公开(公告)号：EP2951123A1

公开(公告)日：2015-12-09

申请号：EP14701685.1

申请日：2014-01-13

申请人： Tesa SE

发明人： KEITE-TELGENBÜSCHER, Klaus ,  SCHUH, Christian ,  LÜHMANN, Bernd ,  DOLLASE, Thilo ,  BAI, Minyoung ,  KRAWINKEL, Thorsten

IPC分类号： B82Y40/00 ,  C09J7/02 ,  C09J153/02 ,  H01L51/52

CPC分类号： C09J7/0221 ,  B82Y30/00 ,  B82Y40/00 ,  C08L63/00 ,  C08L2205/04 ,  C09J7/387 ,  C09J125/08 ,  C09J153/00 ,  C09J153/025 ,  C09J2201/122 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2425/00 ,  C09J2453/00 ,  H01L51/5253 ,  Y10T428/269 ,  Y10T428/287

摘要： Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced, especially by a cross-linking build-up reaction, the first phase (elastomeric phase) having at least a softening temperature according to DSC of less than 23°C, and the second phase, after the build-up reaction, having a softening temperature according to DSC of greater than 23°C, the two phases having the morphology of a cross-linked nanoparticle network after the build-up reaction.

公开(公告)号：EP2925507A1

公开(公告)日：2015-10-07

申请号：EP13795491.3

申请日：2013-11-25

申请人： Tesa SE

发明人： DOLLASE, Thilo ,  KRAWINKEL, Thorsten ,  SCHERF, Lesmona ,  BAI, Minyoung

IPC分类号： B29C65/50 ,  B32B7/12 ,  C09J7/00 ,  C09J7/02 ,  B29C65/48

CPC分类号： B32B7/12 ,  B32B27/22 ,  B32B37/12 ,  B32B2305/72 ,  C08J5/124 ,  C08J2369/00 ,  C08J2400/00 ,  C08J2453/00 ,  C08J2463/00 ,  C09J7/20 ,  C09J7/35 ,  C09J153/00 ,  C09J2463/00 ,  C09J2467/006 ,  C09J2499/00

摘要： The invention relates to a laminate made of two rigid substrates and an adhesive film arranged between said substrates. At least one of the rigid substrates is transparent, the thickness of the adhesive film is not greater than 80 µm, and the adhesive film comprises at least one adhesive layer made of an adhesive compound to which one or more plasticizers are added, at least one plasticizer of said plasticizers being a reactive plasticizer. The proportion of the plasticizers to the adhesive compound totals at least 15 wt.%, and the proportion of the reactive plasticizer to the adhesive compound is at least 5 wt.%.

公开(公告)号：EP2768919A1

公开(公告)日：2014-08-27

申请号：EP12775254.1

申请日：2012-10-19

申请人： Tesa SE

发明人： DOLLASE, Thilo ,  KRAWINKEL, Thorsten ,  BAI, Minyoung

IPC分类号： C09J153/00 ,  C03C27/10 ,  C09J163/00 ,  C09J193/00 ,  C09K3/10 ,  B32B17/10 ,  C09J7/00 ,  H01L51/52

CPC分类号： H01L23/293 ,  B32B17/06 ,  B32B17/064 ,  C03C27/10 ,  C08L53/00 ,  C08L63/00 ,  C08L93/00 ,  C08L93/04 ,  C09J7/00 ,  C09J7/387 ,  C09J153/00 ,  C09J163/00 ,  C09J193/00 ,  C09J193/04 ,  C09J2203/326 ,  C09J2453/00 ,  C09K3/10 ,  H01L31/0481 ,  H01L51/52 ,  H01L51/5246 ,  H01L2251/5338 ,  H01L2924/0002 ,  Y02E10/50 ,  Y10T428/269 ,  Y10T428/287 ,  H01L2924/00

摘要： The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which, when regarded as a hypothetical homopolymer, has a softening temperature greater than 40°C; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one cyclic ether-based type of reactive resin with a softening temperature less than 40 °C, preferably less than 20°C; and (d) at least one type of photoinitiator for initiating cationic curing.

摘要翻译： 本发明涉及一种粘合物质，特别是用于将电子组件封装在渗透物上，所述物质包括：（a）至少一种共聚物，其至少含有异丁烯或丁烯作为共聚单体类型和至少一种共聚单体类型，当被认为是 假设的均聚物，其软化温度大于40℃; （b）至少一种类型的至少部分氢化的粘合剂树脂; （c）至少一种基于环醚类的反应性树脂，其软化温度低于40℃，优选低于20℃; 和（d）至少一种用于引发阳离子固化的光引发剂。