公开(公告)号：EP1960490B8

公开(公告)日：2017-06-21

申请号：EP06830364.3

申请日：2006-12-05

申请人： Huntsman Advanced Materials Licensing (Switzerland) GmbH

发明人： BARKER GOODALL, Pauline ,  KOTZEV, Dimiter Lubomirov

IPC分类号： C09J133/06

CPC分类号： C08G18/672 ,  C08F290/067 ,  C08G18/4854 ,  C08G2270/00 ,  C08L9/02 ,  C08L75/16 ,  C08L2205/035 ,  C08L2205/04 ,  C08L2205/22 ,  C08L2666/02 ,  C09J4/06 ,  C09J133/04 ,  C09J175/16 ,  C08G18/48

摘要： The invention relates to an uncured, polymerizable composition comprising (A) 1 - 25 % b.w. of the total composition of a rubber, (B) 25 - 75 % b.w. of the total composition of a monomer or monomer blend comprising acrylic or methacrylic acid or a derivative thereof (C) 1 - 50 % b.w. of the total composition of a meth(acrylated) polyurethane and (D) at least one type of core shell particle. Upon cure these compositions exhibit better facture toughness, especially at low temperatures.

摘要翻译： 本发明涉及一种未固化的可聚合组合物，其包含（A）1-25重量％ （B）25-75％（重量）的橡胶。 的包含丙烯酸或甲基丙烯酸或其衍生物的单体或单体共混物的总组合物（C）1-50重量％。 （D）至少一种类型的芯壳颗粒。 在固化时，这些组合物表现出更好的断裂韧性，特别是在低温下。

公开(公告)号：EP3023461A4

公开(公告)日：2016-11-16

申请号：EP14825646

申请日：2014-07-21

申请人： LG CHEMICAL LTD

发明人： LEE SEUNG MIN ,  CHANG SUK KY ,  PARK MIN SOO ,  YOO HYUN JEE ,  SHIM JUNG SUP ,  CHO YOON GYUNG ,  BAE KYUNG YUL ,  KIM HYUN SUK ,  MOON JUNG OK

IPC分类号： C08L101/00 ,  C08F220/18 ,  C08L23/22 ,  C08L33/04 ,  C09J123/22 ,  H01L23/29

CPC分类号： H01L51/004 ,  C08F220/18 ,  C08L23/22 ,  C08L33/08 ,  C08L101/00 ,  C08L101/005 ,  C08L2203/16 ,  C08L2203/206 ,  C08L2205/04 ,  C08L2312/00 ,  C09J123/22 ,  C09J133/06 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/56

摘要： An encapsulation composition, an encapsulation film including the same, an encapsulation product for organic electronic devices, and a method of manufacturing an organic electronic device are provided. The encapsulation composition can be useful in effectively preventing moisture or oxygen from flowing into the organic electronic device from external environments while realizing transparency when the organic electronic device is encapsulated by the encapsulation composition. Also, the encapsulation film formed of the encapsulation composition can be useful in ensuring mechanical properties such as handling properties and processability, and the organic electronic device whose encapsulation structure is formed by means of the encapsulation film may have improved lifespan and durability, thereby providing an encapsulation product for organic electronic devices showing high reliability.

公开(公告)号：EP3063212A1

公开(公告)日：2016-09-07

申请号：EP14796966.1

申请日：2014-10-28

申请人： Blue Cube IP LLC

发明人： SONG, Xiaomei ,  GONG, Yonghua ,  CHEN, Hongyu ,  XIAO, Tianhui ,  MULLINS, Michael J.

IPC分类号： C08J3/24 ,  C08L9/06 ,  C08L35/06 ,  C08L63/00 ,  C08L71/12

CPC分类号： C08L25/16 ,  C08J3/24 ,  C08J5/24 ,  C08J2325/16 ,  C08J2337/00 ,  C08J2371/12 ,  C08J2425/16 ,  C08J2463/00 ,  C08J2471/12 ,  C08L9/06 ,  C08L35/06 ,  C08L37/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/035 ,  C08L2205/04 ,  C08L63/00

摘要： A curable composition comprising a a) styrene-butadiene vinyl resin containing from 30 weight percent to 85 weight percent of 1, 2-vinyl groups and wherein styrene is present in an amount in the range of from 10 weight percent to 50 weight percent; b) a vinyl poly(phenylene ether) having a number average molecular weight in the range of from 300 to 10000; c) an aniline modified styrene-maleic anhydride copolymer; d) a multifunctional epoxy resin; and e) a flame retardant wherein, upon curing under curing conditions, the curable composition forms at least one interpenetrating network structure, is disclosed. Methods for preparing the curable composition are also disclosed, as are prepregs and laminates made therefrom.

公开(公告)号：EP3052555A1

公开(公告)日：2016-08-10

申请号：EP14790813.1

申请日：2014-09-24

申请人： 3M Innovative Properties Company

发明人： EDMONDS, William F. ,  PETAJA, Jason S. ,  SOLOMON, Jeffrey L.

IPC分类号： C08J5/12 ,  C09J5/02 ,  C09J7/02 ,  C09J133/08 ,  C09J151/06 ,  C08L53/02 ,  G02B5/04

CPC分类号： C09J7/50 ,  C08L2205/04 ,  C09J133/06 ,  C09J133/08 ,  C09J163/00 ,  C09J2201/122 ,  C09J2203/318 ,  C09J2433/00 ,  C09J2433/003 ,  C09J2463/00 ,  G02B5/045 ,  G02B6/0053 ,  Y10T428/24612

摘要： Articles are described such as optical films and optical film stacks 2000. The articles include a substrate 2070 and a primer layer 2075 disposed on the substrate wherein the primer layer comprises a polyacrylate and a nitrogen-containing polymer. The article further includes an adhesive layer 2060 disposed onto the primer layer wherein the adhesive layer comprises a polyacrylate component. In some embodiments, the adhesive is further bonded to a second substrate 2010 or a release liner.

公开(公告)号：EP2838965A4

公开(公告)日：2015-05-20

申请号：EP13778752

申请日：2013-04-02

申请人： ARKEMA INC

发明人： ZHENG MIN ,  WEN MEI ,  GABOURY SCOTT ,  WOOD KURT A ,  PARTRIDGE RONALD

IPC分类号： C09D127/12 ,  C03C17/30 ,  C09D127/16 ,  C09D151/00 ,  C09D175/04

CPC分类号： C03C17/30 ,  C03C17/001 ,  C03C2217/29 ,  C03C2218/32 ,  C08G18/10 ,  C08G18/289 ,  C08G18/6279 ,  C08G18/73 ,  C08G18/758 ,  C08L2205/04 ,  C09D127/16 ,  C09D151/003 ,  C09D175/04 ,  Y10T428/3154 ,  C08K5/29 ,  C08K5/54 ,  C08L75/04

摘要： The invention relates to an aqueous fluoropolymer coating composition for direct application to glass without the need for pre-treatment of the glass surface. The coating composition can also be used with other non-porous and porous substrates. The fluoropolymer coating contains a hydroxyl-functional fluoropolymer, and polyisocyanates. Preferably the coating composition also contains a water-dispersible hydroxyl functional polyurethane. The coating composition may exist as a 1-pack or a multi-pack coating system. The coating has excellent wet adhesion to glass, good weathering, chalking resistance, chemical resistance, and dirt pickup resistance.

摘要翻译： 本发明涉及直接应用于玻璃而不需要预处理玻璃表面的含氟聚合物水性涂料组合物。 涂料组合物也可以与其它无孔和多孔的基材一起使用。 含氟聚合物涂层含有羟基官能的含氟聚合物和多异氰酸酯。 优选地，涂料组合物还含有水分散性羟基官能聚氨酯。 涂料组合物可以以1包或多包装涂料体系的形式存在。 该涂层具有优异的与玻璃的湿粘附性，良好的耐候性，抗粉化性，耐化学性和耐污垢性。

公开(公告)号：EP2796486A4

公开(公告)日：2015-03-04

申请号：EP12860012

申请日：2012-10-04

申请人： OSSTEM IMPLANT CO LTD

发明人： CHUNG YONG IL ,  CHOI DA MI ,  SONG JU DONG ,  KANG EUN JUNG ,  EOM TAE GWAN ,  CHOI KYOO OK

IPC分类号： C08J3/075 ,  A61L27/18 ,  A61L27/20 ,  A61L27/24 ,  A61L27/26 ,  A61L27/52 ,  A61L27/58 ,  C08J5/18

CPC分类号： A61L27/58 ,  A61L27/18 ,  A61L27/227 ,  A61L27/24 ,  A61L2430/12 ,  B29C35/02 ,  B29C39/003 ,  B29K2071/02 ,  B29K2105/0061 ,  B29K2995/0088 ,  C08J3/075 ,  C08J3/246 ,  C08J2300/206 ,  C08J2301/28 ,  C08J2305/02 ,  C08J2305/04 ,  C08J2305/10 ,  C08J2371/02 ,  C08J2389/00 ,  C08J2400/206 ,  C08J2471/02 ,  C08L1/286 ,  C08L5/02 ,  C08L5/04 ,  C08L5/08 ,  C08L5/10 ,  C08L71/02 ,  C08L89/06 ,  C08L101/16 ,  C08L2201/06 ,  C08L2203/02 ,  C08L2205/04

公开(公告)号：EP2602284A1

公开(公告)日：2013-06-12

申请号：EP11192150.8

申请日：2011-12-06

申请人： DSM IP Assets B.V.

发明人： Hensen, Guido ,  Steeman, Paulus Antonius Maria ,  Jansen, Johan Franz Gradus Antonius ,  Keestra, Beert Jacobus ,  Melick van, Harold Geert Hendrik ,  Linsen, Jozef Maria Herman

IPC分类号： C08J5/24 ,  C08L67/02

CPC分类号： C08L67/02 ,  C08J5/24 ,  C08J2367/02 ,  C08L2205/04

摘要： The invention relates to a multi-component resin system comprising (A) a hydroxyl functional unsaturated polyester resin comprising fumaric acid building blocks as unsaturated dicarboxylic acid building blocks and having a hydroxyl value of from 40 up to and including 150, (B) a hydroxyl functional saturated polyester resin comprising cyclohexane dicarboxylic acid building blocks as saturated dicarboxylic acid building blocks and having a hydroxyl value of from 40 up to and including 150, (C) a polyisocyanate that has on average at least 1.75 isocyanate groups, (D) an ethylenically unsaturated compound copolymerizable with (A) and optionally with (B), and (E) a radical initiator, whereby the molar ratio of

摘要翻译： 本发明涉及一种多组分树脂体系，其包括（A）羟基官能不饱和聚酯树脂，其包含作为不饱和二羧酸结构单元的富马酸结构单元，羟基值为40以上且包括150，（B）羟基 包含环己烷二羧酸结构单元作为饱和二羧酸结构单元的羟基值为40以上且包括150的功能性饱和聚酯树脂，（C）平均具有至少1.75个异氰酸酯基团的多异氰酸酯，（D）烯键式 可与（A）和任选与（B）共聚的不饱和化合物，和（E）自由基引发剂，其中摩尔比

公开(公告)号：EP2546287A1

公开(公告)日：2013-01-16

申请号：EP12187201.4

申请日：2007-02-14

申请人： Hitachi Chemical Co., Ltd.

发明人： Mizuno, Yasuyuki ,  Fujimoto, Daisuke ,  Danjobara, Kazutoshi ,  Murai, Hikari

IPC分类号： C08J3/24 ,  C08J5/24 ,  H05K1/03 ,  C08L9/00 ,  C08L71/12

CPC分类号： H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.
The present invention relates to a thermosetting resin composition comprising a polyphenylene ether-modified butadiene prepolymer comprising a polyphenylene ether (A) and a butadiene polymer (B'), characterized in that the component (A) has a number average molecular weight in the range of 7000 to 30000; the component (B') comprises 40% or more of a unit derived from a 1,2-butadiene unit having a 1,2-vinyl group in a side chain; the component (B') is not a modified polybutadiene in which the 1,2-vinyl group in the side chain, or one or both of the terminals in the molecule of the component (B') is/are chemically modified by converting into epoxy, glycol, phenol, maleic acid, (meth)acryl, or urethane; and the component (B') has a cross-linked structure; and a resin varnish, a prepreg and a metal clad laminated board using the same.

公开(公告)号：EP2062932A4

公开(公告)日：2013-01-02

申请号：EP06781860

申请日：2006-07-28

申请人： TORAY INDUSTRIES

发明人： TABATA NORIKAZU ,  HASHISAKA KAZUHIKO ,  SUGIMURA MASAHIRO ,  SAKAMOTO TAKUO ,  UE MASAKI ,  NAKAYAMA HIROYUKI ,  FUKUDA SEIJI

IPC分类号： C08J5/14 ,  B24B37/00 ,  B24B37/24 ,  C08F2/38 ,  C08F283/00 ,  C08J3/24 ,  C08J9/36 ,  C08L33/10 ,  H01L21/304

CPC分类号： B24B37/24 ,  B24D18/0027 ,  C08F2/38 ,  C08F2/40 ,  C08F265/04 ,  C08F283/00 ,  C08J3/246 ,  C08L33/10 ,  C08L75/00 ,  C08L2205/04 ,  C08L75/04

公开(公告)号：EP2230277A1

公开(公告)日：2010-09-22

申请号：EP09305230.6

申请日：2009-03-12

申请人： Corning Incorporated

发明人： Sergeevich Shelekhov, Nikita

IPC分类号： C08L87/00

CPC分类号： C08J5/005 ,  B82Y30/00 ,  C08G18/3206 ,  C08G18/6469 ,  C08G18/8108 ,  C08G18/8116 ,  C08G2270/00 ,  C08L2205/04 ,  Y10S525/903

摘要： A composite including interpenetrating networks of an organic polymer, such as from an acrylate or olefin, having urethane groups; and an inorganic polymer, the composite having a low or no-shrinkage characteristic, and a method for making the composite, as defined herein.

摘要翻译： 一种复合包含的有机聚合物的互穿网络，颜色：例如来自丙烯酸酯或烯烃，具有氨基甲酸酯基团; 并且在无机聚合物，具有低或无收缩特性，以及用于制造该复合，所定义的方法中的复合材料。