摘要:
A wafer cleaning system (500) for a wire saw (100) including a wire forming a wire web for cutting wafers, comprising at least one cleaning nozzle (540) configured and arranged for providing a cleaning liquid into a space between adjacent wafers from at least one side of the wafers..
摘要:
A wire saw device for cutting semiconductor material is described. The wire saw device includes a tension modifier adapted to convert a first wire tension into a second wire tension. The tension modifier includes a first guide roller including an axis of rotation and a plurality of grooves being formed in an outer circumferential surface of the first guide roller and a second guide roller including a plurality of grooves being formed in an outer circumferential surface of the second guide roller. The first guide roller and the second guide roller are spaced apart from each other at a fixed distance. The second guide roller is pivotable around the axis of rotation of the first guide roller.
摘要:
An ingot feeding system for a wire saw device, a wire saw device including the ingot feeding system and a method for feeding an ingot during cutting is described. The ingot feeding system includes a kinematic mechanism structure; at least one actuator for moving at least one part of the kinematic mechanism structure; a support table for coupling an ingot to the kinematic mechanism structure; and at least one sensor for measuring a force acting on the kinematic mechanism structure.
摘要:
A method for forming a wire guide (200) is described. The method includes arranging a cylindrical unit (210) with respect to a laser source, wherein the cylindrical unit (210) includes an outer circumferential surface, and forming a wire guide (200) to be used in a wire saw device (100) by directing a laser beam generated by the laser source to the outer circumferential surface of the cylindrical unit (200) to form a circumferential groove (220) in the cylindrical unit (210). Further, a wire guide and a system for forming grooves in a wire guide are described.
摘要:
According to the present disclosure, a device (100, 300, 400, 500, 700), method and use for cleaning a wire (150) of a wire saw adapted for sawing a semiconductor work piece (130) is provided. The device (100, 300, 400, 500, 700) includes a container (110) including a first opening (115). The container (110) is filled with loose solid particles (111) and adapted such that the wire (150) can pass via the first opening (115) through the loose solid particles (111).
摘要:
A motor unit (10) for a wire saw device comprises a housing (15), a shaft (20) being rotatably provided in the housing (15), a motor (25) having a stator (26) and a rotor (27), wherein the stator is fixed to the housing (15), and wherein the rotor (27) is mounted to the shaft (20) and has the same rotational axis (A) as the shaft, and wherein the shaft and the motor (25) are located in the housing (15). Further, a use of such a motor unit and a wire saw device (100) including such a motor unit (10) is proposed.
摘要:
A semiconductor wire saw (1) comprising a support (150) for holding a semiconductor workpiece; a wire guide (160) for forming a wire web (170) for sawing the workpiece; a nozzle (100) for generating a fluid jet directable at the wire web (170). The nozzle (100) includes an outlet (112) which has a width (202) and a depth (203). The ratio of the depth (203) to the width (202) is greater than 3.5 and/or the outlet (112) includes a plurality of surface portions (310) to provide shear stress in a cutting fluid. The optional surface portions (310) are disposed in an inner region of the areal cross-section (250) of the outlet (112).
摘要:
A wire (200) is provided that is adapted for sawing semiconductor material (102; 104; 106; 108), wherein the wire includes a non-circular cross section. Furthermore, a wire guide (112, 114, 116, 118) adapted for guiding the wire (200) for sawing semiconductor material (102, 104, 106, 108) as described is provided. The wire guide comprising at least one groove that includes a rectangular or trapezoidal cross-section.
摘要:
A wire saw device (100) for sawing a plurality of slices of a workpiece (10) is described. The wire saw device includes a wire guide assembly with at least two wire guide cylinders (122) for guiding a wire (20) to form at least one wire web with at least one working area, wherein the at least two wire guide cylinders (122) have a rotation axis, a first compartment (102), which houses the wire guide assembly and has a first side portion of the compartment, which is essentially parallel to the rotation axis, wherein the first compartment further comprises a second side portion of the compartment, which opposes the first side portion and which is essentially parallel to the rotation axis, a second compartment (104) housing a spool (116) for providing new wire, wherein the second compartment (104) is adjacent the first side portion.