公开(公告)号：EP4491757A1

公开(公告)日：2025-01-15

申请号：EP23766622.7

申请日：2023-02-27

Applicant: NHK Spring Co., Ltd.

Inventor： YOKOYAMA, Hibiki ,  KANEDA, Noriyoshi ,  SONE, Michiyoshi ,  HIRANO, Satoshi ,  TAKAHARA, Go ,  NAMBU Takatoshi

IPC: C23C4/00 ,  B05B7/16 ,  B05B12/12 ,  B05D1/08 ,  B05D3/00

Abstract: According to an embodiment of the present invention, a thermal spraying device including a thermal spraying machine that includes a thermal spraying torch which thermally sprays a material to a base material, one or more peripheral devices that are used together with the thermal spraying machine, and a centralized control board that is capable of collectively controlling the thermal spraying machine and the one or more peripheral devices is provided. According to an embodiment of the present invention of the present invention, a spraying control method that is executed by a thermal spraying device including a thermal spraying machine, one or more peripheral devices that are used together with the thermal spraying machine, and a centralized control board, the method including collectively controlling the thermal spraying machine and the one or more peripheral devices by the centralized control board is provided.

公开(公告)号：EP2695972B1

公开(公告)日：2019-06-05

申请号：EP12768423.1

申请日：2012-04-06

Applicant: NHK Spring Co., Ltd.

Inventor： HIRANO, Satoshi ,  YAMAUCHI, Yuichiro ,  AKABAYASHI, Masaru ,  HANAMACHI, Toshihiko

IPC: C23C28/02 ,  C23C24/04 ,  B05B7/14 ,  B32B15/01 ,  C23C14/02 ,  C23C14/16 ,  C23C28/00

公开(公告)号：EP2690195A1

公开(公告)日：2014-01-29

申请号：EP12760790.1

申请日：2012-03-22

Applicant: NHK Spring Co., Ltd.

Inventor： HIRANO, Satoshi ,  YAMAUCHI, Yuichiro ,  AKABAYASHI, Masaru ,  SAITO, Shinji ,  HANAMACHI, Toshihiko

IPC: C23C24/04 ,  B32B15/01 ,  C22F1/04 ,  C22F1/08 ,  C23C28/02 ,  H01B5/02 ,  H01B13/00

CPC classification number: H05K1/092 ,  B32B15/017 ,  B32B15/018 ,  C23C24/04 ,  C23C28/021 ,  C23C28/023 ,  C23C28/321 ,  C23C28/322 ,  H01B13/30

Abstract: A lamination having a high interface strength, in which a copper film is laminated on an aluminum substrate, or a lamination in which an aluminum film is laminated on a copper substrate, are manufactured by a cold spray method. A lamination 10 of the present invention includes: a substrate 1 formed of aluminum or aluminum alloy; an intermediate layer 2 formed of any one metal or nonmetal selected from the group consisting of silver, gold, chromium, iron, germanium, manganese, nickel, silicon, and zinc, or an alloy containing the any one metal, on a surface of the substrate 1; and a film layer 3 formed by accelerating powder material of copper or copper alloy together with gas heated to a temperature lower than a melting point of the powder material and spraying and depositing a solid-phase powder material onto a surface of the intermediate layer 2.

Abstract translation: 通过冷喷涂法制造在铝基板上层压有铜膜的高界面强度的层压体，或者在铜基板上层压铝膜的层压体。 本发明的层叠体10包括：由铝或铝合金形成的基板1; 由选自银，金，铬，铁，锗，锰，镍，硅和锌的任何一种金属或非金属形成的中间层2或含有任何一种金属的合金在 基板1; 以及通过加热铜或铜合金的粉末材料以及加热到低于粉末材料的熔点的温度的气体而形成的膜层3，并且将固相粉末材料喷射并沉积到中间层2的表面上。

公开(公告)号：EP3315212B1

公开(公告)日：2020-09-02

申请号：EP16814368.3

申请日：2016-06-21

Applicant: NHK Spring Co., Ltd.

Inventor： HIRANO, Satoshi ,  KAWASAKI, Koichi

IPC: B05D1/06 ,  B05B7/14 ,  C23C24/04

公开(公告)号：EP3115481B1

公开(公告)日：2018-10-03

申请号：EP15758220.6

申请日：2015-02-25

Applicant: NHK Spring Co., Ltd.

Inventor： TAKIMOTO, Masaru ,  YAMAUCHI, Yuichiro ,  HIRANO, Satoshi ,  AIKAWA, Naoya

IPC: C23C24/04

CPC classification number: C23C24/04

Abstract: For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.

公开(公告)号：EP3375606A1

公开(公告)日：2018-09-19

申请号：EP16864329.4

申请日：2016-11-10

Applicant: NHK Spring Co., Ltd.

Inventor： AIKAWA, Naoya ,  HIRANO, Satoshi ,  YAMAUCHI, Yuichiro

IPC: B32B15/01 ,  B05D1/12 ,  B05D7/24 ,  B22F1/00 ,  B22F9/08 ,  B32B15/02 ,  B32B15/04 ,  B32B15/20 ,  C04B41/90 ,  C22C9/00

Abstract: To provide a laminate having a high heat dissipation effect, having no problem such as cracking of an insulating substrate even when a thermal load is applied, and having no void or the like in a metal film, and a method of manufacturing the laminate. A laminate according to the present invention includes an insulating substrate 10, an intermediate layer 50 formed on a surface of the substrate 10 and containing a metal or an alloy as a main component, and a circuit layer 20 that is a metal film formed of a copper powder having a hydrogen content of 0.002% by mass or less and laminated on the intermediate layer 50. In the laminate, an interface between the intermediate layer 50 and the circuit layer 20 is plastically deformed.

公开(公告)号：EP2743378A1

公开(公告)日：2014-06-18

申请号：EP12822351.8

申请日：2012-08-06

Applicant: NHK Spring Co., Ltd.

Inventor： YAMAUCHI, Yuichiro ,  HIDESHIMA, Hidemitsu ,  HIRANO, Satoshi

IPC: C23C24/04

CPC classification number: F16L9/02 ,  C23C24/04 ,  F28F3/12 ,  F28F7/02

Abstract: A member with flow passage that is improved in adhesion between a wall surface constituting a flow passage and a metallic member, and a method for manufacturing the same are provided. A member with flow passage 100 includes: a base member 101 made of metal or alloy; a plate-like member 102 made of metal or alloy in a plate-like shape, including two flat plate portions 11 that are positioned at both widthwise ends and have main surfaces passing over one and the same plane, and a convex portion 12 that is provided between the two flat plate portions 11 and has a cross section shaped in a thickness direction so as to protrude with respect to the flat plate portions, and forming the flow passage 106; and a metal deposit layer 105 that is formed by, while main surfaces of the flat plate portions 11 opposite to a top of the convex portion 12 are facing the base member 101, accelerating powder of metal or alloy together with a gas, and spraying and depositing the powder in a solid-phase state on a surface of the plate-like member 101 at the top side of the convex portion 12 and a surface of the base member 101.

Abstract translation: 提供了一种具有提高构成流路的壁面与金属构件之间的粘合性的流路的构件及其制造方法。 具有流动通道100的构件包括：由金属或合金制成的基座构件101; 由板状的金属或合金构成的板状构件102，包括位于两个宽度方向两端并且具有穿过同一平面的主表面的两个平板部分11和位于同一平面上的主表面的两个平板部分11， 设置在两个平板部11之间，并且具有在厚度方向上成形为相对于平板部突出的横截面，并且形成流路106; 以及金属沉积层105，其中，平板部分11的与凸部12的顶部相对的主表面面向基底部件101，与气体一起加速金属或合金的粉末，并喷涂和 在凸部12的上侧的板状部件101的表面和基部部件101的表面上以固相状态沉积粉末。

公开(公告)号：EP3375606B1

公开(公告)日：2020-09-23

申请号：EP16864329.4

申请日：2016-11-10

Applicant: NHK Spring Co., Ltd.

Inventor： AIKAWA, Naoya ,  HIRANO, Satoshi ,  YAMAUCHI, Yuichiro

IPC: B32B15/01 ,  B05D1/12 ,  B05D7/24 ,  B32B15/02 ,  B32B15/04 ,  B32B15/20 ,  C04B41/90 ,  C22C9/00 ,  B32B37/18 ,  C23C24/00

公开(公告)号：EP3315212A1

公开(公告)日：2018-05-02

申请号：EP16814368.3

申请日：2016-06-21

Applicant: NHK Spring Co., Ltd.

Inventor： HIRANO, Satoshi ,  KAWASAKI, Koichi

IPC: B05D1/06 ,  B05B7/14 ,  C23C24/04

Abstract: Provided is a film forming method and the like by which, while implementing a cold spray method, it is possible to inject material powder at a high speed while preventing the material powder from being heated excessively. The film forming method is used for forming a film by spraying material powder to deposit on a surface of a base member while the material powder remains in a solid phase state. The film forming method includes: a mixing distance adjusting step of adjusting, in accordance with the type of the material powder, the distance between the position in which the diameter of a through passage is smallest and a mixing position in which the material powder introduced to a nozzle is mixed with gas, the through passage being formed inside the nozzle and being configured so that the diameter thereof first decreases and then increases from a base end toward a distal end; an injecting step of mixing the material powder with the gas in the mixing position, introducing the mixture to the nozzle, accelerating the mixture toward the position in which the diameter is the smallest, and injecting the material powder and the gas from the distal end of the nozzle; and a spraying step of spraying the material powder and the gas injected from the distal end onto the base member.

Abstract translation: 本发明提供一种在实施冷喷涂法的同时，能够防止原料粉末过度加热的同时高速喷射原料粉末的成膜方法等。 该成膜方法用于通过喷射材料粉末以沉积在基底部件的表面上而形成膜，同时材料粉末保持固相状态。 所述成膜方法包括：混合距离调节步骤，根据所述原料粉末的种类，调节所述贯通路径的直径最小的位置与将所述原料粉末导入的混合位置之间的距离 喷嘴与气体混合，所述贯通通道形成在所述喷嘴内部，并构造成使得其直径首先减小，然后从基端朝向远端增加; 在混合位置混合原料粉末和气体的注入工序，将混合物导入喷嘴，使混合物朝向直径最小的位置加速，从原料粉末的前端喷射原料粉末和气体 喷嘴; 以及将原料粉末和从前端注入的气体喷雾到基材上的喷雾工序。

公开(公告)号：EP2907896A1

公开(公告)日：2015-08-19

申请号：EP13845899.7

申请日：2013-10-08

Applicant: NHK Spring Co., Ltd.

Inventor： HIRANO, Satoshi

IPC: C23C24/04 ,  B05B7/14 ,  B05D1/12

CPC classification number: B05B1/02 ,  B05B7/1422 ,  B05B7/1481 ,  B05D1/12 ,  B05D3/0466 ,  B05D3/0486 ,  C23C24/04

Abstract: A film forming method and a film forming apparatus are provided, which achieve: suppression of oxidation of a film being formed; a simple and inexpensive configuration of the apparatus; and replacement of a base member to be subjected to film formation without time and effort. A film forming apparatus 100 is a film forming apparatus that forms a film by accelerating powder 2 of a material with gas and spraying and depositing the powder 2 onto a surface of a substrate 1 with the powder 2 being kept in a solid state; the film forming apparatus 100 includes a chamber 10, a holding unit 11 that is provided in the chamber 10 and holds the base member 1, a spray nozzle 12 that jets out the powder with inert gas, and a drive unit 15 that moves any one of the spray nozzle 12 and holding unit 11 with respect to the other; and inside of the chamber 10 is caused to be under positive pressure by the inert gas jetted out from the spray nozzle 12.

Abstract translation: 提供一种成膜方法和成膜装置，其实现：抑制所形成的膜的氧化; 该装置的简单且廉价的构造; 并且不用时间和精力地更换要成膜的基底构件。 成膜装置100是通过用气体加速材料的粉末2并且将粉末2保持为固态并喷射并沉积到基材1的表面上而形成膜的成膜装置; 成膜装置100包括：室10，设置在室10中并保持基部构件1的保持单元11;喷射喷嘴12，其用惰性气体喷出粉末;驱动单元15，其移动任何一个 的喷嘴12和保持单元11相对于另一个; 通过从喷嘴12喷出的惰性气体使室10的内部成为正压。