公开(公告)号：EP3375606A1

公开(公告)日：2018-09-19

申请号：EP16864329.4

申请日：2016-11-10

Applicant: NHK Spring Co., Ltd.

Inventor： AIKAWA, Naoya ,  HIRANO, Satoshi ,  YAMAUCHI, Yuichiro

IPC: B32B15/01 ,  B05D1/12 ,  B05D7/24 ,  B22F1/00 ,  B22F9/08 ,  B32B15/02 ,  B32B15/04 ,  B32B15/20 ,  C04B41/90 ,  C22C9/00

Abstract: To provide a laminate having a high heat dissipation effect, having no problem such as cracking of an insulating substrate even when a thermal load is applied, and having no void or the like in a metal film, and a method of manufacturing the laminate. A laminate according to the present invention includes an insulating substrate 10, an intermediate layer 50 formed on a surface of the substrate 10 and containing a metal or an alloy as a main component, and a circuit layer 20 that is a metal film formed of a copper powder having a hydrogen content of 0.002% by mass or less and laminated on the intermediate layer 50. In the laminate, an interface between the intermediate layer 50 and the circuit layer 20 is plastically deformed.

公开(公告)号：EP2763166A1

公开(公告)日：2014-08-06

申请号：EP12836204.3

申请日：2012-09-20

Applicant: NHK Spring Co., Ltd.

Inventor： YAMAUCHI, Yuichiro ,  SAITO, Shinji ,  AKABAYASHI, Masaru ,  MORI, Shogo

IPC: H01L23/36 ,  C23C24/04 ,  H01L23/427 ,  H01L25/07 ,  H01L25/18 ,  H05K1/02 ,  H05K7/20

CPC classification number: F28D15/02 ,  B23P15/26 ,  C23C24/04 ,  F28D15/0233 ,  F28D15/0275 ,  H01L21/4871 ,  H01L23/3735 ,  H01L23/427 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/0306 ,  H05K7/20336 ,  H05K2201/064 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A heat dissipation structure having high joining strength during a cooling/heating cycle and a high cooling efficiency, a power module, a method of manufacturing the heat dissipation structure, and a method of manufacturing the power module is provided. A power module 1 of the present invention includes: a ceramic substrate 10 having an insulation quality; a metal member 50 containing a metal or an alloy and joined by a brazing material on a surface of the ceramic substrate 10; and a heat dissipation member 40 formed by accelerating a powder containing a metal or an alloy with a gas, and by spraying and depositing the powder in a solid phase state on a surface of the metal member 50, wherein a heat pipe 60 is embedded in the heat dissipation member 40.

Abstract translation: 提供一种具有高冷却/加热循环和高冷却效率，电源模块，制造散热结构的方法，以及制造该功率模块的方法的过程中接合强度的散热结构。 本发明的功率模块1包括：陶瓷基板具有绝缘质量10; 金属构件50上含有金属或合金和由陶瓷基板10的表面上的钎焊材料接合; 并通过加速含有具有气体的金属或合金的粉末，并通过喷雾和金属部件50的表面上沉积在固相状态下的粉末，worin热管60形成的散热部件40被嵌入在 散热构件40次

公开(公告)号：EP2743378A1

公开(公告)日：2014-06-18

申请号：EP12822351.8

申请日：2012-08-06

Applicant: NHK Spring Co., Ltd.

Inventor： YAMAUCHI, Yuichiro ,  HIDESHIMA, Hidemitsu ,  HIRANO, Satoshi

IPC: C23C24/04

CPC classification number: F16L9/02 ,  C23C24/04 ,  F28F3/12 ,  F28F7/02

Abstract: A member with flow passage that is improved in adhesion between a wall surface constituting a flow passage and a metallic member, and a method for manufacturing the same are provided. A member with flow passage 100 includes: a base member 101 made of metal or alloy; a plate-like member 102 made of metal or alloy in a plate-like shape, including two flat plate portions 11 that are positioned at both widthwise ends and have main surfaces passing over one and the same plane, and a convex portion 12 that is provided between the two flat plate portions 11 and has a cross section shaped in a thickness direction so as to protrude with respect to the flat plate portions, and forming the flow passage 106; and a metal deposit layer 105 that is formed by, while main surfaces of the flat plate portions 11 opposite to a top of the convex portion 12 are facing the base member 101, accelerating powder of metal or alloy together with a gas, and spraying and depositing the powder in a solid-phase state on a surface of the plate-like member 101 at the top side of the convex portion 12 and a surface of the base member 101.

Abstract translation: 提供了一种具有提高构成流路的壁面与金属构件之间的粘合性的流路的构件及其制造方法。 具有流动通道100的构件包括：由金属或合金制成的基座构件101; 由板状的金属或合金构成的板状构件102，包括位于两个宽度方向两端并且具有穿过同一平面的主表面的两个平板部分11和位于同一平面上的主表面的两个平板部分11， 设置在两个平板部11之间，并且具有在厚度方向上成形为相对于平板部突出的横截面，并且形成流路106; 以及金属沉积层105，其中，平板部分11的与凸部12的顶部相对的主表面面向基底部件101，与气体一起加速金属或合金的粉末，并喷涂和 在凸部12的上侧的板状部件101的表面和基部部件101的表面上以固相状态沉积粉末。

公开(公告)号：EP2650077A1

公开(公告)日：2013-10-16

申请号：EP11846727.3

申请日：2011-12-01

Applicant: Nhk Spring Co., Ltd.

Inventor： YAMAUCHI, Yuichiro ,  SAITO, Shinji

IPC: B23K35/30 ,  C04B37/00 ,  C04B37/02 ,  C22C5/06 ,  H01M8/02 ,  H01M8/12

CPC classification number: B23K35/3006 ,  B23K35/00 ,  B23K35/28 ,  B23K35/30 ,  B23K2201/36 ,  B23K2203/04 ,  B23K2203/05 ,  B23K2203/16 ,  B23K2203/18 ,  B23K2203/26 ,  B23K2203/52 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/368 ,  C04B2237/406 ,  C22C5/06 ,  C22C30/00 ,  H01M8/0202 ,  H01M8/0215 ,  H01M8/0228 ,  H01M8/0271 ,  H01M8/0297 ,  H01M2008/1293

Abstract: A brazing alloy for bonding in air can be melted at a temperature below the melting point ofAg and can improve the high-temperature durability of the bonded article. The brazing alloy for bonding in air contains Ag, B, and Si, as essential components, in which the total of constituent elements except for Ag is set to more than 50% by volume and not more than 90% by volume, Si content in the constituent elements except for Ag is set to more than 22% by volume, and B content in the constituent elements except for Ag is set to more than 14% by volume. For example, as shown in Fig. 4 , in a bonded layer 13 of a bonded specimen of the present invention, after holding at high temperature, no void 16 ( Fig. 6 ) as observed in a bonded specimen after holding at high temperature of a Comparative Sample was observed, the brazing alloy was sufficiently melted, and superior gas sealing characteristics were maintained even after holding at high temperature for a long time.

Abstract translation: 用于空气中粘合的钎焊合金可以在低于Ag的熔点的温度下熔化，并且可以提高粘合制品的高温耐久性。 用于在空气中粘合的钎焊合金含有作为必要成分的Ag，B和Si，其中Ag除外的组成元素的总量设定为大于体积比50体积％且不大于90体积％，Si含量 除了Ag以外的构成元素被设定为大于22体积％，除Ag以外的构成元素的B含量设定为大于14体积％。 例如，如图1所示。 如图4所示，在本发明的接合试样的接合层13中，在高温保持后，观察到在比较样品的高温下保持后的接合试样中观察到的空隙16（图6），钎焊 合金充分熔融，即使长期保持在高温下也保持了优异的气体密封特性。