公开(公告)号：EP2530707B1

公开(公告)日：2018-11-14

申请号：EP12003853.4

申请日：2012-05-16

申请人： IXYS Semiconductor GmbH

发明人： Knoll, Heiko, Dipl.-Ing.

IPC分类号： H01L21/48 ,  H01L23/14 ,  H01L23/373 ,  C04B37/02

CPC分类号： C04B37/021 ,  C04B37/026 ,  C04B2235/656 ,  C04B2235/665 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/407 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/86 ,  H01L21/4846 ,  H01L23/147 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

公开(公告)号：EP3135653B1

公开(公告)日：2018-10-03

申请号：EP15783486.2

申请日：2015-04-16

申请人： Mitsubishi Materials Corporation

发明人： TERASAKI Nobuyuki ,  NAGATOMO Yoshiyuki

IPC分类号： C04B37/02 ,  B23K1/00 ,  B23K1/19 ,  B23K1/20 ,  H01L23/40 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  C22C9/00 ,  C22C9/01 ,  C22C12/00 ,  C22C13/00 ,  C22C21/00 ,  C22C24/00 ,  C22C28/00 ,  C22C9/02

CPC分类号： C04B37/026 ,  B23K1/00 ,  B23K1/19 ,  B23K1/20 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  B23K35/302 ,  C04B37/02 ,  C04B2237/124 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C22C9/00 ,  C22C9/01 ,  C22C9/02 ,  C22C12/00 ,  C22C13/00 ,  C22C21/00 ,  C22C24/00 ,  C22C28/00 ,  H01L23/40 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material containing Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together.

公开(公告)号：EP2008807B1

公开(公告)日：2018-08-29

申请号：EP08158706.5

申请日：2008-06-20

申请人： The Boeing Company

发明人： Lehman, Leanne L. ,  McCann, John R.

IPC分类号： B32B3/18 ,  B32B18/00

CPC分类号： B32B3/18 ,  B32B3/04 ,  B32B3/08 ,  B32B3/263 ,  B32B3/28 ,  B32B5/02 ,  B32B5/22 ,  B32B5/245 ,  B32B5/26 ,  B32B9/005 ,  B32B9/047 ,  B32B18/00 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/105 ,  B32B2266/02 ,  B32B2266/04 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2307/734 ,  B32B2605/18 ,  C04B2237/32 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/368 ,  Y10T428/17

摘要： A ceramic matrix composite structure (10) includes a load carrying fluted core (16) formed from a ceramic matrix composite. The fluted core (16) includes a plurality of nested flute members (18a, b) laminated between a pair of ceramic matrix composite facesheets (12, 14). The flute members (18a, b) are fabricated by wrapping ceramic resin fabric around a mandrel, curing the flute members (18a, b) and then removing the mandrels. The structure may include reinforced areas in which the facesheets (12, 14) are laminated directly together to receive fasteners for mounting the structure. The structure may include both flat and curved portions (Fig. 2).

公开(公告)号：EP3356078A1

公开(公告)日：2018-08-08

申请号：EP16826322.6

申请日：2016-12-21

申请人： Heraeus Deutschland GmbH & Co KG

发明人： ROGG, Alexander ,  WACKER, Richard

IPC分类号： B23K26/06 ,  B28D1/22 ,  B28D5/00 ,  B23K26/40 ,  H01L23/373 ,  B23K26/364 ,  C04B37/02 ,  C03B33/02 ,  C03B33/09

CPC分类号： B23K26/0626 ,  B23K26/364 ,  B23K26/40 ,  C03B33/0222 ,  C04B37/026 ,  C04B2235/665 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/704 ,  H01L21/4807 ,  H01L23/3735

摘要： The present invention relates to a method for the treatment of metallized ceramic substrates and to a metal-ceramic substrate obtained by said method.

公开(公告)号：EP3242106A4

公开(公告)日：2018-07-25

申请号：EP15875715

申请日：2015-12-30

申请人： KOLON INC

发明人： SIM JAE HYUNG

IPC分类号： F41H1/02 ,  B32B18/00 ,  B32B27/38 ,  B32B27/42 ,  F41H5/04

CPC分类号： F41H5/0428 ,  B32B7/00 ,  B32B18/00 ,  B32B27/38 ,  B32B27/42 ,  B32B2262/0269 ,  B32B2307/558 ,  B32B2363/00 ,  B32B2377/00 ,  B32B2571/02 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/365 ,  C04B2237/368 ,  F41H1/02 ,  F41H5/04

摘要： A bulletproof panel of the present invention includes: (i) a ceramic plate A; (ii) at least one phenol resin impregnated aramid fabric laminate C having phenol resin impregnated aramid fabrics C1, C2 and C3 which are laminated thereon; and (iii) an epoxy resin impregnated fabric B disposed between the ceramic plate A and the phenol resin impregnated aramid fabric laminate C, and impregnated with an epoxy resin. The phenol resin impregnated aramid fabrics C1, C2 and C3 may be aramid fabrics impregnated with a phenol resin, and aramid fabrics impregnated with a phenol/polyvinyl butyral mixture resin. In the present invention, since the epoxy resin impregnated fabric B is disposed between the ceramic plate A and the phenol resin impregnated aramid fabric laminate C to increase the adhesive strength therebetween, the ceramic plate A and the phenol resin impregnated aramid fabric laminate C are not delaminated from each other even under a high-temperature environment, and thereby greatly enhancing the bulletproof performance. Further, there is no need to insert thermoplastic adhesive films between the phenol resin impregnated aramid fabrics C1, C2 and C3 like in the prior art, and thereby greatly improving the workability.

公开(公告)号：EP3205636A4

公开(公告)日：2018-06-06

申请号：EP16758819

申请日：2016-02-24

申请人： IHI CORP ,  JAPAN FINE CERAM CENTER

发明人： NAKAMURA TAKESHI ,  TAMURA TAKASHI ,  KITAOKA SATOSHI ,  KAWASHIMA NAOKI

IPC分类号： C04B41/89 ,  B32B18/00 ,  C04B41/87 ,  F01D5/28

CPC分类号： C09D5/084 ,  C04B37/00 ,  C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2237/341 ,  C04B2237/368 ,  C04B2237/40 ,  F01D5/288 ,  F05D2300/2112 ,  F05D2300/2261 ,  F05D2300/2283 ,  F05D2300/6033 ,  Y02T50/672 ,  C04B35/565 ,  C04B35/806 ,  C04B41/4545 ,  C04B41/5067 ,  C04B41/5037

摘要： A coating used in a vapor-oxidative atmosphere has a first layer including SIALON and a second layer covering the first layer and being exposed to the atmosphere, the second layer including mullite, wherein the first layer and the second layer get in contact with each other.

公开(公告)号：EP2909153B1

公开(公告)日：2018-05-30

申请号：EP13789855.7

申请日：2013-10-16

申请人： Safran Aircraft Engines

发明人： PODGORSKI, Michael ,  MOLLIEX, Ludovic, Edmond, Camille

IPC分类号： C04B35/10 ,  C04B35/565 ,  C04B35/584 ,  B32B18/00 ,  C04B38/06 ,  F01D5/28 ,  C04B111/00

CPC分类号： F01D5/284 ,  B28B1/001 ,  B32B18/00 ,  C04B35/10 ,  C04B35/565 ,  C04B35/584 ,  C04B38/06 ,  C04B2111/00405 ,  C04B2235/665 ,  C04B2235/775 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/76 ,  F01D9/02 ,  C04B38/0074

公开(公告)号：EP3303259A1

公开(公告)日：2018-04-11

申请号：EP16724610.7

申请日：2016-05-13

申请人： Rogers Germany GmbH

发明人： MEYER, Andreas ,  BRITTING, Stefan ,  KNÖCHEL, Dieter ,  BIERWAGEN, David

IPC分类号： C04B37/02

CPC分类号： H05K1/0306 ,  C04B37/026 ,  C04B2237/12 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/407 ,  C04B2237/52 ,  C04B2237/708 ,  C04B2237/86

摘要： Method for producing a composite material (5), in particular for a circuit board, wherein the composite material (5) comprises a planar base material (1), in particular a ceramic, to which an additional layer (2), in particular a metallisation, is applied on one side or both sides by means of a solder layer (3), characterised by: - providing the base material (1), wherein the base material (1) has a first surface (A1) on at least one side; - providing the additional layer (2) and arranging the solder layer (3) between a second surface (A2) of the additional layer (2) and the first surface (A1) in such a way that when the additional layer (3) is deposited on the first surface (A1), the first surface (A1) of the base material (1) is covered by the solder layer (3) in a planar manner; wherein a thickness of the solder layer (3) between the base material (1) and the additional layer (2) is smaller than 12 µm, in particular smaller than 7 µm; - heating the base material (1) and the additional layer (2) arranged on the first surface (A1) to at least partially melt the solder layer (3) and connecting the base material (1) to the at least one additional layer (2).

公开(公告)号：EP3166140A4

公开(公告)日：2018-03-07

申请号：EP15814706

申请日：2015-06-30

申请人： MITSUBISHI MAT CORPORATION

发明人： OI SOTARO ,  OOHIRAKI TOMOYA

IPC分类号： H01L23/13 ,  C04B37/02 ,  H01L23/36 ,  H01L23/373 ,  H01L23/433 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L23/36 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/86 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/473 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/37147 ,  H01L2224/40137

摘要： In a power-module substrate unit 51, a circuit layer 12 is structured by a plurality of small circuit layers 12S; a ceramic substrate layer 11 is structured by at least one plate; the small circuit layers 12S are formed to have a layered structure having a first aluminum layer 15 bonded on one surface of the ceramic substrate layer 11 and a first copper layer 16 bonded on the first aluminum layer 15 by solid diffusion; a radiation plate 30 is made of copper or copper alloy; the metal layer 13 and the radiation plate 30 are bonded by solid diffusion, and a ratio (t1 × A1 × Ã1) / (t2 × A2 × Ã2) is not smaller than 0.80 and not larger than 1.20 where a thickness is t1 (mm), a bonding area is A1 (mm 2 ), and an yield stress is Ã1 (N/mm 2 ) of the first copper layer 16; a thickness at a bonding position to the metal layer is t2 (mm), a bonding area is A2 (mm 2 ), and an yield stress of the radiation plate 30 is Ã2 (N/mm 2 ).

公开(公告)号：EP3125286A4

公开(公告)日：2017-12-06

申请号：EP15767745

申请日：2015-03-26

申请人： KYOCERA CORP

发明人： KOMATSUBARA KENJI ,  ISHIKAWA KAZUHIRO ,  ABE YUUICHI ,  NAKAMURA KIYOTAKA

IPC分类号： H01L23/13 ,  C04B37/02

CPC分类号： H01L23/13 ,  C04B35/584 ,  C04B35/645 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3256 ,  C04B2235/5445 ,  C04B2235/785 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/52 ,  C04B2237/708 ,  H01L21/4807 ,  H01L23/15 ,  H01L25/07 ,  H01L2924/0002 ,  H01L2924/00

摘要： [Object] To provide a circuit board having high bonding strength and an electronic device including the circuit board. [Solution] A circuit board includes a circuit member located on one main surface of a ceramic substrate with a bonding layer therebetween, in which the bonding layer includes a mounting portion with the circuit member mounted thereon; and an exposed portion including voids on a surface thereof, and in which an average value of dispersion of distances between centers of gravity of the voids is 3 or more and 55 or less. The circuit board having the structure according to the present invention has high bonding strength between the ceramic substrate and the circuit member.