PROCEDE DE NETTOYAGE DE LA SURFACE D'UN SUBSTRAT DE SILICIUM
    21.
    发明公开
    PROCEDE DE NETTOYAGE DE LA SURFACE D'UN SUBSTRAT DE SILICIUM 有权
    清理方法在硅衬底的表面

    公开(公告)号:EP2471111A1

    公开(公告)日:2012-07-04

    申请号:EP10762742.4

    申请日:2010-08-23

    IPC分类号: H01L31/18 C30B33/12 C30B29/06

    摘要: The invention relates to a method for cleaning the surface of a silicon substrate, said surface being covered by a layer of silicon oxide. According to the invention, the method includes: a step of a) exposing said surface to a radiofrequency plasma, generated from a fluorinated gas, for stripping the silicon oxide layer and for inducing the adsorption of fluorinated elements on the surface of the silicon substrate, said exposure being performed for a duration of 60 to 900 seconds, the power density generated using the plasma being 10 mW/cm
    2 to 350 mW/cm
    2 , the fluorinated gas pressure being 10 mTorrs to 200 mTorrs, and the silicon substrate temperature being lower than or equal to 300°C; and a step b) of exposing said surface including the fluorinated elements to a hydrogen radiofrequency plasma, in order to remove said fluorinated elements from the substrate surface, said exposure being performed for a duration of 5 to 120 seconds, the power density generated using the plasma being 10 mW/cm
    2 to 350 mW/cm
    2 , the hydrogen pressure being 10 mTorrs to 1 Torr, and the silicon substrate temperature being lower than or equal to 300°C.