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公开(公告)号:EP2706095A4
公开(公告)日:2014-12-17
申请号:EP12779994
申请日:2012-05-04
申请人: LG CHEMICAL LTD
发明人: KO MIN JIN , MOON MYUNG SUN , CHEONG JAE HO , CHOI BUM GYU , KANG DAE HO , KIM MIN KYOUN
IPC分类号: C08L83/04 , C08G77/04 , C08K5/5415 , G02F1/1335
CPC分类号: C08L83/04 , C08G77/12 , C08G77/20 , C08G77/70 , C08K3/36 , C08K5/5419 , G02F1/1339 , G02F2001/13398 , C08L83/00
摘要: Provided is a curable composition. The curable composition, which may provide an encapsulating material, of which processibility and workability before curing are effectively maintained and which has excellent light transmissivity, light extraction efficiency, hardness, crack resistance, adhesion strength and thermal shock resistance after curing, is provided. Further, the curable composition may show effectively controlled tackiness in the surface and may not show whitening under the high temperature or high humidity condition before or after curing.
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公开(公告)号:EP2735590A4
公开(公告)日:2014-12-10
申请号:EP12817922
申请日:2012-07-23
申请人: LG CHEMICAL LTD
发明人: KO MIN JIN , MOON MYUNG SUN , JUNG JAE HO , CHOI BUM GYU , KANG DAE HO , KIM MIN KYOUN , CHO BYUNG KYU
IPC分类号: C08L83/04 , C08G77/04 , C08K3/00 , C08K5/5415 , H01L23/29
CPC分类号: H01L33/56 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/80 , C08K3/0008 , C08K3/01 , C08K3/22 , C08K3/36 , C08K2201/002 , C08L83/00 , C08L83/04 , C08L2205/22 , G02F1/133603 , H01L23/293 , H01L2924/0002 , Y10T428/1059 , Y10T428/1068 , H01L2924/00
摘要: A curable composition and use thereof are provided. The composition can be useful in exhibiting excellent processability and workability, and providing a cured product which exhibits superior light extraction efficiency, crack resistance, hardness, thermal shock resistance, and adhesive properties, has superior reliability under severe conditions for a long period of time and prevents opacity and stickiness onto a surface thereof when cured. Also, the curable composition capable of preventing precipitation of an additive such as a fluorescent material or a photoconversion material and being formed into a cured product having excellent transparency even when the additive is added to the curable composition can be provided.
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公开(公告)号:EP2662411A4
公开(公告)日:2014-09-10
申请号:EP12732028
申请日:2012-01-06
申请人: LG CHEMICAL LTD
发明人: CHOI BUM GYU , KO MIN JIN , MOON MYUNG SUN , JUNG JAE HO , KANG DAE HO , KIM MIN KYOUN , CHO BYUNG KYU
IPC分类号: C08L83/04 , C08G77/04 , C08K5/5415 , G02F1/13357 , H01L23/29
CPC分类号: H01L33/52 , C08G77/12 , C08G77/14 , C08G77/20 , C08K5/56 , C08L83/00 , C08L83/04 , G02F1/133603 , H01L23/29 , H01L23/296 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
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公开(公告)号:EP2662410A4
公开(公告)日:2014-05-14
申请号:EP12731982
申请日:2012-01-06
申请人: LG CHEMICAL LTD
发明人: CHOI BUM GYU , KO MIN JIN , MOON MYUNG SUN , JUNG JAE HO , KANG DAE HO , KIM MIN KYOUN , CHO BYUNG KYU
IPC分类号: C08L83/04 , C08G77/04 , C08K5/5415 , C08K5/5419 , G02F1/13357 , H01L23/29
CPC分类号: H01L33/56 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/80 , C08K5/5419 , C08K5/56 , C08L83/00 , C08L83/04 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
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