Abstract:
In a cellular array processor at least two of the plurality of processors in a row cooperate together as an address generator so that large amounts of memory external to the array chip may be addressed and in addition so that an address may be generated onboard for use by the DRAM memory associated with each processor. Based on this structure, a memory with an internal organization that is 256-bits wide may be connected to 16 16-bit processors which would require 256 bits of data. In so doing, a vast number of pins are saved, that is 256 bits of data out of the memory and 256 bits of data into the processing cells by combining the processing cells and memory on the same chip. It is significant that exactly one design of a processing cell may provide both a data processing element and an address processing element. In this way, these cells are interchangeable to maximize the yield and reliability of the device. A single address from the address generator addresses the entire onboard DRAM so as to use the number of address generators required and to reduce the amount of address decode logic required as well as minimizing power dissipation in the DRAM portion of the chip.
Abstract:
A data processing system includes a processor (10), base read-only store (101) and a non-volatile read/write memory (104) interconnected by a control bus (13), a data bus (19), an address bus (14) and a selection bus (18). Add-on read-only memories (106, 107) can be coupled to the busses when required to add operating features to the system. The read/write memory (104) includes a table containing a location for each possible add-on memory. Each location contains data indicating either that the related add-on memory is connected and required by the system, or is not connected, or, if connected, not required. Each add-on memory stores, in its first location, the address of that location for verification when it is accessed.
Abstract:
Testing of a multibank memory device having a plurality of memory banks which includes activating two or more of the plurality of memory banks for participation in the test; selecting at least one common memory address corresponding to a memory cell within each activated bank; simultaneously writing test data into the selected memory cell of each activated bank; simultaneously reading the test data previously written into the selected memory cell of each activated bank; and comparing the test data read from each activated bank with the test data from each other activated bank and if a match is determined to exist, then indicating a pass condition, else indicating a fail condition.
Abstract:
A semiconductor memory device is disclosed which has a data output circuit including a first node, a second node, first and second transistors connected in series between the first node and a potential line, third and fourth transistors connected in series between the first node and the potential line, fifth and sixth transistors connected in series between the second node and the potential line, seventh and eighth transistors connected in series between the second node and the potential line, one of the first and third transistors being driven in response to a data signal read from a selected memory cell and one of the fifth and seventh transistors being driven in response to an inverted data signal of the data signal in a normal mode while turning one of the second and fourth transistor and one of the sixth and eighth transistors ON, both of the first and third transistors being driven in response to the data signal and both of the fifth and seventh transistors being driven in response to the inverted data signal while all the second, fourth, sixth and eighth transistors ON. The output circuit further includes an output logic circuit driving an output terminal to one of first and second logic levels when the first and second nods have logic levels different from each other and to a high impedance when the first and second nodes have logic levels equal to each other.
Abstract:
An integrated circuit having enhanced testing capabilities and a method of testing an integrated circuit are provided. The integrated circuit preferably includes a substrate and a memory block on the substrate. The memory block preferably has a plurality of memory cells arranged in a plurality of rows and a plurality of columns within a defined area on the substrate, at least one bit line connected to each of the plurality of memory cells and defining a column, at least one word line connected to each of the plurality of memory cells and defining a row, and sense amplifying means connected to the at least one bit line for sensing a state of an addressed memory cell in at least one of the plurality of columns. The integrated circuit also includes a selectable stress tester on the substrate and connected to the memory block for selectively stress testing only portions of the memory block and not other portions so as to determine whether to accept or reject a memory block.
Abstract:
An integrated circuit memory device (21) includes plural input/output pins (30, 127 and others) and plural arrays of addressable storage cells (31-46). A set of circuits (51, 68, 70, 71-86, 90) provides access to a unique storage location in each array (31-46) through a given row and column address. A writing circuit (47, 68, 70, 71-86, 91-106, 131-146), designed for test, provides in parallel plural copies of a test data bit. The test data bit is applied through a single pin (30) and a common data-in lead (68), for storage in an addressed storage cell in each of the arrays. A readout circuit (110, 111, 112, 171, 127, 201-216, 131-146) is arranged for reading out the stored test data bit from the addressed storage cell in each of the arrays (31-46). The writing circuit, while in a block write test mode, stores the test data bit on the common data-in lead (68) in a block of address locations in each array (31-46).
Abstract:
An integrated circuit memory device (21) includes plural input/output pins (30, 127 and others) and plural arrays of addressable storage cells (31-46). A set of circuits (51, 68, 70, 71-86, 90) provides access to a unique storage location in each array (31-46) through a given row and column address. A writing circuit (47, 68, 70, 71-86, 91-106, 131-146), designed for test, provides in parallel plural copies of a test data bit. The test data bit is applied through a single pin (30) and a common data-in lead (68), for storage in an addressed storage cell in each of the arrays. A readout circuit (110, 111, 112, 171, 127, 201-216, 131-146) is arranged for reading out the stored test data bit from the addressed storage cell in each of the arrays (31-46). The writing circuit, while in a block write test mode, stores the test data bit on the common data-in lead (68) in a block of address locations in each array (31-46).
Abstract:
A circuit (36, 52) and method for a memory device (10), such as a synchronous dynamic random access memory (SDRAM) having at least two memory banks (14, 16). Columns of at least two memory banks (14, 16) are concurrently addressable to permit data to be written to, or read from, the at least two memory banks (14, 16) concurrently. By writing data concurrently to more than one memory bank, testing of the memory of the memory device (10) can be effectuated in a reduced period of time. Data can also be written or read from a single bank (14, 16) in a multi-bank RAM without requiring that a particular bank (14, 16) be specified during a read/write command.