03F7/40 ,  H01L21/0272 ,  H01L21/0273 ,  H01L21/31144

公开(公告)号：EP4398289A1

公开(公告)日：2024-07-10

申请号：EP22864133.8

申请日：2022-07-29

申请人： FUJIFILM Corporation

发明人： NOZAKI, Atsuyasu ,  TAKASHIMA, Misaki ,  SATO, Naoki ,  NAKAMURA, Atsushi

IPC分类号： H01L21/312 ,  C08G73/10 ,  G03F7/027 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  G03F7/037 ,  G03F7/038 ,  G03F7/42

CPC分类号： G03F7/027 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  H01L21/02118 ,  H01L21/02282 ,  G03F7/0387 ,  G03F7/38 ,  G03F7/325 ,  C08G69/265 ,  C08G69/40 ,  C09D177/06 ,  C08F290/145 ,  G03F7/037 ,  G03F7/0388 ,  G03F7/405 ,  G03F7/425

摘要： There is provided a manufacturing method for a cured substance, which makes it possible to obtain a cured substance having excellent breaking elongation, a manufacturing method for a laminate, including the manufacturing method for a cured substance, a manufacturing method for a semiconductor device, including the manufacturing method for a cured substance or the manufacturing method for a laminate, and there is provided a treatment liquid that is used in the manufacturing method for a cured substance.
The manufacturing method for a cured substance includes a film forming step of applying a resin composition containing a precursor of a cyclization resin onto a base material to form a film, a treatment step of bringing a treatment liquid into contact with the film, and a heating step of heating the film after the treatment step, in which the treatment liquid contains at least one compound selected from the group consisting of a basic compound having an amide group and a base generator having an amide group.

公开(公告)号：EP4379394A1

公开(公告)日：2024-06-05

申请号：EP22849459.7

申请日：2022-07-26

申请人： TOPPAN INC.

发明人： HAKII, Hidemitsu ,  FUKUGAMI, Norihito

IPC分类号： G01N35/08 ,  B01D19/00 ,  B01J19/00 ,  B05D3/06 ,  B81B1/00 ,  B81C1/00 ,  B81C3/00 ,  G01N37/00 ,  G03F7/40

CPC分类号： B01D19/00 ,  B01J19/00 ,  B05D3/06 ,  B81B1/00 ,  B81C1/00 ,  B81C3/00 ,  G01N35/08 ,  G01N37/00 ,  G03F7/40

摘要： There is provided a microfluidic chip and a method of producing the microfluidic chip, which can suppress poor bonding between a resin layer forming a channel and a lid component, and can suppress deformation of the channel. A microfluidic chip (1) includes a substrate (10), a partition layer (11) configured by a resin material and provided on the substrate (10) to form a channel, and a cover layer (12) provided on the surface of the partition layer (11) facing away from the substrate (10), wherein the partition layer (11) has an elastic modulus in the range of 1 MPa or more and 10 GPa or less.

公开(公告)号：EP2856259B1

公开(公告)日：2018-12-26

申请号：EP13797402.8

申请日：2013-05-24

申请人： The Regents of the University of California

发明人： DESAI, Tejal A. ,  CHIRRA, Hariharasudhan D.

IPC分类号： G03F7/00 ,  A61K9/00 ,  G03F7/40

CPC分类号： A61M31/002 ,  A61K9/0097 ,  G03F7/0035 ,  G03F7/40

摘要： A method of preparing a substantially planar microdevice comprising a plurality of reservoirs is provided. In general, the method comprises forming a plurality of microdevices comprising a plurality of reservoirs from a planar layer of a biocompatible polymer. The method also comprises depositing one or more bioactive agents into the reservoirs. The microdevice is configured to attach to a target tissue and release the bioactive agent in close proximity to the tissue.

公开(公告)号：EP2861638B1

公开(公告)日：2018-11-14

申请号：EP13723081.9

申请日：2013-05-13

申请人： AZ Electronic Materials (Luxembourg) S.à.r.l.

发明人： CHEN, Chunwei ,  LU, PingHung ,  LIU, Weihong ,  TOUKHY, Medhat A. ,  KIM, SangChul ,  LAI, SookMee

IPC分类号： C08F220/18 ,  G03F7/027 ,  G03F7/033 ,  G03F7/038

CPC分类号： G03F7/028 ,  C08F220/18 ,  G03F7/027 ,  G03F7/033 ,  G03F7/0755 ,  G03F7/0757 ,  G03F7/30 ,  G03F7/40 ,  C08F2220/185 ,  C08F220/20 ,  C08F2220/281 ,  C08F220/06 ,  C08F2220/1825 ,  C08F212/08

摘要： Disclosed are compositions for negative-working thick film photophotoresists based on acrylic co-polymers. Also included are methods of using the compositions.

公开(公告)号：EP3125274B1

公开(公告)日：2018-09-12

申请号：EP15769513.1

申请日：2015-03-18

申请人： Toray Industries, Inc.

发明人： TANIGAKI, Yugo ,  FUJIWARA, Takenori

IPC分类号： G03F7/42 ,  H01L21/027 ,  G03F7/023 ,  G03F7/075 ,  H01L21/304 ,  H01L21/306 ,  G03F7/40

CPC分类号： H01L21/0272 ,  B08B3/08 ,  B08B7/0057 ,  G03F7/0233 ,  G03F7/0757 ,  G03F7/40 ,  G03F7/42 ,  G03F7/423 ,  G03F7/425 ,  G03F7/427 ,  H01L21/0206 ,  H01L21/266 ,  H01L21/3081 ,  H01L21/31058 ,  H01L21/31111 ,  H01L21/31116

摘要： Disclosed is a method for manufacturing a semiconductor device, including a step of yielding a pattern 2a of a polysiloxane-containing composition over a substrate 1, and a step of forming an ion impurity region 6 in the substrate, wherein, after the step of forming an ion impurity region, the method further includes a step of firing the pattern at a temperature of 300 to 1,500°C. This method makes it possible that after the formation of the ion impurity region in the semiconductor substrate, the pattern 2a of the polysiloxane-containing composition is easily removed without leaving any residual. Thus, the yield in the production of a semiconductor device can be improved and the tact time can be shortened.

公开(公告)号：EP2204698B1

公开(公告)日：2018-08-08

申请号：EP09015549.0

申请日：2009-12-16

申请人： FUJIFILM Corporation

发明人： Fujii, Shigekatsu ,  Aoshima, Norio ,  Watanabe, Toshihiro ,  Kubota, Yasuhiro

IPC分类号： G03F7/32 ,  G03F7/40

CPC分类号： G03F7/40 ,  B41N3/038

摘要： A plate surface treatment agent for a lithographic printing plate is provided that includes a vinyl copolymer containing a monomer unit having at least one group selected from the group consisting of a phosphonic acid group, a phosphoric acid group, a carboxylic acid group, and a salt of these groups and a monomer unit having at least one group or structure selected from the group consisting of a sulfonic acid group, a salt thereof, an amide group, and a betaine structure. There is also provided a method for treating a lithographic printing plate that includes a step of imagewise exposing a lithographic printing plate precursor, a step of processing using a developer, and a step of carrying out a plate surface treatment using the plate surface treatment agent for a lithographic printing plate.

公开(公告)号：EP2957955B1

公开(公告)日：2018-06-06

申请号：EP15001757.2

申请日：2015-06-15

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Takemura, Katsuya ,  Iio, Masashi ,  Urano, Hiroyuki ,  Miyazaki, Takashi

IPC分类号： G03F7/023 ,  G03F7/075

CPC分类号： G03F7/039 ,  G03F7/022 ,  G03F7/0226 ,  G03F7/0236 ,  G03F7/0757 ,  G03F7/09 ,  G03F7/11 ,  G03F7/16 ,  G03F7/20 ,  G03F7/30 ,  G03F7/32 ,  G03F7/40

摘要： The present invention provides a positive photosensitive resin composition containing (A) a polymer compound obtained in the presence of an acid catalyst by condensation of at least a siloxane compound shown by formula (1), a phenol compound(s) shown by formula (2) and/or formula (3), and aldehydes and ketones shown by formula (4), (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinker, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination generated on a metal wiring, an electrode, and a substrate such as Cu and Al, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when the widely used 2.38% TMAH aqueous solution is used as a developer.

公开(公告)号：EP3327504A1

公开(公告)日：2018-05-30

申请号：EP17202732.8

申请日：2017-11-21

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： HIRANO, Yoshinori ,  ASAI, Satoshi ,  KONDO, Kazunori

IPC分类号： G03F7/039 ,  G03F7/40

CPC分类号： G03F7/0392 ,  G03F7/0397 ,  G03F7/094 ,  G03F7/11 ,  G03F7/161 ,  G03F7/20 ,  G03F7/30 ,  G03F7/40

摘要： A laminate comprising a thermoplastic film and a chemically amplified positive resist film thereon is provided, the resist film comprising (A) a base polymer having a hydroxyphenyl group and a protective group, the polymer turning alkali soluble as a result of the protective group being eliminated under the action of acid, (B) a photoacid generator, (C) an organic solvent, and (D) a polymer having an ester bond in its backbone. The resist film may be transferred to a stepped support without forming voids.

公开(公告)号：EP3325689A1

公开(公告)日：2018-05-30

申请号：EP16825231.0

申请日：2016-07-15

申请人： Pixelteq, Inc.

发明人： LOVELADY, Heather ,  VARGHESE, Ronnie

IPC分类号： C23C18/22 ,  C23C28/02 ,  G03F1/80

CPC分类号： G03F7/168 ,  G03F7/40 ,  H01L21/0272

摘要： A single lithography process for multi-layer metal/dielectric coatings using a series of developing, baking, and lifting steps to coat two or more thin films without re-patterning that results in the encapsulation and profile optimization of multi-spectral patterned thin film coatings is disclosed.