公开(公告)号：EP2294496A4

公开(公告)日：2014-03-26

申请号：EP09751558

申请日：2009-05-21

Applicant: ASETEK AS

Inventor： ALYASER MONEM H ,  RICE JEREMY A

IPC: G06F1/20 ,  F28D15/00 ,  F28D15/02 ,  F28F3/12 ,  G06F1/16 ,  H01L23/42 ,  H01L23/46 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K7/20254 ,  F28D15/00 ,  F28D15/02 ,  F28D2021/0019 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2633378A1

公开(公告)日：2013-09-04

申请号：EP10805292.9

申请日：2010-10-28

Applicant: Asetek A/S

Inventor： TOFTLOEKKE, Mikkel, Block ,  LYKKE, Peter ,  KRISTENSEN, Poul, Hove

IPC: G06F1/20

CPC classification number: G06F1/203 ,  G06F2200/201

Abstract: A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.

公开(公告)号：EP2633377A1

公开(公告)日：2013-09-04

申请号：EP10776016.7

申请日：2010-10-28

Applicant: Asetek A/S

Inventor： TOFTLOEKKE, Mikkel, Block ,  RATLIFF, Christopher ,  LYKKE, Peter ,  BERK, Todd ,  ERIKSEN, Andre, Sloth

IPC: G06F1/20

CPC classification number: G06F1/203 ,  G06F2200/201

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

公开(公告)号：EP2013675A4

公开(公告)日：2013-08-28

申请号：EP07776729

申请日：2007-05-04

Applicant: COOLIGY INC

Inventor： CONWAY BRUCE ,  BREWER RICHARD GRANT ,  TSAO PAUL ,  HOM JAMES ,  WERNER DOUGLAS E ,  ZHOU PENG ,  UPADHYA GIRISH ,  DATTA MADHAV ,  FIROUZI ALI ,  LANDRY FREDRIC

IPC: H05K7/20 ,  F28F7/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/40

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2593845A2

公开(公告)日：2013-05-22

申请号：EP11807469.9

申请日：2011-07-13

Applicant: Inertech IP LLC

Inventor： COSTAKIS, John ,  KEISLING, Earl ,  MCDONNELL, Gerald

IPC: G06F1/20 ,  H05K7/20

CPC classification number: H05K7/20818 ,  F28D1/0477 ,  F28D1/05383 ,  F28D2021/0028 ,  F28D2021/0068 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20827

Abstract: A system for cooling electronic equipment includes first and second heat exchangers and a condenser. The first exchanger is disposed in an airflow in thermal communication with electronic equipment and is configured to receive a cooling fluid at a first temperature. The first exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a second temperature. The second exchanger is disposed in the airflow between the first exchanger and the electronic equipment and is configured to receive the cooling fluid at the second temperature. The second exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a third temperature. The condenser is configured to receive the cooling fluid at the third temperature and is configured to enable heat transfer from the cooling fluid to a cooling source to cool the cooling fluid to the first temperature.

公开(公告)号：EP1782665B1

公开(公告)日：2013-01-16

申请号：EP05772152.4

申请日：2005-08-17

Applicant: Xylem IP Holdings LLC

Inventor： LAING, Karsten

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/473

CPC classification number: G06F1/26 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2239646A3

公开(公告)日：2011-09-28

申请号：EP10166627.9

申请日：2005-05-06

Applicant: Asetek A/S

Inventor： Eriksen, André Sloth

IPC: G06F1/20

CPC classification number: G06F1/206 ,  F04D15/0066 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20263 ,  H05K7/20272 ,  H01L2924/00

Abstract: The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging surface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.

公开(公告)号：EP2305016A1

公开(公告)日：2011-04-06

申请号：EP09777867.4

申请日：2009-08-13

Applicant: Airbus Operations GmbH

Inventor： ROERING, Sebastian

IPC: H05K7/20

CPC classification number: H05K7/20645 ,  G06F1/20 ,  G06F2200/201

Abstract: The invention relates to an aircraft signal computer system (10) comprising a plurality of modular signal computer units (12) and a liquid cooling device for cooling the modular signal computer units (12), wherein the liquid cooling device comprises a coolant line (16), which can be connected to a central liquid cooling system of an aircraft in order to feed a liquid coolant medium at a desired low temperature to the liquid cooling device, and wherein the coolant line (16) of the liquid cooling device is in thermal surface contact with the modular signal computer units (12) in order to dissipate heat from the modular signal computer units (12).

公开(公告)号：EP1448040B1

公开(公告)日：2011-01-12

申请号：EP04003191.6

申请日：2004-02-12

Applicant: Hitachi, Ltd.

Inventor： Ota, Shigemi, c/o Hitachi, Ltd., Int. Prop. Group ,  Matsushita, Shinji, c/o Hitachi, Ltd.,

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20781 ,  G06F2200/201

公开(公告)号：EP1710660A3

公开(公告)日：2010-11-03

申请号：EP06006968.9

申请日：2006-03-31

Applicant: HITACHI, LTD.

Inventor： Terakado, Shuichi Hitachi, Ltd IPG 12th Floor ,  Nishihara, Atsuo Hitachi, Ltd IPG 12th Floor ,  Ohashi, Shigeo Hitachi, Ltd IPG 12th Floor ,  Minamitani, Rintaro Hitachi, Ltd IPG 12th Floor ,  Naganawa, Takashi Hitachi, Ltd IPG 12th Floor

IPC: G06F1/20

CPC classification number: G06F1/203 ,  F28F3/12 ,  F28F13/06 ,  G06F2200/201

Abstract: The invention relates to a cooling jacket (100) for use in electronic apparatus having a heat-generating element (200) therein, for transmitting heat generated from the heat-generating element (200) into a liquid coolant flowing therein. The cooling jacket (100) comprises a cover (130) building up a heat transfer surface to be in contact with a surface of the heat-generating element (200), a passage (110) for the liquid coolant, which is formed neighboring the heat transfer surface and wound round in an "S"-like manner inside the main body (120) of the cooling jacket (100), and an inlet (111) and an outlet (112) attached at both ends of the flow passage for the liquid coolant, and further a dispersion member (150) is disposed in the flow passage, being built up by gathering a plural number of members (150), each of which has a "U"-like cross-section and an aspect ratio of 10 to 20, thereby diffusing the liquid coolant therein, so as to transfer the heat from the heat-generating element (200) thereto with high efficiency, and thereby enabling to cool down the heat-generating element (200), fully, even with a relatively small amount or volume of the liquid coolant.