摘要:
A method for preparing a liquid jet recording head (7) which is to be used for generating heat energy to be utilized for discharging ink by applying electrical signals, having an electricity-heat energy convertor (13) comprising a heat-generating resistor and a pair of electrodes for applying electrical signals on said heat-generating resistor, comprises the process of aging according to the heating treamtnet of said heat-generating resistor which generates heat from said heat-generating resistor by applying electrical signals from said electrodes enough to stabilize the resistance value of said heat-generating resistor (13) through the action of heating by the heat generation.
摘要:
Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member (10) between the flex circuit and printhead, with the lead frame member (10) having plurality of conductive leads or fingers (14) extending at a predetermined angle ⊖ with respect to the final plane of interconnection. During the interconnection process, these leads or fingers (14) are spring biased through this predetermined angle to provide good compressive electrical contact between the two members interconnected by the lead frame (10) in a single plane of interconnection.
摘要:
The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous metal resistor, including an insulated substrate and a resistor applied to the insulated substrate. The resistor can include from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron; and from 5 atomic % to 90 atomic % each of a first and second metal of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, where the second metal is different than the first metal. The metalloid, the first metal, and the second metal can account for at least 70 atomic % of the amorphous thin metal film.
摘要:
A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening.
摘要:
The present invention relates to an ink-jet print head able to resist to chemically aggressive solvent-based inks, and to a process for the manufacturing thereof, the ink-jet print head comprising a polymeric material layer defining ink passage ways formed on a substrate, said polymeric material layer being formed by curing a curable resin composition comprising a cyclic aromatic di-functional epoxy resin, a cyclic aliphatic di-functional epoxy resin and a polymerization initiator. The invention also relates to an improved curable resin composition.
摘要:
A method of forming a component for a droplet deposition apparatus,includes the steps of: providing a protection material so as to fill fluid chambers and; directing a high-powered laser at the component so as to ablate an array of nozzles communicating with respective filter chambers. The protection material acts to inhibit damage to the walls of the chamber during ablation, such as damage to the interior passivation coating, or electrodes provided on the walls of the chamber, and can be removed for example by flushing with a heated solvent.
摘要:
Process for protectively coating against aggressive liquids hydraulic microcircuits made in a resin (32), particularly for an ink jet printhead, consisting of: a9 disposing of a silicon substrate (20) comprising a sacrificial layer (26) of copper, deposited on the substrate and defining the inner shape of the hydraulic microcircuits (35, 36, 37); b) depositing on top of the outer surface of the sacrificial layer (26), by means of an electrochemical process, at least one protective, metallic coating layer (30); c) applying on the sacrificial layer (26) a non-photosensitive epoxy or polyamide resin (32), having a predetermined thickness and suitable for completely covering the sacrificial layer (26); d) effecting a polymerization of the resin (32) to increase its mechanical resistance to mechanical and thermal stresses and performing a planarization of the outer surface (33) of the resin (32), by means of a mechanical lapping and simultaneous chemical treatment; e) removing the sacrificial layer (26) through a chemical etching, in a highly acid bath; f) depositing a metallic, protective layer (39) on the outer surface (33) of the resin (32), through vacuum evaporation.
摘要:
A printhead assembly comprising the printhead and filters intended for use with the printhead is passivated by passing a gaseous coating such as Parylene through the assembly. In this way dirt particles created during manufacture of the printhead are encapsulated and thus prevented from blocking the nozzles. The printhead assembly is also prevented from interacting physically or chemically with ink flowing through the printhead.
摘要:
Since the same water-repellent process is provided on the nozzle forming part and the outer circumferential part of the nozzle formation member, same process as for the nozzle forming part is needed for the outer circumferential part which is not limited for its structural demand thereby the manufacturing process is complicated and needs high cost. The first water-repellent layer 41 due to the first water-repellent process is formed on the surface of the nozzle forming part 31 formed the nozzle 4 of the surface of the nozzle plate 2, and the second water-repellent layer 42 due to the second water-repellent process different from the first water-repellent process is formed on the surface of the outer circumferential part (outer portion of surface) of the nozzle plate 2. Materials and processes, in which the second water- repellent layer can be formed using simple manufacturing process, can be selected for the second water-repellent process.