-
公开(公告)号:EP3783079B1
公开(公告)日:2023-06-07
申请号:EP19789470.2
申请日:2019-04-15
发明人: HAYASHI, Miyuki , KITA, Ai , TSUKAMOTO, Masaya
IPC分类号: C09J133/02 , C08F20/18 , C08F22/00 , C09J11/08 , C09J167/00 , C09J201/08 , C09J105/00
-
公开(公告)号:EP3428599B1
公开(公告)日:2023-06-07
申请号:EP17763448.2
申请日:2017-03-10
发明人: UEDA, Saori , YAMADA, Yasuyuki
IPC分类号: G01L9/00 , C09J11/00 , C09J11/08 , C09J183/04 , H01L29/84 , C09J171/02
-
公开(公告)号:EP3750964B1
公开(公告)日:2023-05-31
申请号:EP19840224.0
申请日:2019-07-29
发明人: KANG, Seongwook , KWON, Yoonkyung , PARK, Byungsu , LEE, Hui Je , HAN, Sanghun
IPC分类号: C09J133/08 , C09J7/40 , C09J7/20 , C08L83/04 , C09J11/08 , C09J133/10 , C08F230/08 , C09J139/06 , C09J133/06 , C08F290/06
-
公开(公告)号:EP3750965B1
公开(公告)日:2023-05-24
申请号:EP19841360.1
申请日:2019-07-29
发明人: KANG, Seongwook , KWON, Yoonkyung , PARK, Byungsu , LEE, Hui Je , HAN, Sanghun
IPC分类号: C09J133/08 , C09J133/10 , C09J11/08 , C08L83/04 , C09J7/20 , C09J7/40 , H01L51/50 , C08F230/08 , C09J139/06
-
公开(公告)号:EP4177321A1
公开(公告)日:2023-05-10
申请号:EP21833533.9
申请日:2021-06-30
IPC分类号: C09J11/08 , C09J153/02 , G09F3/04 , G09F3/10 , C09J7/38
摘要: The present invention provides a label having excellent barrier property and transparency, wherein contamination of the container and adhesive residue due to the residual monomer in the adhesive layer are suppressed. The label is a label that is used for shrink-wrapping a container body of a resin container by wrapping around a barrel of the container body and heat-shrinking the shrinkable label, wherein the label comprises at least one heat shrinkable base material, a transparent vapor-deposited film consisting of an inorganic oxide, and an adhesive layer, and the adhesive layer comprises an adhesive composition comprising a triblock copolymer having a block structure of segment A1-segment B-segment A2.
-
26.
公开(公告)号:EP4144808A1
公开(公告)日:2023-03-08
申请号:EP21797814.7
申请日:2021-04-22
发明人: MUTO, Mitsuo , SUGO, Michihiro , TAGAMI, Shohei
IPC分类号: C09J5/00 , C09J11/08 , C09J183/04 , C09J183/05 , C09J183/06 , H01L21/304 , C09J7/30
摘要: The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin composition that contains a non-functional organopolysiloxane; a wafer processed body; and a method for producing a thin wafer, said method using a temporary adhesive for wafer processing.
-
公开(公告)号:EP3019572B1
公开(公告)日:2022-10-05
申请号:EP14750042.5
申请日:2014-07-11
IPC分类号: C09J11/08 , C09J123/08 , C09J153/02
-
公开(公告)号:EP3940036A3
公开(公告)日:2022-08-03
申请号:EP21184411.3
申请日:2021-07-08
发明人: TANIGUCHI, Naoki , TSUJI, Mikako
IPC分类号: C09J11/08 , C09J153/00 , C09J201/00 , C09J7/38
摘要: Problem to be solved:
Provided is a material for a pressure-sensitive adhesive which has a high adhesive strength and is capable of forming a pressure-sensitive adhesive layer excellent in film appearance.
Solution:
The material for a pressure-sensitive adhesive contains composition C in a particulate form including thermoplastic elastomer A, and composition F in a particulate form including thermoplastic elastomer D and tackifier E, wherein the condition (2) is satisfied, an adhesive strength of the material for a pressure-sensitive adhesive is larger than that of the composition C and the composition F, wherein x represents a mass ratio (thermoplastic elastomer(s) / thermoplastic elastomer(s) + tackifier(s)) of the material for a pressure-sensitive adhesive; α represents a mass ratio (thermoplastic elastomer(s) / thermoplastic elastomer(s) + tackifier(s)) of the composition C; and β represents a mass ratio (thermoplastic elastomer(s) / thermoplastic elastomer(s) + tackifier(s)) of the composition F, and the material for a pressure-sensitive adhesive satisfies the expression (1) and the condition (13): β a ratio of the total mass of the tackifier(s) to the total mass of the thermoplastic elastomer(s) in the composition F is more than 1.5 and 3.0 or less; a ratio of the MFR value of the composition F to the MFR value of the composition C is 10 or more and 100 or less.-
公开(公告)号:EP4011616A1
公开(公告)日:2022-06-15
申请号:EP20850554.5
申请日:2020-07-28
发明人: SOEJIMA Kazuki , NAKAO Kota
IPC分类号: B32B27/00 , C09J11/08 , C09J201/00 , C09J7/38
摘要: The present invention provides a pressure-sensitive adhesive tape, including: a base material; and a pressure-sensitive adhesive layer arranged on at least one side of the base material, wherein the pressure-sensitive adhesive layer contains thermally expandable microspheres and a pressure-sensitive adhesive, wherein the thermally expandable microspheres are each formed of a shell and a volatile substance contained inside the shell, and wherein a resin forming the shell contains a constituent unit having a carboxyl group. In one embodiment, the resin forming the shell has a glass transition temperature (Tg) of 120°C or more.
-
公开(公告)号:EP3542646B1
公开(公告)日:2022-06-08
申请号:EP19164267.7
申请日:2019-03-21
发明人: MAZOYER, Jacques Andre Christian , AGODA-TANDJAWA, Gueba , LOAEC, Aurelie , LEROY, Helene Christelle Odette
IPC分类号: A23L29/256 , A23L29/212 , A23L29/238 , A23L29/244 , A23L29/269 , A23C9/154 , A23K20/163 , C09J11/08 , A61K8/02 , A61K8/9706 , A61Q5/02 , A61Q19/00 , A61Q19/10
-
-
-
-
-
-
-
-
-