公开(公告)号：EP3496817B1

公开(公告)日：2024-10-02

申请号：EP17761355.1

申请日：2017-08-11

IPC分类号： A61Q5/00 ,  C04B41/49 ,  C09D183/04 ,  C08G77/16 ,  C08G77/26 ,  C08L83/04 ,  C08G77/04

CPC分类号： C04B41/4922 ,  C08G77/26 ,  A61Q5/12 ,  C08G77/045 ,  C08G77/80 ,  A61K8/585 ,  A61K8/898 ,  A61Q5/00 ,  C04B41/009 ,  C04B41/64 ,  C09D183/08

公开(公告)号：EP4259695B1

公开(公告)日：2024-08-07

申请号：EP20833716.2

申请日：2020-12-08

IPC分类号： C08G77/18 ,  C08G77/38 ,  C08G77/445 ,  C08G77/00 ,  C08L83/10

CPC分类号： C08G77/70 ,  C08G77/80 ,  C08G77/18 ,  C08G77/38 ,  C08G77/445 ,  C08L83/10 ,  C08G63/6956 ,  C09D167/02

公开(公告)号：EP3315301B1

公开(公告)日：2024-08-07

申请号：EP17195687.3

申请日：2017-10-10

IPC分类号： B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B17/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/24 ,  B32B27/26 ,  B32B27/28 ,  B32B37/02 ,  B32B37/12 ,  B32B38/10

CPC分类号： B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/24 ,  B32B27/26 ,  B32B27/28 ,  B32B27/283 ,  B32B37/02 ,  B32B37/12 ,  B32B38/10 ,  C08G77/52 ,  C08G77/50 ,  C09J163/00 ,  C09J183/10 ,  H01L21/6836 ,  B32B2037/009220130101 ,  B32B2037/125320130101 ,  B32B2037/126920130101 ,  B32B2038/001620130101 ,  B32B2250/0320130101 ,  B32B2250/0420130101 ,  B32B2250/0520130101 ,  B32B2270/0020130101 ,  B32B2307/4020130101 ,  B32B2307/41220130101 ,  B32B2307/41420130101 ,  B32B2457/0020130101 ,  B32B2457/0820130101 ,  B32B2457/1220130101 ,  B32B2457/1420130101 ,  C08G77/70 ,  C08G77/80 ,  H01L2221/6838120130101 ,  H01L2221/6838620130101

公开(公告)号：EP3626781B1

公开(公告)日：2024-06-26

申请号：EP18802915.1

申请日：2018-05-02

IPC分类号： C08L83/08 ,  C08L83/05 ,  C08G77/12 ,  C08G77/20 ,  C08G77/24 ,  C08L83/04 ,  C09D183/04 ,  C09D183/08 ,  C08G77/00

CPC分类号： C08L83/08 ,  C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08G77/24 ,  C09D183/08 ,  C09D183/04 ,  H10N30/857

公开(公告)号：EP2134790B1

公开(公告)日：2018-11-14

申请号：EP08742280.4

申请日：2008-03-26

申请人： Momentive Performance Materials Inc.

发明人： RAMAKRISHNAN, Indumathi ,  NESAKUMAR, Edward, Joseph

IPC分类号： C08L83/04 ,  C08K3/22 ,  C08K5/00

CPC分类号： C08L83/04 ,  C08G77/16 ,  C08G77/80 ,  C08K3/22 ,  C08K5/0008 ,  C08L83/00 ,  C08L2666/44 ,  C08L2666/54

摘要： The present invention relates to room-temperature curable silicone compositions possessing rapid deep-section cure. The silicone sealant compositions of the present invention find application in insulating glass units as elements of windows, skylights, doors and related products.

公开(公告)号：EP2484732B1

公开(公告)日：2018-10-03

申请号：EP12153999.3

申请日：2012-02-06

申请人： Schott AG

发明人： Bockmeyer, Matthias ,  Rudigier-Voigt, Eveline ,  Schuhmacher, Jörg ,  Hagemann, Volker ,  Back, Franziska

IPC分类号： C09D183/04 ,  B29D11/00 ,  H01B3/46 ,  H01L21/312

CPC分类号： C09D183/06 ,  B29D11/00365 ,  C03C1/008 ,  C03C17/006 ,  C03C17/30 ,  C03C2217/40 ,  C03C2217/445 ,  C03C2217/477 ,  C03C2218/113 ,  C08G77/14 ,  C08G77/18 ,  C08G77/445 ,  C08G77/80 ,  C09D183/04 ,  C23C18/06 ,  C23C18/122 ,  C23C18/1233 ,  C23C18/1245 ,  C23C18/1254 ,  C23C18/127 ,  C23C18/14 ,  Y10T428/24612 ,  Y10T428/31663 ,  C08L83/00

公开(公告)号：EP2878637B1

公开(公告)日：2018-09-26

申请号：EP13823473.7

申请日：2013-07-29

申请人： LG Chem, Ltd.

发明人： KO, Min Jin ,  JUNG, Jae Ho ,  CHOI, Bum Gyu ,  YU, Min A

IPC分类号： C08L83/04 ,  C08G77/04 ,  H01L23/29 ,  G02F1/1335 ,  C09D183/04

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/00 ,  C08L83/04 ,  C09D183/04

摘要： Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

公开(公告)号：EP3363848A1

公开(公告)日：2018-08-22

申请号：EP16855767.6

申请日：2016-10-14

申请人： Samyang Corporation ,  Damipolychem Co., Ltd.

发明人： SHIN, Kyung Moo ,  KWON, Young Do

IPC分类号： C08G77/448 ,  C08G77/04 ,  C08G77/12 ,  C08G77/06 ,  C08J5/00

CPC分类号： C08G77/448 ,  C08G64/186 ,  C08G77/04 ,  C08G77/06 ,  C08G77/80

摘要： The present invention relates to a polysiloxane-polycarbonate copolymer having improved transparency and flame retardancy, and a method for producing the same. More specifically, the present invention relates to a polysiloxane having a specific structure having a side chain containing a randomly substituted hydroxyphenyl group, a polysiloxane-polycarbonate copolymer having the polysiloxane and a polycarbonate block as repeating units, exhibiting excellent flame retardancy and also excellent transparency, and a method for producing the same.

公开(公告)号：EP3239244A4

公开(公告)日：2018-08-01

申请号：EP15871611

申请日：2015-06-01

申请人： SHENGYI TECHNOLOGY CO LTD

发明人： YE SUWEN ,  TANG GUOFANG

IPC分类号： C08L83/04 ,  B32B27/04 ,  C08G77/16 ,  C08G77/18 ,  C08K3/36 ,  C08K5/098 ,  C09D183/06

CPC分类号： C08L83/06 ,  B32B27/04 ,  B32B38/08 ,  B32B2307/304 ,  B32B2307/3065 ,  C08G77/08 ,  C08G77/16 ,  C08G77/18 ,  C08G77/80 ,  C08J5/24 ,  C08K3/013 ,  C08K3/36 ,  C08K5/098 ,  C08L83/04 ,  C09D183/06 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0358 ,  H05K2201/068 ,  C08K5/5415

摘要： The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufaturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.

公开(公告)号：EP2662412B1

公开(公告)日：2018-07-11

申请号：EP12732111.5

申请日：2012-01-06

申请人： LG Chem, Ltd.

发明人： CHOI, Bum Gyu ,  KO, Min Jin ,  MOON, Myung Sun ,  JUNG, Jae Ho ,  KANG, Dae Ho ,  KIM, Min Kyoun ,  CHO, Byung Kyu

IPC分类号： C08L83/04 ,  C08K5/5415 ,  C08G77/04 ,  H01L23/29 ,  G02F1/13357 ,  C08K5/5419

CPC分类号： H01L33/56 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.