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公开(公告)号:EP4300576A3
公开(公告)日:2024-06-26
申请号:EP23209817.8
申请日:2017-12-22
CPC分类号: H05K1/0204 , H05K1/185 , H05K3/4652 , H05K2201/1041620130101 , H05K2201/207220130101 , H05K2201/20920130101 , H05K2203/06320130101 , C09J7/00 , H05K2201/02620130101 , H05K2201/032320130101 , H05K2203/019120130101 , C09J2203/32620130101 , H05K2201/0912720130101 , H01L2224/1820130101 , H01L23/49822 , H01L23/13 , H01L23/49816 , H01L23/3677 , H01L23/49827 , H01L23/49894 , C09J2301/3120200801
摘要: A component carrier (106), comprising a stack (116) comprising at least one electrically conductive layer structure (114) and/or at least one electrically insulating layer structure (112), a sheet (100) with nano- and/or microstructures (102) and arranged on and/or in the stack (116), said sheet (100) comprising or consisting of copper.
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公开(公告)号:EP4376393A1
公开(公告)日:2024-05-29
申请号:EP22920829.3
申请日:2022-12-22
发明人: HWANG, Daum , CHUNG, Haewoo
IPC分类号: H04M1/02 , C09J7/30 , C09J9/00 , H01M50/247 , H01M50/264 , C09J7/00
CPC分类号: C09J7/00 , C09J7/30 , C09J9/00 , H01M50/264 , H01M50/247 , H04M1/02
摘要: An electronic device according to an embodiment may include a support member, a battery disposed on the support member, and an adhesive tape having a part disposed to traverse an area between the battery and the support member and a remaining part exposed to the outside of the area between the battery and the support member on at least one of one end or the other end of the battery, in a state in which the battery is disposed, wherein the part of the adhesive tape may include a first area disposed in a direction toward the other end from the one end of the battery and a second area disposed in the direction toward the other end from the one end of the battery and spaced apart from the first area to provide at least one gap extending through at least one surface of the adhesive tape facing the battery, and the remaining part of the adhesive tape may include a non-adhesive layer on at least one surface thereof. In addition to this, various embodiments identified through the specification may be possible.
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公开(公告)号:EP2931198B1
公开(公告)日:2018-10-31
申请号:EP13862696.5
申请日:2013-12-09
CPC分类号: A61F13/025 , A61F13/0253 , A61L24/06 , C09J7/00 , C09J7/10 , C09J7/20 , C09J133/06 , C09J133/26 , C09J2201/40 , C09J2201/61 , C09J2433/00 , C09J2477/00
摘要: This disclosure relates generally to adhesive articles and particularly to adhesive articles comprising a reversible adhesive layer and a non-reversible adhesive layer. The adhesive article may further comprise a backing material. The adhesive article may further comprise a dressing material. Such adhesive articles may be particularly suitable for treatment of damaged sensitive tissue, for example wounds formed on a fragile skin.
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公开(公告)号:EP3110898B1
公开(公告)日:2018-10-03
申请号:EP15709591.0
申请日:2015-02-26
申请人: H. B. Fuller Company
CPC分类号: C09J7/00 , B32B7/12 , B32B37/06 , B32B37/1207 , B32B37/1284 , B32B37/18 , B32B2037/1253 , C09J7/10 , C09J2201/28 , C09J2201/36 , C09J2201/606 , C09J2433/00 , C09J2475/00 , Y10T428/24843 , Y10T428/269 , Y10T428/2826 , Y10T428/31551 , Y10T428/31591 , Y10T428/31601 , Y10T428/31605 , Y10T442/2098
摘要: Disclosed is a multi-layer adhesive film including a heat curable adhesive film and a first tacky adhesive composition disposed on the first major surface of the heat curable adhesive film. The heat curable adhesive film includes a surface-deactivated solid isocyanate and a polyurethane that includes functional groups that are reactive with isocyanate. A method of making an article that includes the multi-layer adhesive film and article made thereby are also disclosed.
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公开(公告)号:EP2735594B1
公开(公告)日:2018-10-03
申请号:EP12825761.5
申请日:2012-08-27
申请人: LG Chem, Ltd.
发明人: YOON, Sung Soo , KIM, No Ma , HWANG, In Ho , PARK, In Kyu , KIM, Min Joon
IPC分类号: C09J7/00 , C09J133/08 , G02B5/30 , G02F1/13
CPC分类号: C09J133/14 , B32B2457/202 , C09J7/00 , C09J7/10 , C09J133/08 , C09J2201/622 , C09J2203/318 , C09J2433/00 , G02B1/10 , G02B5/30 , G02B5/3025 , G02F1/13 , G02F1/133528 , G02F2202/28 , Y10T428/1041 , Y10T428/105 , Y10T428/1077 , Y10T428/1082 , Y10T428/2848 , Y10T428/2891
摘要: Provided are a pressure-sensitive adhesive, a polarizing plate, and a liquid crystal display device. The pressure-sensitive adhesive may be used to provide a polarizing plate which has a tensile modulus that varies in a thickness direction, and for example, which has a smaller thickness and a lighter weight, and also satisfies all of the physical properties required for the polarizing plate such as durability, water resistance, workability and light leakage preventability, and a liquid crystal display device including the same.
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公开(公告)号:EP2705103B1
公开(公告)日:2018-09-26
申请号:EP12720142.4
申请日:2012-05-04
申请人: tesa SE
发明人: SCHUBERT, Thomas , KOOPS, Arne , REICH, Sarah
IPC分类号: C09J5/02 , C09J7/10 , B32B27/08 , B32B27/16 , B32B27/30 , B32B27/32 , B32B27/40 , C08G18/48 , C08G18/66 , C08G18/75 , C08J5/12 , C08G18/12 , C08G18/22 , C08G18/32 , C09J123/16 , C09J175/08
CPC分类号: C09J7/00 , B29B7/485 , B29B7/82 , B29B7/86 , B32B27/08 , B32B27/16 , B32B27/308 , B32B27/32 , B32B27/40 , B32B2405/00 , C08G18/12 , C08G18/227 , C08G18/3206 , C08G18/4812 , C08G18/4825 , C08G18/4829 , C08G18/6674 , C08G18/755 , C08G2170/40 , C08J5/128 , C08J2323/16 , C09J5/02 , C09J7/10 , C09J123/16 , C09J175/08 , C09J2201/134 , C09J2201/36 , C09J2201/606 , C09J2201/61 , C09J2423/00 , C09J2423/10 , C09J2433/00 , C09J2475/00 , Y10T428/2826 , C08G18/758
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公开(公告)号:EP3375833A1
公开(公告)日:2018-09-19
申请号:EP16864069.6
申请日:2016-10-31
发明人: YOSHIDA, Akiko , OKADA, Kenichi , AKAZAWA, Koji
IPC分类号: C09J5/04 , C09J7/00 , C09J11/06 , C09J163/00
摘要: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.
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公开(公告)号:EP3130647B1
公开(公告)日:2018-09-12
申请号:EP15775939.0
申请日:2015-04-01
发明人: KITANO, Hajime
IPC分类号: C09J7/00 , B32B27/00 , B32B27/30 , C09J4/02 , C09J11/06 , C09J181/00 , B32B25/04 , B32B7/12 , B32B27/40 , C08G18/67 , C08G18/38 , C08G75/045 , C09J175/16
CPC分类号: B32B7/12 , B32B15/06 , B32B25/04 , B32B25/042 , B32B25/08 , B32B25/12 , B32B25/14 , B32B27/30 , B32B27/40 , B32B2307/748 , B32B2405/00 , C08F290/067 , C08G18/672 , C08G18/755 , C08G18/792 , C08G18/8029 , C08G75/045 , C08G77/28 , C09J7/00 , C09J11/06 , C09J175/16 , C09J181/00 , C09J183/08
摘要: An adhesive sheet, the adhesive sheet having an adhesive composition layer, the adhesive composition layer being formed using a composition including: a polythiol compound; a (meth)acrylic compound having a plurality of at least one of an acryloyl group or a methacryloyl group; a radical generator; and a Michael addition catalyst, a ratio (Ac/SH) of a total molar number (Ac) of the at least one of an acryloyl group or a methacryloyl group contained in the (meth)acrylic compound to a total molar number (SH) of thiol groups contained in the polythiol compound being from 0.25 to 0.80.
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公开(公告)号:EP2767566B1
公开(公告)日:2018-09-12
申请号:EP12850575.7
申请日:2012-11-14
申请人: LG Chem, Ltd.
CPC分类号: H01L51/5246 , C08K3/013 , C08K3/22 , C08K3/24 , C08K3/32 , C08K2003/2227 , C09J7/00 , C09J7/10 , C09J7/35 , C09J11/00 , C09J2201/134 , C09J2201/36 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01L51/524 , H01L51/5253 , H01L51/5259 , Y10T428/24942 , Y10T428/24959
摘要: Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130 °C of 10 1 to 10 6 Pa·s and a viscosity at room temperature of 10 6 Pa·s or more in an uncured state, and when the adhesive layer has a multilayered structure, a difference in melting viscosity between layers is less than 30 Pa·s. In addition, the method of encapsulating an organic electronic device using the adhesive film is provided.
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公开(公告)号:EP3364456A2
公开(公告)日:2018-08-22
申请号:EP17210055.4
申请日:2017-12-22
发明人: Tuominen, Mikael , Tay, Annie , Baftiri, Artan
IPC分类号: H01L23/538 , H05K1/18 , H05K1/02
CPC分类号: H05K1/185 , C09J7/00 , C09J2201/626 , C09J2203/326 , H01L23/5389 , H05K1/0204 , H05K3/4652 , H05K2201/026 , H05K2201/0323 , H05K2201/10416 , H05K2201/2072 , H05K2201/209 , H05K2203/0191 , H05K2203/063
摘要: A method of using a sheet (100) with nano- and/or microstructures (102) on a sheet surface (104) for manufacturing a component carrier (106).
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