公开(公告)号：EP0169270A1

公开(公告)日：1986-01-29

申请号：EP84115184.8

申请日：1984-12-11

申请人： HITACHI, LTD.

发明人： Daikoku, Takahiro ,  Nakajima, Tadakatsu ,  Ashiwake, Noriyuki ,  Kawamura, Keizo ,  Sato, Motohiro ,  Kobayashi, Fumiyuki ,  Nakayama, Wataru

IPC分类号： H01L23/42 ,  H01L23/36

CPC分类号： H01L23/4338 ,  H01L2224/16

摘要： A cooling device for providing cooling of integrated circuit semiconductor chips (1) is so arranged as to transfer a heat via thin fin members (16,18) which are fitted with each other with a small clearance (19).The bottom surface of one of thermal conductive members (17) which is provided integrally with the fin members (18) is made greater in surface area than a back planar surface of the semiconductor chip (1), and the thermal conductive member (17) and the semiconductor chip (1) are kept at all times in plane contact with each other, thereby enhancing the cooling performance.

公开(公告)号：EP0298372B1

公开(公告)日：1993-01-13

申请号：EP88110467.3

申请日：1988-06-30

申请人： HITACHI, LTD.

发明人： Ohashi, Shigeo ,  Kuwabara, Heikichi ,  Nakajima, Tadakatsu ,  Nakayama, Wataru ,  Sato, Motohiro ,  Kasai, Kenichi

IPC分类号： H01L23/42 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L23/44 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP0169270B1

公开(公告)日：1990-03-28

申请号：EP84115184.8

申请日：1984-12-11

申请人： HITACHI, LTD.

发明人： Daikoku, Takahiro ,  Nakajima, Tadakatsu ,  Ashiwake, Noriyuki ,  Kawamura, Keizo ,  Sato, Motohiro ,  Kobayashi, Fumiyuki ,  Nakayama, Wataru

IPC分类号： H01L23/42 ,  H01L23/36

CPC分类号： H01L23/4338 ,  H01L2224/16

公开(公告)号：EP0159722B1

公开(公告)日：1989-07-26

申请号：EP85105149.0

申请日：1985-04-26

申请人： HITACHI, LTD.

发明人： Nakayama, Wataru ,  Nakajima, Tadakatsu ,  Hirasawa, Shigeki ,  Kohno, Akiomi ,  Takenaka, Takaji

IPC分类号： H01L23/42

CPC分类号： H01L23/427 ,  F28F13/187 ,  H01L2924/0002 ,  Y10S505/90 ,  H01L2924/00

公开(公告)号：EP0298372A3

公开(公告)日：1989-03-08

申请号：EP88110467.3

申请日：1988-06-30

申请人： HITACHI, LTD.

发明人： Ohashi, Shigeo ,  Kuwabara, Heikichi ,  Nakajima, Tadakatsu ,  Nakayama, Wataru ,  Sato, Motohiro ,  Kasai, Kenichi

IPC分类号： H01L23/42 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L23/44 ,  H01L2924/0002 ,  H01L2924/00

摘要： High heat generation member (1) of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member (1) and is condensed by a condenser (5) which is provided in an upper portion of a container (2). A refrigerant steam flow path (4) and a condensed refrigerant flow path (6) from the condenser (5) are separated with a partition wall (7). The condensed liquid (3) sent back to the partition wall (7) is supplied to the heat generation member (1) through the partition wall (7).

公开(公告)号：EP0298372A2

公开(公告)日：1989-01-11

申请号：EP88110467.3

申请日：1988-06-30

申请人： HITACHI, LTD.

发明人： Ohashi, Shigeo ,  Kuwabara, Heikichi ,  Nakajima, Tadakatsu ,  Nakayama, Wataru ,  Sato, Motohiro ,  Kasai, Kenichi

IPC分类号： H01L23/42 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L23/44 ,  H01L2924/0002 ,  H01L2924/00

摘要： High heat generation member (1) of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member (1) and is condensed by a condenser (5) which is provided in an upper portion of a container (2). A refrigerant steam flow path (4) and a condensed refrigerant flow path (6) from the condenser (5) are separated with a partition wall (7). The condensed liquid (3) sent back to the partition wall (7) is supplied to the heat generation member (1) through the partition wall (7).

摘要翻译： 电子集成电路等的高发热体（1）被煮沸冷却。 制冷剂蒸汽是通过冷却发热件（1）而产生的，并由设置在容器（2）的上部的冷凝器（5）冷凝。 来自冷凝器（5）的制冷剂蒸汽流路（4）和冷凝的制冷剂流路（6）被分隔壁（7）分离。 送回分隔壁（7）的冷凝液（3）通过分隔壁（7）供给到发热体（1）。

公开(公告)号：EP0167665B1

公开(公告)日：1988-06-29

申请号：EP84114163.3

申请日：1984-11-23

申请人： HITACHI, LTD.

发明人： Nakayama, Wataru ,  Hirasawa, Shigeki ,  Nakajima, Tadakatsu

IPC分类号： H01L23/42 ,  H05K7/20

CPC分类号： H05K7/203 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP0237741A2

公开(公告)日：1987-09-23

申请号：EP87101348.8

申请日：1987-02-02

申请人： HITACHI, LTD.

发明人： Nakajima, Tadakatsu 7-301 Tsukuba House ,  Nakayama, Wataru ,  Oohashi, Shigeo Niihari-ryo ,  Kuwabara, Heikichi ,  Daikoku, Takahiro

IPC分类号： H01L23/42 ,  H01L23/36

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/907

摘要： The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer (11) is provided at the surface part of the contact interface of a heat generating element (1) or a heat sink element (2), and a liquid (13) such as oil is contained in cavities (15) formed in the porous layer (11), the heat generating element (1) and the heat sink element (2) being held in close contact by the surface tension of the liquid (13), whereby heat generated by the heat generating element (1) is transferred to the heat sink element (2).

公开(公告)号：EP0159722A2

公开(公告)日：1985-10-30

申请号：EP85105149.0

申请日：1985-04-26

申请人： HITACHI, LTD.

发明人： Nakayama, Wataru ,  Nakajima, Tadakatsu ,  Hirasawa, Shigeki ,  Kohno, Akiomi ,  Takenaka, Takaji

IPC分类号： H01L23/42

CPC分类号： H01L23/427 ,  F28F13/187 ,  H01L2924/0002 ,  Y10S505/90 ,  H01L2924/00

摘要： In an apparatus wherein heat generating bodies (2) such as integrated circuit chips are cooled by utilizing boiling of a liquid; a heat transfer apparatus characterized in that a heat conductive member (12) which has a plurality of layers of cavity groups (18, 19) and apertures (17) for bringing the cavity groups (18,19) into communication is installed on a surface of each of the heat generating bodies (2).