公开(公告)号：EP4231796A3

公开(公告)日：2023-11-29

申请号：EP22206127.7

申请日：2017-08-28

申请人： Inertech IP LLC

发明人： ZHANG, Ming ,  NGUYEN, Ken ,  SHAPIRO, Doron ,  COSTAKIS, John

IPC分类号： H05K7/20 ,  F28D1/053 ,  F28D1/047 ,  F28F1/02 ,  F28D1/04 ,  G06F1/20 ,  F28D21/00 ,  F28F1/12 ,  F28F21/08 ,  F28F9/013

摘要： A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through the fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

公开(公告)号：EP2648496B1

公开(公告)日：2019-05-01

申请号：EP13173395.8

申请日：2011-06-23

申请人： Inertech IP LLC

发明人： Keisling, Earl ,  Costakis, John ,  McDonnell, Gerald

IPC分类号： H05K7/20

公开(公告)号：EP3504948A1

公开(公告)日：2019-07-03

申请号：EP17765313.6

申请日：2017-08-28

申请人： Inertech IP LLC

发明人： ZHANG, Ming ,  NGUYEN, Ken ,  SHAPIRO, Doron ,  COSTAKIS, John

IPC分类号： H05K7/20 ,  F28D1/053 ,  F28D1/047 ,  F28F1/02 ,  F28D1/04 ,  G06F1/20 ,  F28D21/00

公开(公告)号：EP2586281A2

公开(公告)日：2013-05-01

申请号：EP11764370.0

申请日：2011-06-23

申请人： Inertech IP LLC

发明人： KEISLING, Earl ,  COSTAKIS, John ,  McDONNELL, Gerald

IPC分类号： H05K7/20

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a shared fluid and electrical circuit section that is configured to connect to adjacent shared fluid and electrical circuit sections to form a shared fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒系统和节能冷却系统。 模块化数据盒系统包括中央自由冷却系统和多个模块化数据盒，每个模块化数据盒包括耦合到中央自由冷却系统的热交换组件和耦合到热交换组件的分布式机械冷却系统。 模块化数据盒包括具有布置成多边形形状的至少五个墙壁的数据外壳，以圆形或U形图案布置的多个计算机机架和用于产生热和冷通道的盖子，以及空气循环器 被配置为在热通道和冷通道之间连续地循环空气。 每个模块化数据盒还包括包含共享流体和电路部分的辅助外壳，其配置成连接到相邻的共享流体和电路部分，以形成连接到中央自由冷却系统的共用流体和电路。 辅助外壳包含分布式机械冷却系统的至少一部分，其被配置为修剪由中央自由冷却系统执行的冷却。

公开(公告)号：EP3210297A1

公开(公告)日：2017-08-30

申请号：EP15790397.2

申请日：2015-10-21

申请人： Inertech IP LLC

发明人： MONDAL, Subrata, K.

IPC分类号： H02M7/487

CPC分类号： H02M7/487 ,  H02J9/061 ,  H02M3/04 ,  H02M2007/53876

摘要： Control systems for a multi-level diode-clamped inverter and corresponding methods include a processor and a digital logic circuit forming a hybrid controller. The processor identifies sector and region locations based on a sampled reference voltage vector V* and angle θe*. The processor then selects predefined switching sequences and pre-calculated turn-on time values based on the identified sector and region locations. The digital logic circuit generates PWM switching signals for driving power transistors of a multi-level diode-clamped inverter based on the turn-on time values and the selected switching sequences. The control system takes care of the existing capacitor voltage balancing issues of multi-level diode-clamped inverters while supplying both active and reactive power to an IT load. Using the control system, one can generate a symmetrical PWM signal that fully covers the linear under-modulation region.

摘要翻译： 用于多级二极管钳位型逆变器的控制系统和相应的方法包括形成混合控制器的处理器和数字逻辑电路。 处理器基于采样的参考电压矢量V *和角度θe*来识别扇区和区域位置。 处理器然后基于所识别的扇区和区域位置来选择预定义的切换序列和预先计算的开启时间值。 数字逻辑电路基于导通时间值和选择的开关序列产生用于驱动多级二极管钳位型逆变器的功率晶体管的PWM开关信号。 该控制系统负责处理多级二极管钳位型逆变器的现有电容器电压平衡问题，同时向IT负载提供有功和无功功率。 使用该控制系统，可以生成完全覆盖线性欠调制区域的对称PWM信号。

公开(公告)号：EP2593845A2

公开(公告)日：2013-05-22

申请号：EP11807469.9

申请日：2011-07-13

申请人： Inertech IP LLC

发明人： COSTAKIS, John ,  KEISLING, Earl ,  MCDONNELL, Gerald

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： H05K7/20818 ,  F28D1/0477 ,  F28D1/05383 ,  F28D2021/0028 ,  F28D2021/0068 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20827

摘要： A system for cooling electronic equipment includes first and second heat exchangers and a condenser. The first exchanger is disposed in an airflow in thermal communication with electronic equipment and is configured to receive a cooling fluid at a first temperature. The first exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a second temperature. The second exchanger is disposed in the airflow between the first exchanger and the electronic equipment and is configured to receive the cooling fluid at the second temperature. The second exchanger enables heat transfer from the airflow to the cooling fluid to heat the cooling fluid to a third temperature. The condenser is configured to receive the cooling fluid at the third temperature and is configured to enable heat transfer from the cooling fluid to a cooling source to cool the cooling fluid to the first temperature.

公开(公告)号：EP4177543A1

公开(公告)日：2023-05-10

申请号：EP22208708.2

申请日：2013-10-09

申请人： Inertech IP LLC

发明人： McDonnell, Gerald ,  Keisling, Earl

IPC分类号： F25B41/00 ,  F25B25/00 ,  F25B5/04 ,  F25D17/02 ,  F25B23/00

摘要： The cooling systems and methods of the present disclosure relate to a plural in-series pumped liquid refrigerant trim evaporator cycle that may be incorporated into an existing cooling system to increase the efficiency of the existing cooling system. The cooling systems of the present disclosure include a first evaporator coil in thermal communication with an air intake flow to a heat load, such as a heat load being cooled by the existing cooling system, and a first liquid refrigerant distribution unit in thermal communication with the first evaporator coil. The cooling systems further includes a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in thermal communication with the air intake flow, and a second liquid refrigerant distribution unit in thermal communication with the second evaporator coil. A trim compression cycle of the second liquid refrigerant distribution unit is configured to incrementally further cool the air intake flow through the second evaporator coil when the temperature of the free-cooled first fluid flowing out of the main compressor of the second liquid refrigerant distribution unit exceeds a predetermined threshold temperature.

公开(公告)号：EP3852263A1

公开(公告)日：2021-07-21

申请号：EP21161509.1

申请日：2015-10-21

申请人： Inertech IP LLC

发明人： Mondal, Subrata

IPC分类号： H02M7/487

摘要： Control systems for a multi-level diode-clamped inverter and corresponding methods include a processor and a digital logic circuit forming a hybrid controller. The processor identifies sector and region locations based on a sampled reference voltage vector V* and angle θ e *. The processor then selects predefined switching sequences and pre-calculated turn-on time values based on the identified sector and region locations. The digital logic circuit generates PWM switching signals for driving power transistors of a multi-level diode-clamped inverter based on the turn-on time values and the selected switching sequences. The control system takes care of the existing capacitor voltage balancing issues of multi-level diode-clamped inverters while supplying both active and reactive power to an IT load. Using the control system, one can generate a symmetrical PWM signal that fully covers the linear under-modulation region.

公开(公告)号：EP2648496A3

公开(公告)日：2017-11-01

申请号：EP13173395.8

申请日：2011-06-23

申请人： Inertech IP LLC

发明人： Keisling, Earl ,  Costakis, John ,  McDonnell, Gerald

IPC分类号： H05K7/20

CPC分类号： H05K7/20827 ,  F25B49/00 ,  F25D17/00 ,  F28D15/00 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20818 ,  H01L2924/00

摘要： A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a shared fluid and electrical circuit section that is configured to connect to adjacent shared fluid and electrical circuit sections to form a shared fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

摘要翻译： 公开了一种节省空间的高密度模块化数据盒系统和高能效冷却系统。 模块化数据盒系统包括中央自由冷却系统和多个模块化数据盒，每个模块化数据盒包括耦合到中央自由冷却系统的热交换组件和耦合到热交换组件的分布式机械冷却系统。 模块化数据盒包括数据机箱，该数据机箱具有布置成多边形形状的至少五个壁，布置成圆形或U形图案的多个计算机机架以及用于形成冷热通道的盖，以及空气循环器 配置为在热通道和冷通道之间连续循环空气。 每个模块化数据盒还包括包含共享流体和电路部分的辅助外壳，该辅助外壳被配置为连接到相邻的共享流体和电路部分以形成连接到中央自由冷却系统的共享流体和电路。 辅助外壳包含分布式机械冷却系统的至少一部分，其被配置为修整由中央自由冷却系统执行的冷却。

公开(公告)号：EP2681978A1

公开(公告)日：2014-01-08

申请号：EP11826152.8

申请日：2011-12-28

申请人： Inertech IP LLC

发明人： KEISLING, Earl ,  COSTAKIS, John ,  MCDONNELL, Gerald

IPC分类号： H05K7/20

CPC分类号： H05K7/20745 ,  H05K7/20736 ,  H05K7/20781 ,  H05K7/20827 ,  Y10T29/49826

摘要： A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to position the first heat exchanger in heat transfer relationship with the at least one server. The first heat exchanger is not attached to the at least one server rack. The modular server rack cooling structure is also applied to a system that includes at least a first rack and at least a second rack disposed opposite from one another to form a hot aisle or a cold aisle. A method is disclosed for installing additional heat exchangers on the support structure of a modular server rack cooling structure to meet increased cooling capacity requirements without requiring additional space.

摘要翻译： 用于冷却数据中心组件的至少一个服务器机架中的至少一个服务器的模块化服务器机架冷却结构包括至少第一支撑构件和至少第一热交换器。 第一热交换器联接到第一支撑构件，其被构造成将第一热交换器定位成与至少一个服务器成热传递关系。 第一热交换器不连接到至少一个服务器机架。 模块化服务器机架冷却结构还应用于至少包括第一机架和至少第二机架的系统，所述至少第二机架彼此相对布置以形成热通道或冷通道。 公开了一种用于在模块化服务器机架冷却结构的支撑结构上安装附加热交换器以满足增加的冷却能力需求而不需要额外空间的方法。