公开(公告)号：EP2860830A1

公开(公告)日：2015-04-15

申请号：EP13188545.1

申请日：2013-10-14

申请人： Camlin Technologies (Switzerland) Limited

发明人： Fill, Matthias ,  Felder, Feridnand ,  Zogg, Hans ,  Meier, Oliver

IPC分类号： H01S5/022 ,  H01S5/04 ,  H01S5/183 ,  H01S5/14 ,  H01S5/30 ,  H01S5/024

CPC分类号： H01S5/022 ,  H01S5/0222 ,  H01S5/02296 ,  H01S5/02415 ,  H01S5/041 ,  H01S5/14 ,  H01S5/183 ,  H01S5/3022 ,  H01S2301/163

摘要： The present invention relates to a first container (1) with an internal space (3) for accommodating a vertical external cavity surface emitting laser device (50). Said first container (1) hermetically seals said internal space (3) from an external space (4), wherein said first container (1) has at least one wall with at least one first through-opening (23). Said at least one first through-opening (23) is adapted for passage of an optical pump beam (7) from the external space (4) into the internal space (3), and/or for passage of a laser emission beam (8) from the internal space (3) into the external space (4). Moreover, said at least one first through-opening (23) is hermetically sealed by a sealing mirror (21), wherein said sealing mirror (21) is adapted to form an external cavity (2) of the vertical external cavity surface emitting laser device (50) with a second mirror (22) in the internal space (3). Furthermore, the present invention relates to laser device with such a first container and to an assembly method of the laser device.

摘要翻译： 本发明涉及具有用于容纳垂直外腔表面发射激光装置（50）的内部空间（3）的第一容器（1）。 所述第一容器（1）将所述内部空间（3）从外部空间（4）密封，其中所述第一容器（1）具有至少一个具有至少一个第一通孔（23）的壁。 所述至少一个第一通孔（23）适于使光泵浦光束（7）从外部空间（4）进入内部空间（3），和/或使激光发射光束（8）通过 ）从内部空间（3）进入外部空间（4）。 此外，所述至少一个第一通孔（23）由密封反射镜（21）气密地密封，其中所述密封反射镜（21）适于形成垂直外腔表面发射激光装置的外部空腔（2） （50）在内部空间（3）中具有第二反射镜（22）。 此外，本发明涉及具有这种第一容器的激光装置和激光装置的组装方法。

公开(公告)号：EP2822114A2

公开(公告)日：2015-01-07

申请号：EP14173975.5

申请日：2014-06-25

申请人： CANON KABUSHIKI KAISHA

发明人： Nagatomo, Yasuhiro

IPC分类号： H01S5/14 ,  H01S5/183

CPC分类号： G01B9/02091 ,  H01S5/0222 ,  H01S5/141 ,  H01S5/18366

摘要： A surface emitting laser operable to change a wavelength of emitted light includes, a first reflecting mirror (110), a second reflecting mirror (100), wherein a cavity is formed between the first reflecting mirror and the second reflecting mirror along the optical axis of the surface emitting laser, an active layer (120) formed within the cavity, a region (130) formed within the cavity, and a movable part (140) situated within the region (130), the movable part having a refractive index different from a refractive index of the region (130). The wavelength of emitted light is changeable by changing the position of the movable part (140) along the direction of the optical axis in the region (130).

摘要翻译： 可操作以改变发射光的波长的表面发射激光器包括：第一反射镜（110），第二反射镜（100），其中在第一反射镜和第二反射镜之间沿着光轴 所述表面发射激光器，形成在所述空腔内的有源层（120），形成在所述空腔内的区域（130）以及位于所述区域（130）内的可移动部分（140），所述可移动部分的折射率不同于 所述区域（130）的折射率。 发射光的波长可以通过沿区域（130）中的光轴的方向改变可移动部分（140）的位置来改变。

公开(公告)号：EP2472680A1

公开(公告)日：2012-07-04

申请号：EP10844509.9

申请日：2010-01-27

申请人： Mitsubishi Electric Corporation

发明人： TAMAYA, Motoaki ,  NAKAMURA, Akira ,  NANBA, Chise

IPC分类号： H01S5/022

CPC分类号： H01S5/02212 ,  H01L23/10 ,  H01L2924/0002 ,  H01R4/58 ,  H01R13/03 ,  H01S5/0222 ,  H01S5/02236 ,  H01L2924/00

摘要： In order to obtain a semiconductor laser module in which breakage is not made in a cooling process during sealing with glass, magneto-striction deformation is in an acceptable range, and a large current can be flown, the semiconductor laser module includes: a semiconductor laser element (10) which emits light by the supply of a current; a package base (1) having a through hole (1A); a lead pin (2) which passes through the through hole (1A) and supplies the current to the semiconductor laser element (10); a glass material (3) which seals the through hole (1A) through which the lead pin (2) passes through; and a cap (30) which has a window (31) from which light emitted by the semiconductor laser element (10) is taken out and has the semiconductor laser element (10) in the inside thereof, the cap (30) being hermetically joined to the package base (1). The lead pin (2) is an iron-nickel alloys in which the coefficient of linear expansion is not higher than a predetermined ratio in difference with the glass material (3), the saturation magneto-striction constant is not higher than a predetermined value, and volume resistivity is not higher than a predetermined rate.

摘要翻译： 为了获得在玻璃密封期间在冷却过程中不进行断裂的半导体激光器模块，磁致伸缩变形在可接受的范围内，并且可以流过大电流，所述半导体激光器模块包括：半导体激光器 通过供给电流而发光的元件（10）; 具有通孔（1A）的封装基座（1）; 导通销（2），其穿过所述通孔（1A）并将电流提供给所述半导体激光元件（10）; 密封引脚（2）穿过的通孔（1A）的玻璃材料（3） 以及具有窗口（31）的盖（30），半导体激光元件（10）发出的光从该窗口取出，并且在其内部具有半导体激光元件（10），盖（30）被气密地连接 到包装基座（1）。 引线销（2）是与玻璃材料（3）不同的线膨胀系数不高于规定比例的铁 - 镍合金，饱和磁致伸缩常数不高于规定值， 并且体积电阻率不高于预定速率。

公开(公告)号：EP2072990A2

公开(公告)日：2009-06-24

申请号：EP08171311.7

申请日：2008-12-11

申请人： Daylight Solutions, Inc.

发明人： Weida, Miles J. ,  Day, Timothy ,  Takeuchi, Eric

IPC分类号： G01M3/38

CPC分类号： G01M3/38 ,  G01M3/202 ,  G01N21/3504 ,  G01N2021/3513 ,  H01S3/105 ,  H01S5/0222 ,  H01S5/024 ,  H01S5/02415 ,  H01S5/0612 ,  H01S5/141

摘要： An imaging system (10) for imaging an emitting gas (12) includes an imager (16) and a laser source (20). The imager (16) captures an image (18) of light in the mid-infrared (MIR) range. The laser source (20) includes a semiconductor laser (334) that directly emits an output beam (26) that is in the MIR range. The output beam (26) may be adapted to backscatter near and/or be absorbed by the emitting gas (12). Thus, when an emitting gas (12) is present, the gas (12) may absorb and attenuate the backscattered light. As a result thereof, a shadow or contrast (18A) corresponding to the emitting gas (12) may be visible in the image (18) that is captured by the imager (16).

摘要翻译： 用于对发射气体（12）进行成像的成像系统（10）包括成像器（16）和激光源（20）。 成像器（16）捕获中红外（MIR）范围内的光的图像（18）。 激光源（20）包括直接发射处于MIR范围内的输出光束（26）的半导体激光器（334）。 输出光束（26）可以适于在发射气体（12）附近和/或被吸收的背散射。 因此，当存在发射气体（12）时，气体（12）可以吸收和衰减背散射光。 作为其结果，对应于发射气体（12）的阴影或对比度（18A）可以在由成像器（16）捕获的图像（18）中可见。

公开(公告)号：EP1943706A1

公开(公告)日：2008-07-16

申请号：EP05804390.2

申请日：2005-10-27

申请人： LIMO Patentverwaltung GmbH & Co. KG

发明人： STÖHR, Detlef, Dipl.-Ing ,  BARTOSCHEWSKI, Daniel

IPC分类号： H01S5/022 ,  H01S5/024 ,  G02B6/42

CPC分类号： H01S5/02469 ,  H01S5/02208 ,  H01S5/0222 ,  H01S5/02236 ,  H01S5/02296 ,  H01S5/4031

摘要： Semiconductor laser device, comprising at least one semiconductor laser element (5), a heat sink (1) having a first bearing area (10), on which the at least one semiconductor laser element (5) bears, a housing upper part (2) and a housing lower part, which, in the interconnected state, can at least partly surround the semiconductor laser element (5), and also sealing means for the tight connection of housing upper part (2) and housing lower part, the heat sink (1) serving as housing lower part.

公开(公告)号：EP1372230A3

公开(公告)日：2005-06-08

申请号：EP03005629.5

申请日：2003-03-12

申请人： Agilent Technologies, Inc.

发明人： Baney, Douglas M.

IPC分类号： H01S5/14 ,  H01S5/022

CPC分类号： H01S5/141 ,  H01S5/0222 ,  H01S5/0683

摘要： An external cavity laser having a set atmosphere is disclosed. In an embodiment, the laser system includes a gain medium (210) to emit light in response to an applied current, a wavelength selective reflector (240) configured to resonate the light that is emitted from the gain medium, and a chamber (205; 305; 505; 705; 905) containing a set atmosphere, the chamber being optically connected to the gain medium and the wavelength selective reflector such that the light that is emitted from the gain medium passes through the chamber.

公开(公告)号：EP1478017A1

公开(公告)日：2004-11-17

申请号：EP03734831.5

申请日：2003-01-22

申请人： Nec Schott Components Corporation

发明人： FUKUSHIMA, Daisuke, c/o NEC SCHOTT COMPONENTS CORP ,  YAMAMOTO, Hidefumi, c/o NEC SCHOTT COMPONENTS CORP

IPC分类号： H01L23/08

CPC分类号： H01S5/0222 ,  H01L23/10 ,  H01L2924/0002 ,  H01S5/02212 ,  H01S5/02296 ,  H01L2924/00

摘要： An object of the present invention is to provide a low-priced and highly reliable high-vacuum hermetic seal package (30). To this end, a method of manufacturing a hermetic seal package (30) according to the present invention is a method of manufacturing a hermetic seal package (30) by anodically bonding an opening of a cylindrical body (31) for forming an outer frame and the outer edge of a flat glass plate (32) to each other, characterized in that anodically bonded surfaces are 0.04 mm to 200 mm in width and not more than 0.20 µm in surface roughness, the cylindrical body (31) consists of a metal consisting of at least one of Fe, Ni and Co or an alloy or conductive ceramics mainly composed of this metal, the glass plate (32) contains alkaline metal ions, and the quantity of inert gas permeation on bonded portions is 1.0 × 10 -15 Pa·m 3 /s to 1.0 × 10 -8 Pa·m 3 /s after anodic bonding.

摘要翻译： 本发明的目的是提供一种低价高可靠性的高真空密封封装（30）。 为此，根据本发明的制造气密密封包装（30）的方法是通过阳极结合用于形成外框架的圆柱体（31）的开口来制造气密密封包装（30）的方法，以及 平板玻璃板（32）的外边缘彼此之间，其特征在于阳极接合表面的宽度为0.04mm至200mm，表面粗糙度不超过0.20μm，圆柱体（31）由金属 由Fe，Ni和Co中的至少一种或主要由该金属构成的合金或导电陶瓷组成，玻璃板（32）含有碱金属离子，接合部分上的惰性气体渗透量为1.0×10 < 15> Pa.m 3 / s至1.0×10 -8 Pa / m 3 / s。

公开(公告)号：EP1121734B1

公开(公告)日：2003-01-08

申请号：EP99969540.6

申请日：1999-09-20

申请人： Sarnoff Corporation

发明人： ABELES, Joseph, Hy

IPC分类号： H01S3/098

CPC分类号： H01S5/0657 ,  G02B6/4206 ,  G02B6/4215 ,  G02B6/4245 ,  G02B6/4248 ,  G02B6/4251 ,  G02B6/4271 ,  G02B6/4285 ,  H01S5/0222 ,  H01S5/02284 ,  H01S5/141 ,  H01S5/142 ,  H01S5/146 ,  H01S5/4062 ,  H01S5/4068 ,  H01S5/4087 ,  H01S5/50 ,  Y10T74/18656

摘要： A multiwavelength mode-locked MWML angled-stripe SOA laser that emits multiple discrete groups of wavelengths simultaneously in a short time interval, where each group is located at a wavelength suitable to wavelength division multiplexed optical transmission. Feedback (60, 70) and/or feedthrough optics (90) are combined with an angled-stripe SOA to provide different laser embodiments. The actively mode locked MWML laser emits individual spectral components at a plurality of wavelengths simultaneously. The optics are coupled to one or more angled-stripe SOA ports in reflective or optical ring resonator configurations to provide simultaneous feedback at the plurality of wavelengths and to provide substantially identical round-trip travel times and net gains within the lasing cavity for pulses at each of the plurality of wavelengths. A MWML laser so formed is particularly useful as a multiwavelength source for optical signal processing and transmission systems and can be placed in a hermetically sealed package.

公开(公告)号：EP1211765A2

公开(公告)日：2002-06-05

申请号：EP01306677.4

申请日：2001-08-03

申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Tatoh, Nobuyoshi.

IPC分类号： H01S5/022

CPC分类号： G02B6/4201 ,  G02B6/4251 ,  G02B6/4256 ,  G02B6/4271 ,  G02B6/428 ,  H01L2924/0002 ,  H01S3/06704 ,  H01S3/06754 ,  H01S5/02216 ,  H01S5/0222 ,  H01L2924/00

摘要： An optical semiconductor hermetic sealing package for accommodating an optical semiconductor element therein, comprising: a frame (1) made of a metal, an insulator, or a composite of metal and insulator; a first bottom plate (11) made of a metal fixed to the frame (1); a second bottom plate (12) whose Young's modulus is larger than that of the first bottom plate (11) and which is fixed to the surface of the first bottom plate (11) on the opposite side to the frame (1); and a metal block plate (13) that is fixed to the surface of flanges (11a) projecting on both sides of the first bottom plate (11), on the side of the second bottom plate (12). The optical semiconductor hermetic sealing package is capable of alleviating warping of the bottom plate and has an even more excellent heat radiating characteristic. Using the optical semiconductor hermetic sealing package, there can be an optical semiconductor module and an optical fiber amplifier free from deterioration of the electronic cooling elements or deviation of the optical axis.

摘要翻译： 一种光学半导体气密密封封装在光半导体元件容纳在其中，其包括：由金属制成的框架（1），绝缘体上，或金属和绝缘体的复合物; 由固定在框架上的金属制成的第一底板（11）（1）; 的第二底板（12），其杨氏模量小于所述第一底板（11）的大，所有这一切都被固定到在相对侧上的第一底板（11）的表面到所述框架（1）; 和金属板块（13）做了被固定到凸缘上投射在所述第二底板（12）的侧上的第一底板（11）的bothsides表面（​​11A）。 光半导体气密密封包装是能够减轻底板的翘曲并具有更优良的热辐射特性。 使用光学半导体气密密封的封装，它可以是在光学半导体模块和从所述光轴的电子冷却元件或偏差的劣化自由光纤放大器。

公开(公告)号：EP1192518A2

公开(公告)日：2002-04-03

申请号：EP00957245.4

申请日：2000-05-09

申请人： Corning Incorporated

发明人： BOOKBINDER, Dana, C.

IPC分类号： G06F1/00

CPC分类号： H04B10/50 ,  G02B6/4254 ,  G02B6/4265 ,  H01S5/02204 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02284

摘要： One aspect of the present invention is a method of making a semiconductor laser optical waveguide telecommunications module (22) which includes providing a semiconductor laser (24), a housing (26), and a oxidizing atmosphere, such that the oxidizing atmosphere is in contact with the semiconductor laser (24) and contained by the housing (26). In another aspect, the invention includes a semiconductor laser optical waveguide telecommunications module (22) that includes a semiconductor laser (24), a housing (26) for enclosing the semiconductor laser (24) and an O2-free oxidizing atmosphere in contact with the semiconductor laser (24) and contained by the housing (26).