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    LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC DEVICE
    1.
    发明授权
    LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND PIEZOELECTRIC DEVICE 有权

    公开(公告)号：EP3002126B1

    公开(公告)日：2018-10-17

    申请号：EP15187637.2

    申请日：2015-09-30

    Applicant: Seiko Epson Corporation

    Inventor： YAZAKI, Shiro

    IPC: B41J2/16 ,  B41J2/14

    CPC classification number: B41J2/14233 ,  B41J2/14 ,  B41J2/14201 ,  B41J2/14274 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/1612 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2002/14241 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/11

    Abstract: A liquid ejecting head (1) includes a flow channel forming substrate (10) that is provided with a space constituting a pressure generating chamber (12) which communicates with nozzle openings (21), a vibration plate (50) that is stacked on one surface of the flow channel forming substrate and seals the space, and a piezoelectric element (300) that includes a first electrode (60), a piezoelectric layer (70), and a second electrode (80) sequentially stacked on a surface of the vibration plate opposite to the flow channel forming substrate, in which the first electrode is formed, in which at least a width of a first direction along the opposite surface is narrower than the space in a region corresponding to the space, the piezoelectric layer is stacked so as to overlap the first electrode and at least a part of the vibration plate in the region corresponding to the space, the second electrode is stacked so as to overlap the piezoelectric layer in the region corresponding to the space, and as a thickness of a stacked direction of the piezoelectric element is a thickness of the piezoelectric layer, a first thickness (D1) of the piezoelectric layer of a part positioned on the first electrode and a second thickness (D2) of the piezoelectric layer of a part positioned on the vibration plate satisfy a relationship of the first thickness (D1) > the second thickness (D2).

    PROCESS FOR FILLING ETCHED HOLES
    5.
    发明公开
    PROCESS FOR FILLING ETCHED HOLES 审中-公开
    填充蚀刻孔的过程

    公开(公告)号：EP3259134A1

    公开(公告)日：2017-12-27

    申请号：EP16702736.6

    申请日：2016-02-03

    Applicant: Memjet Technology Limited

    Inventor： NORTH, Angus ,  O'REILLY, Ronan ,  MCAVOY, Gregory

    IPC: B41J2/16 ,  B81C1/00

    CPC classification number: B81C1/00611 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1645 ,  B81B2201/052 ,  B81B2203/0353 ,  B81C2201/0104 ,  B81C2201/0121

    Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole; (ii) reflowing the first polymer; (iii) exposing the wafer substrate to a controlled oxidative plasma; (iv) optionally repeating steps (i) to (iii); (v) depositing a layer of a photoimageable second polymer; (vi) selectively removing the second polymer from regions outside a periphery of the holes using exposure and development; and (vii) planarizing the frontside surface to provide holes filled with a plug comprising the first and second polymers, which are different than each other. Each plug has a respective upper surface coplanar with the frontside surface.

    PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, MANUFACTURING METHOD OF PIEZOELECTRIC DEVICE, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD
    6.
    发明公开
    PIEZOELECTRIC DEVICE, LIQUID EJECTING HEAD, MANUFACTURING METHOD OF PIEZOELECTRIC DEVICE, AND MANUFACTURING METHOD OF LIQUID EJECTING HEAD 审中-公开
    压电装置，液体喷射头，压电装置的制造方法以及液体喷射头的制造方法

    公开(公告)号：EP3230066A1

    公开(公告)日：2017-10-18

    申请号：EP15804628.4

    申请日：2015-11-17

    Applicant: Seiko Epson Corporation

    Inventor： YOSHIIKE, Masashi

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14233 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2002/14491 ,  H01L41/047 ,  H01L41/312

    Abstract: A piezoelectric device includes a first substrate that includes a piezoelectric element (32) provided in a first region where bending deformation is allowed and an electrode layer (39) electrically connected to the piezoelectric element (32), a second substrate in which a bump electrode (43) abutting and conducting the electrode layer (39), and having elasticity is formed, and which is disposed so as to face the piezoelectric element (32) with a predetermined space, and adhesive (43) that bonds the first substrate and the second substrate in a state where a distance between the first substrate and the second substrate is maintained. The adhesive (43) has a width in a center portion in a height direction relative to a surface of the first substrate or the second substrate greater than a width in end portions in the same direction.

    Abstract translation: 一种压电器件，包括：第一基板，其包括设置在允许弯曲变形的第一区域中的压电元件（32）和电连接到压电元件（32）的电极层（39）;第二基板，其中凸点电极 （43），其与所述电极层（39）抵接并导通，形成具有弹性的与所述压电元件（32）隔开规定的间隔地配置的粘接剂（43）;以及粘接所述第一基板和所述第二基板 在保持所述第一基板和所述第二基板之间的距离的状态下保持所述第二基板。 粘合剂（43）在相对于第一基板或第二基板的表面的高度方向上的中央部分中的宽度大于在相同方向上的端部中的宽度。

    METHOD FOR MANUFACTURING LIQUID JETTING APPARATUS AND LIQUID JETTING APPARATUS
    10.
    发明公开
    METHOD FOR MANUFACTURING LIQUID JETTING APPARATUS AND LIQUID JETTING APPARATUS 审中-公开
    VERFAHREN ZUR HERSTELLUNG EINERFLÜSSIGKEITSSTRAHLVORRICHTUNGSOWIEFLÜSSIGKEITSSTRAHLVORRICHTUNG

    公开(公告)号：EP2979872A1

    公开(公告)日：2016-02-03

    申请号：EP15178691.0

    申请日：2015-07-28

    Applicant: Brother Kogyo Kabushiki Kaisha

    Inventor： HIRAI, Keita

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14233 ,  B41J2/161 ,  B41J2/1626 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2002/14491

    Abstract: A method for manufacturing a liquid jetting apparatus, which is provided with: a flow passage formation member including a pressure chamber; and a piezoelectric actuator having a vibration film provided on the flow passage formation member, a piezoelectric film arranged on the vibration film to correspond to the pressure chamber, first and second electrodes arranged on different surfaces of the piezoelectric film, a first protective film covering the piezoelectric film, a wire connected to the second electrode, and a second protective film covering the wire, includes: forming a first protective film on the vibration film to cover the piezoelectric film and the second electrode; forming the wire and the second protective film to cover the wire with the first protective film covering the piezoelectric film and the second electrode; and removing a part, of the first protective film, that overlaps with the second electrode, after forming the second protective film.

    Abstract translation: 一种液体喷射装置的制造方法，其特征在于，具备：具有压力室的流路形成部件; 以及压电致动器，其具有设置在所述流路形成部件上的振动膜，配置在所述振动膜上以对应于所述压力室的压电膜，布置在所述压电膜的不同表面上的第一和第二电极，覆盖所述压电膜的第一保护膜 压电膜，连接到第二电极的线和覆盖线的第二保护膜，包括：在振动膜上形成第一保护膜以覆盖压电膜和第二电极; 形成所述导线和所述第二保护膜，以覆盖所述第一保护膜覆盖所述导线，所述第一保护膜覆盖所述压电膜和所述第二电极; 以及在形成所述第二保护膜之后，除去与所述第二电极重叠的所述第一保护膜的一部分。

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