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    HEAD CHIP, LIQUID JET HEAD, AND LIQUID JET RECORDING DEVICE
    2.
    发明公开
    HEAD CHIP, LIQUID JET HEAD, AND LIQUID JET RECORDING DEVICE 审中-公开

    公开(公告)号：EP4382300A1

    公开(公告)日：2024-06-12

    申请号：EP23214563.1

    申请日：2023-12-06

    Applicant: SII Printek Inc.

    Inventor： NISHIKAWA, Daichi ,  KOYANO, Takanori

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14209 ,  B41J2202/1220130101 ,  B41J2/1609 ,  B41J2/1632 ,  B41J2002/1449120130101 ,  B41J2/1623 ,  B41J2/1642 ,  B41J2002/1441920130101 ,  B41J2002/1436220130101

    Abstract: A head chip (51A) according to an aspect of the present disclosure includes an ejection section (61, 62), a jet hole plate (53), a return plate (52), a flow channel plate (120), and a protective film (125). A communication channel (110) includes an upstream opening (115) communicated with a channel opening which opens toward a first side in a first direction in a jet channel, a downstream opening (116) communicated with a manifold opening which opens toward the first side in the first direction in the manifold (123), and a connecting part (117) which extends in a third direction, and which is configured to connect the upstream opening and the downstream opening to each other. The return plate is bonded to the ejection section so that at least a part of an opening edge (115a-d) in the upstream opening is arranged at an outer side when viewed from the first direction with respect to an opening edge (71c, 71d) of the channel opening.

    LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC DEVICE
    3.
    发明授权
    LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC DEVICE 有权

    公开(公告)号：EP3002126B1

    公开(公告)日：2018-10-17

    申请号：EP15187637.2

    申请日：2015-09-30

    Applicant: Seiko Epson Corporation

    Inventor： YAZAKI, Shiro

    IPC: B41J2/16 ,  B41J2/14

    CPC classification number: B41J2/14233 ,  B41J2/14 ,  B41J2/14201 ,  B41J2/14274 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2002/14241 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/11

    Abstract: A liquid ejecting head (1) includes a flow channel forming substrate (10) that is provided with a space constituting a pressure generating chamber (12) which communicates with nozzle openings (21), a vibration plate (50) that is stacked on one surface of the flow channel forming substrate and seals the space, and a piezoelectric element (300) that includes a first electrode (60), a piezoelectric layer (70), and a second electrode (80) sequentially stacked on a surface of the vibration plate opposite to the flow channel forming substrate, in which the first electrode is formed, in which at least a width of a first direction along the opposite surface is narrower than the space in a region corresponding to the space, the piezoelectric layer is stacked so as to overlap the first electrode and at least a part of the vibration plate in the region corresponding to the space, the second electrode is stacked so as to overlap the piezoelectric layer in the region corresponding to the space, and as a thickness of a stacked direction of the piezoelectric element is a thickness of the piezoelectric layer, a first thickness (D1) of the piezoelectric layer of a part positioned on the first electrode and a second thickness (D2) of the piezoelectric layer of a part positioned on the vibration plate satisfy a relationship of the first thickness (D1) > the second thickness (D2).

    STRUCTURE MANUFACTURING METHOD AND LIQUID DISCHARGE HEAD SUBSTRATE MANUFACTURING METHOD
    6.
    发明公开
    STRUCTURE MANUFACTURING METHOD AND LIQUID DISCHARGE HEAD SUBSTRATE MANUFACTURING METHOD 审中-公开

    公开(公告)号：EP2493809A4

    公开(公告)日：2018-03-07

    申请号：EP11732787

    申请日：2011-01-13

    Applicant: CANON KK

    Inventor： TERASAKI ATSUNORI ,  KUBOTA MASAHIKO ,  KANRI RYOJI ,  FUKUMOTO YOSHIYUKI

    IPC: B81C1/00 ,  B41J2/16

    CPC classification number: B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1642

    Abstract: A method for processing a silicon substrate includes providing a combination of a first silicon substrate, a second silicon substrate, and an intermediate layer including a plurality of recessed portions, which is provided between the first silicon substrate and the second silicon substrate, forming a first through hole that goes through the first silicon substrate by executing etching of the first silicon substrate on a surface of the first silicon substrate opposite to a bonding surface with the intermediate layer by using a first mask, and exposing a portion of the intermediate layer corresponding to the plurality of recessed portions of the intermediate layer, forming a plurality of openings on the intermediate layer by removing a portion constituting a bottom of the plurality of recessed portions, and forming a second through hole that goes through the second silicon substrate by executing second etching of the second silicon substrate by using the intermediate layer on which the plurality of openings are formed as a mask.

    PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, MANUFACTURING METHOD OF PIEZOELECTRIC DEVICE, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD
    7.
    发明公开
    PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, MANUFACTURING METHOD OF PIEZOELECTRIC DEVICE, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD 审中-公开
    压电装置，液体喷射头，压电装置的制造方法以及液体喷射头的制造方法

    公开(公告)号：EP3230066A1

    公开(公告)日：2017-10-18

    申请号：EP15804628.4

    申请日：2015-11-17

    Applicant: Seiko Epson Corporation

    Inventor： YOSHIIKE, Masashi

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14233 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2002/14491 ,  H01L41/047 ,  H01L41/312

    Abstract: A piezoelectric device includes a first substrate that includes a piezoelectric element (32) provided in a first region where bending deformation is allowed and an electrode layer (39) electrically connected to the piezoelectric element (32), a second substrate in which a bump electrode (43) abutting and conducting the electrode layer (39), and having elasticity is formed, and which is disposed so as to face the piezoelectric element (32) with a predetermined space, and adhesive (43) that bonds the first substrate and the second substrate in a state where a distance between the first substrate and the second substrate is maintained. The adhesive (43) has a width in a center portion in a height direction relative to a surface of the first substrate or the second substrate greater than a width in end portions in the same direction.

    Abstract translation: 一种压电器件，包括：第一基板，其包括设置在允许弯曲变形的第一区域中的压电元件（32）和电连接到压电元件（32）的电极层（39）;第二基板，其中凸点电极 （43），其与所述电极层（39）抵接并导通，形成具有弹性的与所述压电元件（32）隔开规定的间隔地配置的粘接剂（43）;以及粘接所述第一基板和所述第二基板 在保持所述第一基板和所述第二基板之间的距离的状态下保持所述第二基板。 粘合剂（43）在相对于第一基板或第二基板的表面的高度方向上的中央部分中的宽度大于在相同方向上的端部中的宽度。

    INK JET HEAD
    8.
    发明公开
    INK JET HEAD 审中-公开

    公开(公告)号：EP3210780A3

    公开(公告)日：2017-09-13

    申请号：EP17152261.8

    申请日：2017-01-19

    Applicant: Toshiba TEC Kabushiki Kaisha

    Inventor： SEKI, Masashi

    IPC: B41J2/14

    CPC classification number: B41J2/14209 ,  B41J2/1606 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2002/14491

    Abstract: An ink jet head (10) includes a base (15), walls (18) attached to the base and defining flow paths (51,52) between the walls, the flow paths including first and second flow paths alternating with one another, a nozzle plate (16) comprising openings (25), each of which communicates with one of the first flow paths, an ink supply unit (12) fluidly coupled to the first flow paths, electrodes (28) on side surfaces of the walls, first and second wirings (35), each extending along the base and each being individually connected to one of the electrodes, a plurality of first protective layers (54) on the base, the first wiring extending between a first pair of the first protective layers and the second wiring extending between a second pair of the first protective layers, and a second protective layer (56) comprising an electrically insulating layer covering the first protective layers and the first and second wirings.

    THERMAL INKJET PRINTHEAD STACK WITH AMORPHOUS METAL RESISTOR
    9.
    发明公开
    THERMAL INKJET PRINTHEAD STACK WITH AMORPHOUS METAL RESISTOR 审中-公开
    THERMOTINTENSTRAHLDRUCKKOPFSTAPEL MIT AMORPHEM METALLWIDERSTAND

    公开(公告)号：EP2978608A4

    公开(公告)日：2017-08-30

    申请号：EP13889243

    申请日：2013-07-12

    Applicant: HEWLETT-PACKARD DEV COMPANY L P

    Inventor： ABBOTT JR JAMES ELMER ,  PUGLIESE ROBERTO A ,  LONG GREG SCOTT

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14129 ,  B41J2/14016 ,  B41J2/14088 ,  B41J2/14112 ,  B41J2/1601 ,  B41J2/164 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2202/03 ,  B41J2202/11 ,  H01L27/11582 ,  H01L28/00

    Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous metal resistor, including an insulated substrate and a resistor applied to the insulated substrate. The resistor can include from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron; and from 5 atomic % to 90 atomic % each of a first and second metal of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum, where the second metal is different than the first metal. The metalloid, the first metal, and the second metal can account for at least 70 atomic % of the amorphous thin metal film.

    Abstract translation: 本发明涉及一种具有非晶金属电阻器的热喷墨打印头堆叠，其包括绝缘衬底和施加到绝缘衬底的电阻器。 电阻器可以包括5原子％至90原子％的碳，硅或硼的准金属; 以及钛，钒，铬，钴，镍，锆，铌，钼，铑，钯，铪，钽，钨，铱或铂的第一金属和第二金属各自5原子％至90原子％，其中 第二种金属与第一种金属不同。 准金属，第一金属和第二金属可以占非晶薄金属膜的至少70原子％。

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