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公开(公告)号：EP4009024A1
公开(公告)日：2022-06-08
申请号：EP20849555.6
申请日：2020-07-27
Applicant: NHK Spring Co., Ltd.
Inventor： KIDA, Naoya , TATSUMI, Arata , SEKIYA, Kenji , AIKAWA, Naoya , TAKANASHI, Masaya
Abstract: A temperature sensor includes a block body, a first thermocouple, and a second thermocouple. The first thermocouple includes a first strand, a second strand, a first insulator surrounding the first strand and the second strand, and a first metal sheath surrounding the first insulator. The second thermocouple includes a third strand, a fourth strand, a second insulator surrounding the third strand and the fourth strand, and a second metal sheath surrounding the second insulator. An end portion of each of the first thermocouple and the second thermocouple is buried in the block body.
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公开(公告)号：EP3370477A1
公开(公告)日：2018-09-05
申请号：EP16859467.9
申请日：2016-09-28
Applicant: NHK Spring Co., Ltd.
Inventor： HANAMACHI, Toshihiko , AIKAWA, Naoya
IPC: H05B3/74 , H01L21/02 , H01L21/3065 , H01L21/683 , H05B3/18
CPC classification number: H01L21/6831 , H01L21/02 , H01L21/3065 , H01L21/67017 , H01L21/67098 , H01L21/67103 , H05B3/18 , H05B3/28 , H05B3/74
Abstract: A heater unit having high in-plane temperature uniformity is provided. A heater unit includes a first heater part, a second heater part controlled independently of the first heater part, a base arranged with a groove in a region between the first heater part and the second heater part, and a cover part arranged at an opening end of the groove and providing a closed space with the groove. In addition, an insulating layer covering the first heater part and the second heater part, and an electrostatic chuck attached to the base via the insulating layer may be further included. In addition, the closed space provided by the cover part and the groove may be a vacuum.
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公开(公告)号：EP3612000A1
公开(公告)日：2020-02-19
申请号：EP18785237.1
申请日：2018-04-03
Applicant: NHK Spring Co., Ltd.
Inventor： HANAMACHI, Toshihiko , SEKIYA, Kenji , TAKAHARA, Go , AIKAWA, Naoya , KISARA, Yuta , TATSUMI, Arata
Abstract: A heater unit including a small diameter sheath heater with improved reliability is provided. The heater unit includes a first substrate and a second substrate joined together, a groove arranged on at least one join surface of the first substrate and the second substrate, and a sheath heater arranged inside the groove. The sheath heater includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a space within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the space, and connection terminals arranged at one end of the metal sheath, connection terminals electrically connected with both ends of the heating wire respectively.
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公开(公告)号：EP3115481B1
公开(公告)日：2018-10-03
申请号：EP15758220.6
申请日：2015-02-25
Applicant: NHK Spring Co., Ltd.
Inventor： TAKIMOTO, Masaru , YAMAUCHI, Yuichiro , HIRANO, Satoshi , AIKAWA, Naoya
IPC: C23C24/04
CPC classification number: C23C24/04
Abstract: For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.
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公开(公告)号：EP3375606A1
公开(公告)日：2018-09-19
申请号：EP16864329.4
申请日：2016-11-10
Applicant: NHK Spring Co., Ltd.
Inventor： AIKAWA, Naoya , HIRANO, Satoshi , YAMAUCHI, Yuichiro
IPC: B32B15/01 , B05D1/12 , B05D7/24 , B22F1/00 , B22F9/08 , B32B15/02 , B32B15/04 , B32B15/20 , C04B41/90 , C22C9/00
Abstract: To provide a laminate having a high heat dissipation effect, having no problem such as cracking of an insulating substrate even when a thermal load is applied, and having no void or the like in a metal film, and a method of manufacturing the laminate. A laminate according to the present invention includes an insulating substrate 10, an intermediate layer 50 formed on a surface of the substrate 10 and containing a metal or an alloy as a main component, and a circuit layer 20 that is a metal film formed of a copper powder having a hydrogen content of 0.002% by mass or less and laminated on the intermediate layer 50. In the laminate, an interface between the intermediate layer 50 and the circuit layer 20 is plastically deformed.
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Patent Agency Ranking
公开(公告)号：EP4501540A1
公开(公告)日：2025-02-05
申请号：EP23779143.9
申请日：2023-02-28
Applicant: NHK Spring Co., Ltd.
Inventor： FUJII, Masahiro , FUJINO, Daisuke , ARAKI, Yoshihito , AIKAWA, Naoya , FURUGORI, Nobuyuki , KASONO, Tomonori
Abstract: A polishing device according to an embodiment comprises: a supporting unit for supporting a polishing tool, a stage for holding an object to be polished; a first drive unit for causing the support unit and the stage to move relative to one another along a shape of a polishing surface, and a second drive unit for causing the support unit to rotate synchronously with the first drive unit such that one end of a polishing member attached to the polishing tool faces in a movement direction.
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公开(公告)号：EP3869909A1
公开(公告)日：2021-08-25
申请号：EP19873637.3
申请日：2019-10-01
Applicant: NHK Spring Co., Ltd.
Inventor： HANAMACHI, Toshihiko , TATSUMI, Arata , SEKIYA, Kenji , AIKAWA, Naoya , TAKANASHI, Masaya
Abstract: A heater comprises a folded heater wire, a first insulator provided on the folded heater wire, a metal sheath in contact with a part of the first insulator, a first insulating member arranged in parallel to a part of a first end of the folded heater wire taken out from a first end of the metal sheath, a second insulating member arranged in parallel to a part of the first insulating member and parallel to a part of a second end of the folded heater wire taken out from the first end of the metal sheath, a third insulating member arranged in parallel to a part of the first insulating member and the second insulating member, and bundle the first insulating member and the second insulating member, and a cylindrical member arranged in parallel to a part of the metal sheath and the third insulating member.
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公开(公告)号：EP3375606B1
公开(公告)日：2020-09-23
申请号：EP16864329.4
申请日：2016-11-10
Applicant: NHK Spring Co., Ltd.
Inventor： AIKAWA, Naoya , HIRANO, Satoshi , YAMAUCHI, Yuichiro
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公开(公告)号：EP3866565A1
公开(公告)日：2021-08-18
申请号：EP19870485.0
申请日：2019-10-01
Applicant: NHK Spring Co., Ltd.
Inventor： HANAMACHI, Toshihiko , TATSUMI, Arata , SEKIYA, Kenji , AIKAWA, Naoya , TAKANASHI, Masaya
Abstract: Disclosed is a stage including a first supporting plate, a second supporting plate under the first supporting plate, a shaft under the second supporting plate and overlapping with the first supporting plate and the second supporting plate, and at least one sheath heater passing through the second supporting plate. The at least one sheath heater is arranged so as to extend on a first surface and a second surface which are parallel to an upper surface of the second supporting plate and which are different in distance from the first supporting plate from each other.
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10.发明公开LAMINATE, AND METHOD FOR PRODUCING LAMINATE 审中-公开LAMINAT UND VERFAHREN ZUR HERSTELLUNG DES LAMINATS
公开(公告)号：EP3115481A1
公开(公告)日：2017-01-11
申请号：EP15758220.6
申请日：2015-02-25
Applicant: NHK Spring Co., Ltd.
Inventor： TAKIMOTO, Masaru , YAMAUCHI, Yuichiro , HIRANO, Satoshi , AIKAWA, Naoya
IPC: C23C24/08
CPC classification number: C23C24/04
Abstract: For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.
Abstract translation: 对于根据本发明的层压材料，通过加速含有0.002％至0.020重量％的磷的铜粉并通过加热到低于铜的熔点的温度进行还原处理来形成金属涂层 粉末，同时将铜粉末保持在固体状态下，将铜粉末喷涂到基材表面上，并将铜粉末沉积在基材上。
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