公开(公告)号：EP0523240A1

公开(公告)日：1993-01-20

申请号：EP92903331.4

申请日：1992-01-20

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Ohta, Masahiro ,  Matsuyama, Akio ,  Senoue, Eiji ,  Kuwano, Fumiaki ,  Yasui, Osamu ,  Yoshida, Yasunori ,  Ryu, Akinori ,  Kobayashi, Tadashi

IPC分类号： C07D209/48 ,  C08G73/12 ,  C07D209/66

CPC分类号： C07D209/48 ,  C07D209/66 ,  C07D487/04 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1078 ,  C08G73/12 ,  C08G73/124 ,  C08G73/125 ,  C08G73/126 ,  C08G73/127 ,  C08K5/3417 ,  C08K9/04 ,  C08L79/08 ,  C08L79/085 ,  C09D179/08

摘要： A polyimide resin composition for molding, which comprises a polyimide resin and an aromatic bisimide compound and has a melt flowability and an excellent processability in addition to the heat resistance inherent in polyamide; a carbon fiber-reinforced polyimide resin composition which comprises a polyimide resin and carbon fibers coated with an aromatic bisimide compound and has excellent mechanical strengths; and novel bisimide compounds represented by general formula (I), which are very useful as the aromatic bisimide compounds in the above resin compositions, wherein X represents a direct bond, C₁ to C₁₀ divalent hydrocarbyl, hexafluoroisopropylidene, carbonyl, thio or sulfonyl; Y₁ to Y₄ represent each independently hydrogen, lower alkyl, lower alkoxy, chlorine or bromine; and R represents a divalent group selected from the group consisting of monocyclic aromatic groups, fused polycyclic aromatic groups, and nonfused polycyclic aromatic groups wherein aromatic groups are linked together directly or through cross-linking member(s).

摘要翻译： 一种用于模塑的聚酰亚胺树脂组合物，其包含聚酰亚胺树脂和芳族双酰亚胺化合物，并且除了聚酰胺固有的耐热性之外，还具有熔体流动性和优异的加工性能; 碳纤维增强聚酰亚胺树脂组合物，其包含聚酰亚胺树脂和涂覆有芳族双酰亚胺化合物的碳纤维，并具有优异的机械强度; 和由通式（I）表示的新型双酰亚胺化合物，其在上述树脂组合物中作为芳族双酰亚胺化合物非常有用，其中X表示直接键，C1至C10二价烃基，六氟异亚丙基，羰基，硫代或磺酰基; Y1至Y4各自独立地表示氢，低级烷基，低级烷氧基，氯或溴; 并且R表示选自单环芳族基团，稠合多环芳族基团和未稠合的多环芳族基团的二价基团，其中芳族基团直接或通过交联成员连接在一起。

公开(公告)号：EP0294931B1

公开(公告)日：1992-09-02

申请号：EP88303907.5

申请日：1988-04-29

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Yamaya, Norimasa ,  Ohta, Masahiro ,  Yamaguchi, Akihiro

IPC分类号： C08L79/08 ,  C08J5/16

CPC分类号： F16J9/28 ,  C08G73/1046 ,  C08G73/1057 ,  C08G73/1071 ,  C08K3/04 ,  C08K3/30 ,  C08K3/38 ,  F16C33/201 ,  C08L79/08

公开(公告)号：EP0459801A2

公开(公告)日：1991-12-04

申请号：EP91304893.0

申请日：1991-05-30

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Tamai, Shoji ,  Yamaguchi, Akihiro ,  Ohta, Masahiro

IPC分类号： C08G73/10

CPC分类号： C08G73/101 ,  C08G73/1071

摘要： A readily melt processable polyimide obtained by reacting diamine represented by the formula :

wherein n is an integer of 1 or 2, with 3,3′,4,4′-diphenylethertetracarboxylic dianhydride and/or 4,4′-(p-phenylenedioxy)diphthalic dianhydride or a mixture of these tetracarboxylic acid dianhydrides and pyromellitic dianhydride in the presence of phthalic anhydride, is disclosed.

摘要翻译： 通过使由下式表示的二胺：其中n为1或2的整数与3,3分钟，4,4分钟 - 二苯基醚四羧酸二酐和/或4,4分钟 - （p 苯二甲酸二酐或这些四羧酸二酐和均苯四甲酸二酐在邻苯二甲酸酐存在下的混合物。

公开(公告)号：EP0451405A1

公开(公告)日：1991-10-16

申请号：EP90311676.2

申请日：1990-10-24

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Yamaya, Norimasa ,  Ohta, Masahiro ,  Yamaguchi, Akihiro

IPC分类号： C08G73/12

CPC分类号： C08G73/125 ,  C08G73/121 ,  C08G73/124 ,  C08G73/126

摘要： Disclosed is a thermosetting resin composition which comprises a specific bismaleimide compound or polymaleimide and a specific aromatic diamine compound. It can be widely used for electrical and electronic parts, various structural parts, sliding parts and the like. The diamine is of formula

The maleimide is the bismaleimide

or the polymaleimide

摘要翻译： 公开了包含特定双马来酰亚胺化合物或聚马来酰亚胺和特定芳族二胺化合物的热固性树脂组合物。 它可广泛用于电气和电子部件，各种结构部件，滑动部件等。 二胺具有下式：马来酰亚胺是双马来酰亚胺或聚马来酰亚胺

公开(公告)号：EP0234882A3

公开(公告)日：1989-03-15

申请号：EP87301478.1

申请日：1987-02-20

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Tamai, Shoji ,  Ohta, Masahiro ,  Kawashima, Saburo ,  Oikawa, Hideaki ,  Ohkoshi, Kouji ,  Yamaguchi, Akihiro

IPC分类号： C09J179/08 ,  C08G73/10 ,  B32B27/04

CPC分类号： C08G73/105

摘要： This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I)
(where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutally connected with a bond or a crosslinking function). The ployimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-­hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3ʹ,4,4ʹ-­biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3ʹ4,4ʹ-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.

公开(公告)号：EP0294931A1

公开(公告)日：1988-12-14

申请号：EP88303907.5

申请日：1988-04-29

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Yamaya, Norimasa ,  Ohta, Masahiro ,  Yamaguchi, Akihiro

IPC分类号： C08L79/08 ,  C08J5/16

CPC分类号： F16J9/28 ,  C08G73/1046 ,  C08G73/1057 ,  C08G73/1071 ,  C08K3/04 ,  C08K3/30 ,  C08K3/38 ,  F16C33/201 ,  C08L79/08

摘要： A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a solid lubricant. The composition has low coefficient of friction and excellent wear resistance, and can be utilized for self-lubricating parts.

摘要翻译： 由双马来酰亚胺化合物和二胺化合物组成的聚氨基双马来酰亚胺树脂和固体润滑剂形成的热固性树脂组合物。 该组合物具有低摩擦系数和优异的耐磨性，可用于自润滑部件。

公开(公告)号：EP0294144A1

公开(公告)日：1988-12-07

申请号：EP88304936.3

申请日：1988-05-31

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Ohta, Masahiro ,  Iiyama, Katsuaki ,  Kawashima, Saburo ,  Tamai, Shoji ,  Oikawa, Hideaki ,  Yamaguchi, Akihiro

IPC分类号： C08L79/08

CPC分类号： C08L79/08 ,  Y10S525/906 ,  Y10S525/928 ,  C08L81/00

摘要： This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.
The polyimide resin composition of this invention consists of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide consists of recurring units of the following formula:
wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example,
The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula:
aromatic polysulfone consisting of recurring units of the formula:
or aromatic polyetherimide consisting of recurring units of the formula:

摘要翻译： 本发明涉及模塑树脂组合物，并且更具体地涉及除了优异的高温稳定性，耐化学性和机械强度之外还具有显着改进的模塑能力的聚酰亚胺树脂组合物。 本发明的聚酰亚胺树脂组合物由99.9〜50重量％的聚酰亚胺和0.1〜50重量％的高温工程聚合物构成。 聚酰亚胺由下式的重复单元组成：其中X是磺酰基或羰基，R是选自脂族基，脂环族基，单芳族基，稠合芳基和非稠合芳基的四价基团。 R为例如高温工程聚合物为例如由下式的重复单元组成的聚苯硫醚：由下式的重复单元组成的芳族聚砜：或由下式的重复单元组成的芳族聚醚酰亚胺：

公开(公告)号：EP0269319A2

公开(公告)日：1988-06-01

申请号：EP87310002.8

申请日：1987-11-12

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Oikawa, Hideaki ,  Koga, Nobuhito ,  Iiyama, Katsuaki ,  Kawashima, Saburo ,  Tamai, Shoji ,  Ohta, Masahiro ,  Yamaguchi, Akihiro

IPC分类号： C08G73/10

CPC分类号： C08G73/1071 ,  C08G73/1046

摘要： Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability.
The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives.
The polyimide has recurring units of the following formula (I):
wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage.
The polyimide of this invention is prepared by reacting 4,4ʹ-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V):
and successively imidizing the resultant polyamic acid.

摘要翻译： 本发明的聚酰亚胺除了具有显着的高温稳定性外，几乎是无色的，并且具有非常高的透光率以及优异的加工性和高温下的粘合性。 该聚酰亚胺是一种新型聚酰亚胺，可用于空间和航空材料，电气和电子部件，汽车部件以及高温粘合剂。 聚酰亚胺具有下式（I）的重复单元：其中X是选自键，含1至10个碳的二价烃基，六氟化异丙叉基，羰基，磺酰基和 硫代自由基，酰亚胺环的每个氮原子同时位于醚键或对位。 本发明的聚酰亚胺通过使4,4' - （对亚苯基二氧基）二邻苯二甲酸二酐与具有以下通式（V）的醚二胺反应：并依次酰亚胺化所得聚酰胺酸制备。 Ë

公开(公告)号：EP0751168A1

公开(公告)日：1997-01-02

申请号：EP96304623.0

申请日：1996-06-21

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Oikawa, Hideaki ,  Tamai, Shoji ,  Ohta, Masahiro ,  Yamaguchi, Akihiro

IPC分类号： C08G73/10

CPC分类号： C08G73/101 ,  C08G73/1071 ,  Y10T428/31504

摘要： Novel thermoset polyimide and a composite materials comprising the thermoset polyimide and a fibrous reinforcement are prepared according to this invention.
The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomer or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarbo xylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond.
The thermoset polyimide of this invention has essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. This invention can provide various kind of composite materials for aircraft matrix, electric and electronic appliances and others.
A preferred polyimide is of formula:

摘要翻译： 根据本发明制备新型热固性聚酰亚胺和包含热固性聚酰亚胺和纤维增强材料的复合材料。 通过热处理线性聚酰胺酸或通过使用4,4'-双（3-氨基苯氧基）联苯和均苯四酸二酐作为必需单体制备的线性聚酰亚胺或通过加入4,4'-二氨基二苯醚或3 ，3'，4,4'-联苯四羧酸二酐与本质单体反应，并用具有碳 - 碳三键的芳族二羧酸酐封端分子链末端。 本发明的热固性聚酰亚胺具有热塑性聚酰亚胺的基本优异性能，另外具有增强的耐热性和改进的机械性能。 本发明可以为航空母舰，电动和电子电器等提供各种复合材料。 优选的聚酰亚胺具有下式：

公开(公告)号：EP0350203B1

公开(公告)日：1996-05-29

申请号：EP89306579.7

申请日：1989-06-28

申请人： MITSUI TOATSU CHEMICALS, Inc.

发明人： Ohta, Masahiro ,  Iiyama, Katsuaki ,  Kawashima, Saburo ,  Tamai, Shoji ,  Oikawa, Hideaki ,  Yamaguchi, Akihiro

IPC分类号： C08G73/10

CPC分类号： C08G73/14 ,  C08G73/1003 ,  C08G73/1014 ,  C08G73/1042 ,  C08G73/1078