摘要:
A memory device including a silicon semiconductor substrate, spaced apart source and drain regions formed in the substrate with a channel region there between, and a conductive floating gate disposed over a first portion of the channel region and a first portion of the source region. An erase gate includes a first portion that is laterally adjacent to the floating gate and over the source region, and a second portion that extends up and over the floating gate. A conductive word line gate is disposed over a second portion of the channel region. The word line gate is disposed laterally adjacent to the floating gate and includes no portion disposed over the floating gate. The thickness of insulation separating the word line gate from the second portion of the channel region is less than that of insulation separating the floating gate from the erase gate.
摘要:
A memory device and method including a semiconductor substrate with memory and logic device areas. A plurality of memory cells are formed in the memory area, each including first source and drain regions with a first channel region therebetween, a floating gate disposed over a first portion of the first channel region, a control gate disposed over the floating gate, a select gate disposed over a second portion of the first channel region, and an erase gate disposed over the source region. A plurality of logic devices formed in the logic device area, each including second source and drain regions with a second channel region therebetween, and a logic gate disposed over the second channel region. The substrate upper surface is recessed lower in the memory area than in the logic device area, so that the taller memory cells have an upper height similar to that of the logic devices.
摘要:
A method of forming a memory device on a substrate having memory, LV and HV areas, including forming pairs of spaced apart memory stacks in the memory area, forming a first conductive layer over and insulated from the substrate, forming a first insulation layer on the first conductive layer and removing it from the memory and HV areas, performing a conductive material deposition to thicken the first conductive layer in the memory and HV areas, and to form a second conductive layer on the first insulation layer in the LV area, performing an etch to thin the first conductive layer in the memory and HV areas and to remove the second conductive layer in the LV area, removing the first insulation layer from the LV area, and patterning the first conductive layer to form blocks of the first conductive layer in the memory, LV and HV areas.
摘要:
A method of forming active areas and isolation regions in a semiconductor substrate using a double patterning process. The method include forming a first material on the substrate surface, forming a second material on the first material, forming a plurality of first trenches into the second material wherein the plurality of first trenches are parallel to each other, forming a second trench into the second material wherein the second trench is perpendicular to and crosses the plurality of first trenches in a central region of the substrate, filling the first and second trenches with a third material, removing the second material to form third trenches in the third material that are parallel to each other and do not extend through the central region of the substrate, and extending the third trenches through the first material and into the substrate.
摘要:
A method of forming active areas and isolation regions in a semiconductor substrate using a double patterning process. The method include forming a first material on the substrate surface, forming a second material on the first material, forming a plurality of first trenches into the second material wherein the plurality of first trenches are parallel to each other, forming a second trench into the second material wherein the second trench is perpendicular to and crosses the plurality of first trenches in a central region of the substrate, filling the first and second trenches with a third material, removing the second material to form third trenches in the third material that are parallel to each other and do not extend through the central region of the substrate, and extending the third trenches through the first material and into the substrate.