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    OPTICAL INTEGRATED CIRCUITS (ICS)
    42.
    发明公开
    OPTICAL INTEGRATED CIRCUITS (ICS) 审中-公开
    用于生产光集成电路

    公开(公告)号：EP1356324A2

    公开(公告)日：2003-10-29

    申请号：EP01990046.3

    申请日：2001-12-06

    Applicant: APPLIED MATERIALS, INC.

    Inventor： MAK, Cecilia Y., ,  WHITE, John M., ,  LAW, Kam S., ,  MAYDAN, Dan

    IPC: G02B6/132

    CPC classification number: G02B6/12004 ,  G02B6/13 ,  G02B6/132

    Abstract: In one aspect, the invention provides methods and apparatus for forming optical devices on large area substrates. The large area substrates are preferably made of quartz, silica or fused silica. The large area substrates enable larger optical devices to be formed on a single die. In another aspect, the invention provides methods and apparatus for forming integrated optical devices on large area substrates, such as quartz, silica or fused silica substrates. In another aspect, the invention provides methods and apparatus for forming optical devices using damascene techniques on large area substrates or silicon substrates. In another aspect, methods for forming optical devices by bonding an upper cladding layer on a lower cladding and a core is provided.

    Method of preventing cracking in optical quality silica layers
    43.
    发明公开
    Method of preventing cracking in optical quality silica layers 有权
    二氧化硅on on t t t t t t t t t

    公开(公告)号：EP1352991A1

    公开(公告)日：2003-10-15

    申请号：EP03100161.3

    申请日：2003-01-28

    Applicant: Dalsa Semiconductor Inc.

    Inventor： Quellet, Luc ,  Lachance, Jonathan ,  Archambault, Sylvie

    IPC: C23C16/56 ,  C23C16/40

    CPC classification number: G02B6/132 ,  C23C16/402 ,  C23C16/56 ,  G02B2006/12169

    Abstract: A method is disclosed for making an integrated photonic device having buffer, core and cladding layers deposited on the front side of a wafer. A thick tensile stress layer is deposited on the back side of the wafer just prior to performing a high temperature thermal treatment above 600°C on the cladding layer to prevent the cracking of the layers as a result of the thermal treatment.

    Abstract translation: 公开了一种用于制造集成光子器件的方法，该光子器件具有沉积在晶片正面上的缓冲层，芯层和覆层。 在刚好在包层上进行高于600℃的高温热处理之前，在晶片的背面沉积厚的拉伸应力层，以防止由于热处理而导致的层的开裂。

    On-chip multiple layer vertically transitioning optical waveguide and damascene method of fabricating the same
    44.
    发明公开
    On-chip multiple layer vertically transitioning optical waveguide and damascene method of fabricating the same 审中-公开
    片上Mehrschicht optischer WellenleiterfürverticaleÜbergängeund Damascene Herstellungsverfahren

    公开(公告)号：EP1014122A3

    公开(公告)日：2003-04-16

    申请号：EP99124885.7

    申请日：1999-12-16

    Applicant: LSI LOGIC CORPORATION

    Inventor： Allman, Derryl D.J. ,  Hornbeck, Verne C.

    IPC: G02B6/125 ,  G02B6/12

    CPC classification number: G02B6/125 ,  G02B6/12002 ,  G02B6/132 ,  G02B6/136 ,  G02B2006/12104 ,  G02B2006/12119

    Abstract: An optical waveguide (22) extends vertically within the interior of an IC-like structure (20) to route optical signals between horizontal waveguides (25a-25d) in different layers of horizontal optical interconnects. A light reflecting structure (32, 34) is positioned at the intersection of the horizontal and vertical waveguides (22, 25a-25d) to reflect the light. Multiple horizontal waveguides (25a, 25b; 25c, 25d) may join the vertical waveguide (22) at a common intersection, to form a beam splitter or a beam combiner. Optical signals from one horizontal waveguide are diverted within the IC-like structure (20) into another horizontal or vertical waveguide. The waveguide is formed with a light reflective structure at an intersection of the horizontal and vertical waveguides (22, 25a-25d), and the waveguide is completed using damascene fabrication techniques.

    Abstract translation: 光波导（22）在IC状结构（20）的内部垂直延伸，以在水平光学互连的不同层中的水平波导（25a-25d）之间布置光信号。 光反射结构（32,34）位于水平和垂直波导（22,25a-25d）的交叉处，以反射光。 多个水平波导（25a，25b; 25c，25d）可以在公共交叉点处连接垂直波导（22），以形成分束器或光束组合器。 来自一个水平波导的光信号在IC-类结构（20）内转移到另一个水平或垂直波导中。 波导在水平和垂直波导（22,25a-25d）的交叉处形成有光反射结构，并且波导使用镶嵌制造技术完成。

    A MULTILAYER INTEGRATED OPTICAL DEVICE AND A METHOD OF FABRICATION THEREOF
    46.
    发明公开
    A MULTILAYER INTEGRATED OPTICAL DEVICE AND A METHOD OF FABRICATION THEREOF 有权
    集合多层光学装置和相关方法

    公开(公告)号：EP1248960A2

    公开(公告)日：2002-10-16

    申请号：EP01925847.4

    申请日：2001-04-24

    Applicant: Lambda Crossing Ltd

    Inventor： MARGALIT, Moti ,  ORENSTEIN, Meir

    IPC: G02B6/13

    CPC classification number: G02B6/132 ,  G02B6/12002 ,  G02B6/12007 ,  G02B6/122 ,  G02B6/29343 ,  G02B6/29386 ,  G02B2006/12097 ,  G02B2006/12147

    Abstract: A method of fabricating an integrated optical device and such a device, comprising a structure including at least one waveguiding element are presented. A basic structure is formed containing a substrate material carrying a buffer material layer coated with a core material layer of a higher refraction index as compared to that of the buffer layer. The at least one waveguiding element is defined in a guiding layer on top of the basic structure. The guiding layer is made of a material with a refractive index higher than the refractive index of the buffer layer and the core layer, and is chosen so as to minimize a height of the at least one waveguiding element and to provide effective guiding of light in the core layer. A cladding layer is formed on top of the so-obtained structure, wherein a height difference between the cladding layer region above the waveguiding element and the cladding layer region outside the waveguiding element is substantially small resulting in a desired flatness of the top cladding layer to allow direct formation of a further waveguide structure thereon and prevent significant perturbations in light propagation within the further waveguide structure.

    Formation of materials such as waveguides with a refractive index step
    49.
    发明公开
    Formation of materials such as waveguides with a refractive index step 有权
    Herstellung von MaterialienfürWellenleiter mit Stufenbrechungsindex

    公开(公告)号：EP1209492A1

    公开(公告)日：2002-05-29

    申请号：EP00650200.9

    申请日：2000-11-28

    Applicant: National University of Ireland Cork

    Inventor： Connell, Andrew ,  O'Brien, Shane ,  Kelly, Patrick Vincent

    IPC: G02B6/12 ,  G03F7/00 ,  G02B1/04

    CPC classification number: G02B6/125 ,  C08G77/14 ,  G02B1/045 ,  G02B6/1221 ,  G02B6/132 ,  G02B6/138 ,  G02B2006/12069 ,  G02B2006/121 ,  G03F7/001 ,  G03F7/0757

    Abstract: A process of forming a material such as a waveguide with at least two regions of differing refractive indices comprising the steps of: (a) providing an amount of a gelable composition comprising at least one gelable component in a desired form; (b) exposing the gelable composition to conditions which partially gel the gelable composition so that an amount of ungelled material remains; (c) exposing at least one discrete region of the partially gelled product of step (b) to conditions which induce more complete gelation of the partially gelled gelable composition so that more of the ungelled material is incorporated into the gel structure in the exposed regions than in non-exposed regions; and (d) removing material not incorporated in the gel structure at least from the non-exposed region. A second component may additionally be provided, the second component being selected to impart a higher or lower refractive index to that part of the material in which it is incorporated. A step in refractive index between at least two regions of the material may be achieved.

    Abstract translation: 形成诸如具有不同折射率的至少两个区域的波导的材料的方法包括以下步骤：（a）提供一定量的包含至少一种所需形式的可凝胶组分的可胶凝组合物; （b）将可胶凝组合物暴露于部分凝胶化可凝胶组合物使得一定量的未凝胶材料残留的条件下; （c）将步骤（b）的部分胶凝产物的至少一个离散区域暴露于引起部分凝胶化的可凝胶组合物更完全凝胶化的条件，使得在暴露区域中更多的未凝胶材料被引入凝胶结构中比 在非暴露地区; 和（d）至少从非曝光区域除去未掺入凝胶结构中的材料。 另外可以提供第二组分，第二组分被选择为赋予其掺入材料的那部分更高或更低的折射率。 可以实现材料的至少两个区域之间的折射率的步骤。

    OPTICAL WAVEGUIDE CIRCUIT
    50.
    发明公开
    OPTICAL WAVEGUIDE CIRCUIT 审中-公开
    光波导线路

    公开(公告)号：EP1191362A1

    公开(公告)日：2002-03-27

    申请号：EP00925585.2

    申请日：2000-05-10

    Applicant: The Furukawa Electric Co., Ltd.

    Inventor： NARA, Kazutaka The Furukawa Electric Co., Ltd. ,  NAKAJIMA, Takeshi The Furukawa Electric Co., Ltd. ,  KASHIHARA, Kazuhisa The Furukawa Electric Co., Ltd

    IPC: G02B6/12

    CPC classification number: G02B6/126 ,  G02B6/105 ,  G02B6/12023 ,  G02B6/1203 ,  G02B6/132

    Abstract: The present invention relates to an optical waveguide circuit such as an arrayed waveguide grating, etc., which is capable of suppressing influences of polarization dependency loss without providing a half-wave plate. A lower cladding is formed on a silicon substrate (11). A core having the following waveguide construction is formed thereon. That is, an input side slab waveguide (13) is connected to the emission side of a plurality of incidence waveguides (12), a plurality of arrayed waveguides (14) having different lengths from each other are juxtaposed at and connected to the emission side thereof, an output side slab waveguide (15) is further connected to the emission side thereof, and a plurality of emission waveguides (16) are connected to the emission side thereof, thereby causing the abovementioned waveguide construction. The upper cladding covers up the core. A plurality of multiplexed and inputted light beams, having different wavelengths from each other, which are made incident into the core are divided and outputted wavelength by wavelength. The claddings and core are made of silica-based glass, wherein the value B of birefringence occurring in said optical waveguide portion is |B|≤5.34 x 10 -5 , and αs - 2.0 x 10 -7 ≤ αg ≤ αs + 2.0 x 10 -7 is established where it is assumed that the thermal expansion coefficient of the upper cladding is αg, and the thermal expansion coefficient of a silicon substrate is αs.

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