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公开(公告)号：EP3902653B1
公开(公告)日：2024-07-03
申请号：EP19842415.2
申请日：2019-12-27
IPC: B23K26/53 , H01L21/02 , B23K101/40 , B23K103/00 , B23K26/03
CPC classification number: B28D5/0064 , B28D5/0005 , B23K26/53 , H01L22/12 , B23K2103/5620180801 , C30B29/36 , C30B33/06 , B23K26/032 , B23K2101/4020180801 , H01L21/02035
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2.发明公开
公开(公告)号：EP4382233A1
公开(公告)日：2024-06-12
申请号：EP22212131.1
申请日：2022-12-08
Applicant: Siltronic AG
Inventor： Gotzler, Julian , Gräf, Daniel
CPC classification number: B28D5/045 , B28D5/0076 , B28D5/0064 , B23D59/04 , B23D59/002 , B23D57/0053 , B23D57/0023
Abstract: Verfahren zum Abtrennen einer Vielzahl von Scheiben von einem Werkstück mittels einer Drahtsäge während eines Abtrennvorgangs, wobei die Drahtsäge ein Drahtgatter aus sich bewegenden Drahtabschnitten eines Sägedrahts und eine Stellvorrichtung umfasst, und das Drahtgatter in einer Ebene zwischen zwei Drahtführungsrollen gespannt ist, wobei jede der zwei Drahtführungsrollen zwischen einem Festlager und einem Loslager gelagert ist, das Verfahren umfasst das Zustellen des Werkstücks mittels der Stellvorrichtung durch das Drahtgatter entlang einer Zustellrichtung senkrecht zu einer Werkstückachse und senkrecht zur Ebene des Drahtgatters;
das Zuführen eines Schneidmittels zum Drahtgatter;
das Zuführen eines Temperier-Mediums zum Werkstück;
das Leiten einer Temperier-Flüssigkeit entsprechend eines Temperaturprofils durch die Festlager und/oder das Verschieben des Werkstücks entlang der Werkstückachse entsprechend eines Verschiebeprofils, wobei das Temperaturprofil und das Verschiebeprofil einer Formabweichung entgegengerichtet sind;
gekennzeichnet durch
das Ermitteln von Warp-Kurven von mindestens einer Scheibe vom Werkstück-Anfang und von mindestens einer Scheibe vom Werkstück-Ende von mindestens einem vorausgegangenen Abtrennvorgang unter Verwendung der Drahtsäge;
das Bilden der Differenz der Warp-Kurven;
das Einstellen der Temperatur und/oder der Volumen-Geschwindigkeit des Schneidmittels während des Abtrennvorgangs in Abhängigkeit der Differenz der Warp-Kurven; und
das Einstellen der Temperatur und/oder der Volumen-Geschwindigkeit des Temperier-Mediums in Abhängigkeit der Differenz der Warp-Kurven.-
公开(公告)号：EP3015238A1
公开(公告)日：2016-05-04
申请号：EP14190928.3
申请日：2014-10-29
Applicant: Applied Materials Switzerland Sàrl
Inventor： Sueldia, Raphael , Schneider, Olivier
CPC classification number: B28D5/0064 , B28D5/045
Abstract: The present disclosure provides a wire monitoring system (100) for a wire saw device. The wire monitoring system (100) includes a sensor arrangement (110) configured to be positioned adjacent to a wire (22) of the wire saw device, wherein the sensor arrangement (110) is adapted to detect a bow of the wire (22), and wherein the sensor arrangement (110) includes at least one sensor configured to be moved during operation of the wire saw device.
Abstract translation: 本公开提供了一种用于线锯装置的线监视系统（100）。 所述线监测系统（100）包括传感器布置（110），所述传感器布置（110）被配置为邻近所述线锯装置的线（22）定位，其中所述传感器布置（110）适于检测所述线（22） 并且其中所述传感器装置（110）包括至少一个传感器，所述至少一个传感器构造成在所述线锯装置的操作期间移动。
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公开(公告)号：EP3015237A1
公开(公告)日：2016-05-04
申请号：EP14190926.7
申请日：2014-10-29
Applicant: Applied Materials Switzerland Sàrl
Inventor： Zominy, Claude , Valcourt, Floris
CPC classification number: B28D5/045 , B28D5/0064
Abstract: The present disclosure provides a wire monitoring system (100) for a wire saw device. The wire monitoring system (100) includes a sensor arrangement configured to detect a relative distance (24) between at least two wire portions (22) of a wire of the wire saw device.
Abstract translation: 本公开提供了一种用于线锯装置的线监测系统（100）。 线监测系统（100）包括传感器装置，其被配置为检测线锯装置的线的至少两个线部分（22）之间的相对距离（24）。
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公开(公告)号：EP1544172B1
公开(公告)日：2016-01-20
申请号：EP03798384.8
申请日：2003-09-01
Applicant: HONDA GIKEN KOGYO KABUSHIKI KAISHA
Inventor： YONEZAWA, Satoshi c/o Honda Engineering Co., Ltd. , UEDA, Hisashi c/o Honda Engineering Co., Ltd.
IPC: C03B33/10 , C03B33/037 , H01L21/78
CPC classification number: B28D5/0064 , B26D3/065 , B26D5/02 , B28D1/225 , C03C17/002 , C03C17/36 , C03C17/3678 , C03C2218/32 , C03C2218/328 , H01L21/78 , H01L31/0463 , Y02E10/541 , Y10T83/148
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Patent Agency Ranking
公开(公告)号：EP2708342A1
公开(公告)日：2014-03-19
申请号：EP12184353.6
申请日：2012-09-14
Applicant: Applied Materials Switzerland Sàrl
Inventor： El Haddaoui, Najib
CPC classification number: B28D5/0064 , B28D5/045
Abstract: A wire bow monitoring system (10) for a semiconductor wire saw device (100) is described. The wire bow monitoring system (10) includes a sensor arrangement (20) configured to be positioned adjacent to a wire (30) of the wire saw device (100), wherein the sensor arrangement (20) is adapted to detect a bow of the wire (30), wherein the sensor arrangement (20) includes at least one of an inductive sensor (22), a capacitive sensor (22) and a contact sensor (22).
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公开(公告)号：EP2586582A1
公开(公告)日：2013-05-01
申请号：EP11187049.9
申请日：2011-10-28
Applicant: Applied Materials Switzerland Sàrl
Inventor： Rosset, Jean-Marc , Nasch, Philippe
IPC: B28D5/00
CPC classification number: B28D5/0064 , B28D5/045
Abstract: A wire saw control system (1) for operating a wire saw (100) is provided. The wire saw is adapted for cutting a wafer (304, 304, 306, 308) by moving the wire (230) relatively to the wafer with a selectable wire speed. The wire saw control system includes a camera (20) for inspecting the wire, and a camera control unit (25) for operating the camera in dependence of the wire speed. Furthermore, a wire saw including the wire saw control system is provided, and a method for inspecting a wire of a wire saw. The method includes moving the wire with a variable wire speed; and inspecting the wire in dependence of the wire speed, thereby obtaining an inspection result.
Abstract translation: 提供了用于操作线锯（100）的线锯控制系统（1）。 线锯适于通过以可选线速度相对于晶片移动线（230）来切割晶片（304,304,306,308）。 线锯控制系统包括用于检查线的照相机（20）以及用于根据线速操作照相机的照相机控制单元（25）。 此外，提供了包括线锯控制系统的线锯以及用于检查线锯的线的方法。 该方法包括以可变的线速度移动线; 并根据线速检查导线，从而获得检查结果。
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公开(公告)号：EP1385683B8
公开(公告)日：2006-12-20
申请号：EP02732797.2
申请日：2002-04-10
Applicant: S.O.I.Tec Silicon on Insulator Technologies
Inventor： MARTINEZ, Muriel , BARGE, Thierry , SOUBIE, Alain , LAGAHE - Blanchard , Chrystelle , RAYSSAC, Olivier , Berne, Cécile
CPC classification number: H01L21/67092 , B28D5/0011 , B28D5/0023 , B28D5/0064 , B28D5/0082 , Y10S156/921 , Y10T83/7607 , Y10T83/7667 , Y10T156/1142 , Y10T156/1179 , Y10T156/1967 , Y10T156/1983
Abstract: The invention relates to a device (40) for automatic high-precision cutting of a layer of material joined to a substrate source by means of an embrittled area, said source substrate and layer forming a set which is to be cut and said device comprising cutting means (531, 532) in addition to means (510) for maintaining the position of the set which is to be cut, characterized in that the cutting means comprise a blade which acts upon the set which is to be cut. The invention also relates to a method for using said device.
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公开(公告)号：EP1461190A1
公开(公告)日：2004-09-29
申请号：EP02799856.6
申请日：2002-12-31
Applicant: S.O.I.Tec Silicon on Insulator Technologies
Inventor： RAYSSAC, Olivier , LETERTRE, Fabrice
IPC: B28D5/00
CPC classification number: B28D5/0011 , B28D5/0023 , B28D5/0052 , B28D5/0064 , H01L21/2007 , H01L21/76254 , Y10T83/364 , Y10T156/1126 , Y10T156/1184 , Y10T156/1928 , Y10T156/1967 , Y10T156/1972
Abstract: The invention concerns a method for cutting two material layers (10a, 10b) forming an assembly to be cut (10), which consists in: producing between the two layers a weakened interface (11), defining an interface ring; forming a first region (21) called high-pressure region; forming at least a second region (22a, 22b) called low-pressure region; supplying the high pressure region with a fluid with controlled pressure. The invention is characterized in that the weakened interface can be produced by any type of process known per se and designed therefor, thus not limited to producing a bonding interface; and combined with the high pressure supply the interface ring of the assembly to be cut is etched with at least a blade (30). The invention also concerns a related device.
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10.发明公开Wire saw and method of slicing a cylindrical workpiece, e.g. an ingot 失效德尔茨堡和维尔法罕zum Zerschneiden eines zylindrischenWerkstücks，wie锭
公开(公告)号：EP0798091A2
公开(公告)日：1997-10-01
申请号：EP97302064.7
申请日：1997-03-26
Applicant: SHIN-ETSU HANDOTAI COMPANY LIMITED
Inventor： Kiuchi, Etsuo , Hayakawa, Kazuo , Toyama, Kohei
CPC classification number: B28D5/0064 , B28D5/007 , B28D5/045 , Y02P70/179
Abstract: In a wire saw for slicing a cylindrical workpiece such as a silicon ingot so as to obtain wafers or the like, the feed rate of slurry fed to the workpiece, the viscosity of the slurry, or the feed rate of a wire is varied according to the cutting length in the workpiece or the angle between the wire and the circumference of the workpiece. It becomes possible to obtain wafers or the like, each having a uniform thickness.
Abstract translation: 在用于切割诸如硅锭的圆柱形工件的线锯中，以获得晶片等，供给到工件的浆料的进料速率，浆料的粘度或者丝线的进给速率根据 工件中的切割长度或线材与工件周长之间的角度。 可以获得各自具有均匀厚度的晶片等。
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