Wafer cleaning system
    21.
    发明公开
    Wafer cleaning system 审中-公开
    系统zum Reinigen von Halbleiterscheiben

    公开(公告)号:EP2955745A1

    公开(公告)日:2015-12-16

    申请号:EP14171976.5

    申请日:2014-06-11

    IPC分类号: H01L21/67 B28D5/00

    CPC分类号: H01L21/67051 B28D5/0076

    摘要: A wafer cleaning system (500) for a wire saw (100) including a wire forming a wire web for cutting wafers, comprising at least one cleaning nozzle (540) configured and arranged for providing a cleaning liquid into a space between adjacent wafers from at least one side of the wafers..

    摘要翻译: 一种用于线锯(100)的晶片清洁系统(500),其包括形成用于切割晶片的线网的线,包括至少一个清洁喷嘴(540),其被配置和布置成用于将清洁液体从 晶圆最少一边

    Wire saw device
    22.
    发明公开
    Wire saw device 有权
    Drahtsägevorrichtung

    公开(公告)号:EP2842676A1

    公开(公告)日:2015-03-04

    申请号:EP13182653.9

    申请日:2013-09-02

    IPC分类号: B23D57/00 B28D5/04

    摘要: A wire saw device for cutting semiconductor material is described. The wire saw device includes a tension modifier adapted to convert a first wire tension into a second wire tension. The tension modifier includes a first guide roller including an axis of rotation and a plurality of grooves being formed in an outer circumferential surface of the first guide roller and a second guide roller including a plurality of grooves being formed in an outer circumferential surface of the second guide roller. The first guide roller and the second guide roller are spaced apart from each other at a fixed distance. The second guide roller is pivotable around the axis of rotation of the first guide roller.

    摘要翻译: 描述用于切割半导体材料的线锯装置。 线锯装置包括适于将第一线张力转换成第二线张力的张力调节器。 张力调节器包括:第一引导辊,其包括旋转轴线,多个槽形成在第一引导辊的外周面上;第二引导辊,其具有形成在第二引导辊的外周面的多个槽; 导辊。 第一引导辊和第二引导辊以固定距离彼此间隔开。 第二引导辊围绕第一导辊的旋转轴线枢转。

    Ingot feeding system
    23.
    发明公开
    Ingot feeding system 有权
    系统zumblockzuführungund Verfahrendafür

    公开(公告)号:EP2777903A1

    公开(公告)日:2014-09-17

    申请号:EP13159543.1

    申请日:2013-03-15

    IPC分类号: B28D5/04

    摘要: An ingot feeding system for a wire saw device, a wire saw device including the ingot feeding system and a method for feeding an ingot during cutting is described. The ingot feeding system includes a kinematic mechanism structure; at least one actuator for moving at least one part of the kinematic mechanism structure; a support table for coupling an ingot to the kinematic mechanism structure; and at least one sensor for measuring a force acting on the kinematic mechanism structure.

    摘要翻译: 描述了一种用于线锯装置的铸锭进给系统,包括铸锭进给系统的线锯装置和用于在切割期间进给锭的方法。 铸锭进给系统包括运动机构结构; 用于移动所述运动机构结构的至少一部分的至少一个致动器; 用于将铸锭与运动机构结构联接的支撑台; 以及用于测量作用在运动机构结构上的力的至少一个传感器。

    Wire guide and a method for forming a wire guide
    24.
    发明公开
    Wire guide and a method for forming a wire guide 审中-公开
    Drahtzuführungund Verfahren zur Formung einerDrahtzuführung

    公开(公告)号:EP2767375A1

    公开(公告)日:2014-08-20

    申请号:EP13155112.9

    申请日:2013-02-13

    IPC分类号: B28D5/04

    摘要: A method for forming a wire guide (200) is described. The method includes arranging a cylindrical unit (210) with respect to a laser source, wherein the cylindrical unit (210) includes an outer circumferential surface, and forming a wire guide (200) to be used in a wire saw device (100) by directing a laser beam generated by the laser source to the outer circumferential surface of the cylindrical unit (200) to form a circumferential groove (220) in the cylindrical unit (210). Further, a wire guide and a system for forming grooves in a wire guide are described.

    摘要翻译: 描述了一种形成导线器(200)的方法。 该方法包括相对于激光源设置圆柱形单元(210),其中圆柱形单元(210)包括外圆周表面,并且形成用于线锯设备(100)中的导线器(200) 将由激光源产生的激光束引导到圆柱形单元(200)的外圆周表面,以在圆柱形单元(210)中形成圆周凹槽(220)。 此外,描述了导线器和用于在导线器中形成槽的系统。

    Device and method for cleaning the wire of a wire saw
    25.
    发明公开
    Device and method for cleaning the wire of a wire saw 审中-公开
    Vorrichtung und Verfahren zur Reinigung des Drahts einerDrahtsäge

    公开(公告)号:EP2759386A1

    公开(公告)日:2014-07-30

    申请号:EP13153110.5

    申请日:2013-01-29

    IPC分类号: B28D5/00 H01L21/02 B28D5/04

    CPC分类号: B28D5/0076 B28D5/045

    摘要: According to the present disclosure, a device (100, 300, 400, 500, 700), method and use for cleaning a wire (150) of a wire saw adapted for sawing a semiconductor work piece (130) is provided. The device (100, 300, 400, 500, 700) includes a container (110) including a first opening (115). The container (110) is filled with loose solid particles (111) and adapted such that the wire (150) can pass via the first opening (115) through the loose solid particles (111).

    摘要翻译: 根据本公开,提供了一种用于清洁适于锯切半导体工件(130)的线锯的线(150)的装置(100,300,400,500,700)的方法和用途。 装置(100,300,400,500,700)包括包括第一开口(115)的容器(110)。 容器(110)填充有松散的固体颗粒(111),并且适于使得线(150)能够经由第一开口(115)穿过松散的固体颗粒(111)。

    Motor unit for a wire saw device and wire saw device employing the same
    27.
    发明公开
    Motor unit for a wire saw device and wire saw device employing the same 审中-公开
    MohrinheitfüreineDrahtsägenvorrichtungundDrahtsägenvorrichtungdamit

    公开(公告)号:EP2937165A1

    公开(公告)日:2015-10-28

    申请号:EP14166016.7

    申请日:2014-04-25

    摘要: A motor unit (10) for a wire saw device comprises a housing (15), a shaft (20) being rotatably provided in the housing (15), a motor (25) having a stator (26) and a rotor (27), wherein the stator is fixed to the housing (15), and wherein the rotor (27) is mounted to the shaft (20) and has the same rotational axis (A) as the shaft, and wherein the shaft and the motor (25) are located in the housing (15). Further, a use of such a motor unit and a wire saw device (100) including such a motor unit (10) is proposed.

    摘要翻译: 一种用于线锯装置的马达单元(10)包括壳体(15),可旋转地设置在壳体(15)中的轴(20),具有定子(26)和转子(27)的马达(25) ,其中所述定子被固定到所述壳体(15),并且其中所述转子(27)安装到所述轴(20)并且具有与所述轴相同的旋转轴线(A),并且其中所述轴和所述电动机(25) )位于壳体(15)中。 此外,提出了使用这种马达单元和包括这种马达单元(10)的线锯装置(100)。

    Semiconductor wire saw including a nozzle for generating a fluid jet
    28.
    发明公开
    Semiconductor wire saw including a nozzle for generating a fluid jet 审中-公开
    HalbleiterdrahtsägemitDüsezur Erzeugung einesFlüssigkeitsstrahls

    公开(公告)号:EP2865502A1

    公开(公告)日:2015-04-29

    申请号:EP13190300.7

    申请日:2013-10-25

    IPC分类号: B28D5/00

    摘要: A semiconductor wire saw (1) comprising a support (150) for holding a semiconductor workpiece; a wire guide (160) for forming a wire web (170) for sawing the workpiece; a nozzle (100) for generating a fluid jet directable at the wire web (170). The nozzle (100) includes an outlet (112) which has a width (202) and a depth (203). The ratio of the depth (203) to the width (202) is greater than 3.5 and/or the outlet (112) includes a plurality of surface portions (310) to provide shear stress in a cutting fluid. The optional surface portions (310) are disposed in an inner region of the areal cross-section (250) of the outlet (112).

    摘要翻译: 一种半导体线锯(1),包括用于保持半导体工件的支撑件(150) 用于形成用于锯切工件的金属丝网(170)的导线器(160) 用于产生可在丝网(170)处定向的流体喷射的喷嘴(100)。 喷嘴(100)包括具有宽度(202)和深度(203)的出口(112)。 深度(203)与宽度(202)的比值大于3.5,和/或出口(112)包括多个表面部分(310),以在切削液中提供剪切应力。 可选表面部分(310)设置在出口(112)的面横截面(250)的内部区域中。

    Wire for semiconductor wire saw and wire saw
    29.
    发明公开
    Wire for semiconductor wire saw and wire saw 审中-公开
    DrahtfürHalbleiterdrahtsägeundDrahtsäge

    公开(公告)号:EP2647458A1

    公开(公告)日:2013-10-09

    申请号:EP12163224.4

    申请日:2012-04-04

    发明人: Nasch, Philippe

    IPC分类号: B23D61/18

    CPC分类号: B23D61/185 B23D57/0053

    摘要: A wire (200) is provided that is adapted for sawing semiconductor material (102; 104; 106; 108), wherein the wire includes a non-circular cross section. Furthermore, a wire guide (112, 114, 116, 118) adapted for guiding the wire (200) for sawing semiconductor material (102, 104, 106, 108) as described is provided. The wire guide comprising at least one groove that includes a rectangular or trapezoidal cross-section.

    摘要翻译: 提供适于锯切半导体材料(102; 104; 106; 108)的线(200),其中所述线包括非圆形横截面。 此外,提供了适于引导用于锯切所述的半导体材料(102,104,106,108)的线(200)的线引导件(112,114,116,118)。 线引导件包括至少一个包括矩形或梯形横截面的凹槽。

    Modular wafering concept for wafering plant
    30.
    发明公开
    Modular wafering concept for wafering plant 审中-公开
    Modulares WaferkonzeptfürWaferanlage

    公开(公告)号:EP2586555A1

    公开(公告)日:2013-05-01

    申请号:EP11186938.4

    申请日:2011-10-27

    IPC分类号: B23D57/00 B28D5/04

    CPC分类号: B23D57/003 B28D5/045

    摘要: A wire saw device (100) for sawing a plurality of slices of a workpiece (10) is described. The wire saw device includes a wire guide assembly with at least two wire guide cylinders (122) for guiding a wire (20) to form at least one wire web with at least one working area, wherein the at least two wire guide cylinders (122) have a rotation axis, a first compartment (102), which houses the wire guide assembly and has a first side portion of the compartment, which is essentially parallel to the rotation axis, wherein the first compartment further comprises a second side portion of the compartment, which opposes the first side portion and which is essentially parallel to the rotation axis, a second compartment (104) housing a spool (116) for providing new wire, wherein the second compartment (104) is adjacent the first side portion.

    摘要翻译: 描述了用于锯切工件(10)的多个切片的线锯装置(100)。 线锯装置包括线引导组件,其具有至少两个线引导筒(122),用于引导线(20)以形成具有至少一个工作区域的至少一个线幅,其中所述至少两个导线筒(122) )具有旋转轴线,第一隔室(102),其容纳线引导组件并且具有基本上平行于旋转轴线的隔室的第一侧部分,其中第一隔室还包括第二侧部分 隔间,其与第一侧部分相对并且基本上平行于旋转轴线;第二隔室(104),其容纳用于提供新电线的线轴(116),其中第二隔室(104)与第一侧部相邻。