公开(公告)号：EP4053233A1

公开(公告)日：2022-09-07

申请号：EP20881625.6

申请日：2020-10-19

Applicant: Nisshinbo Chemical Inc.

Inventor： MATSUMOTO, Nobuyuki ,  NAKAJIMA, Shunta ,  ITOH, Takahiko

IPC: C09D175/12 ,  C09D201/00 ,  C09J175/12 ,  C09J201/00 ,  C08G18/09 ,  C08G18/75 ,  C08G18/79 ,  B65D85/50

Abstract: Provided are a polycarbodiimide compound that enables an aqueous resin composition capable of forming a coating (layer) having water resistance and adhesion that can withstand use for food packaging to be obtained, an aqueous resin composition containing the polycarbodiimide compound, and a food packaging having a layer formed of the aqueous resin composition. A polycarbodiimide compound (A) represented by formula (1) below,

wherein R 1 represents a residue obtained by removing a functional group capable of reacting with isocyanate from a hydrophilic compound having the functional group capable of reacting with isocyanate, R 2 represents a divalent residue obtained by removing an isocyanate group from an aliphatic diisocyanate compound, and R 3 represents a divalent residue obtained by removing a hydroxyl group from a glycol compound having 2 or 3 carbon atoms; X represents a group that is formed by reaction between the hydrophilic compound and the aliphatic diisocyanate compound; n1 represents a number of 1 to 10, n2 represents a number of 1 to 10, and p represents a number of 2 to 4; and a plurality of R 1 and R 2 each may be the same or different.

公开(公告)号：EP3590891B1

公开(公告)日：2022-08-17

申请号：EP18761134.8

申请日：2018-02-27

Inventor： NISHIO, Akira ,  YAMANE, Kenichi ,  YAMAMURA, Naotsugu ,  TOMINAGA, Shingo ,  ONIDUKA, Hiroya

IPC: C01F7/02 ,  C01B35/04 ,  C01G23/00 ,  C01G29/00 ,  C01G31/02 ,  C01G41/00 ,  C04B35/111 ,  C08K3/22 ,  C08L101/00 ,  C09D7/00 ,  C09D7/40 ,  C09D11/037 ,  C09D201/00 ,  C09J9/00 ,  C09J11/04 ,  C09J201/00 ,  C09K5/14

公开(公告)号：EP3940036A3

公开(公告)日：2022-08-03

申请号：EP21184411.3

申请日：2021-07-08

Applicant: Asahi Kasei Kabushiki Kaisha

Inventor： TANIGUCHI, Naoki ,  TSUJI, Mikako

IPC: C09J11/08 ,  C09J153/00 ,  C09J201/00 ,  C09J7/38

Abstract: Problem to be solved:
Provided is a material for a pressure-sensitive adhesive which has a high adhesive strength and is capable of forming a pressure-sensitive adhesive layer excellent in film appearance.
Solution:
The material for a pressure-sensitive adhesive contains composition C in a particulate form including thermoplastic elastomer A, and composition F in a particulate form including thermoplastic elastomer D and tackifier E, wherein the condition (2) is satisfied, an adhesive strength of the material for a pressure-sensitive adhesive is larger than that of the composition C and the composition F, wherein x represents a mass ratio (thermoplastic elastomer(s) / thermoplastic elastomer(s) + tackifier(s)) of the material for a pressure-sensitive adhesive; α represents a mass ratio (thermoplastic elastomer(s) / thermoplastic elastomer(s) + tackifier(s)) of the composition C; and β represents a mass ratio (thermoplastic elastomer(s) / thermoplastic elastomer(s) + tackifier(s)) of the composition F, and the material for a pressure-sensitive adhesive satisfies the expression (1) and the condition (13): β a ratio of the total mass of the tackifier(s) to the total mass of the thermoplastic elastomer(s) in the composition F is more than 1.5 and 3.0 or less; a ratio of the MFR value of the composition F to the MFR value of the composition C is 10 or more and 100 or less.

公开(公告)号：EP4011616A1

公开(公告)日：2022-06-15

申请号：EP20850554.5

申请日：2020-07-28

Applicant: Nitto Denko Corporation

Inventor： SOEJIMA Kazuki ,  NAKAO Kota

IPC: B32B27/00 ,  C09J11/08 ,  C09J201/00 ,  C09J7/38

Abstract: The present invention provides a pressure-sensitive adhesive tape, including: a base material; and a pressure-sensitive adhesive layer arranged on at least one side of the base material, wherein the pressure-sensitive adhesive layer contains thermally expandable microspheres and a pressure-sensitive adhesive, wherein the thermally expandable microspheres are each formed of a shell and a volatile substance contained inside the shell, and wherein a resin forming the shell contains a constituent unit having a carboxyl group. In one embodiment, the resin forming the shell has a glass transition temperature (Tg) of 120°C or more.

公开(公告)号：EP3442010B1

公开(公告)日：2022-06-01

申请号：EP17774989.2

申请日：2017-03-27

Inventor： IGARASHI, Kouji ,  MORIMOTO, Akimitsu ,  FUKUMOTO, Hideki

IPC: H01L21/56 ,  C09J7/20 ,  C09J133/04 ,  C09J201/00 ,  H01L23/31

公开(公告)号：EP4001373A1

公开(公告)日：2022-05-25

申请号：EP20841520.8

申请日：2020-07-01

Applicant: Furukawa Electric Co., Ltd.

Inventor： NITTA, Norzafriza ,  FUJIWARA, Hidemichi ,  SATO, Yoshihiro

IPC: C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01L21/52 ,  H01L21/301 ,  C09J7/38

Abstract: Provided are a bonding film that has sufficient connection heat resistance and high reliability, enables satisfactory bonding to a substrate irrespective of the type of an electrode of a semiconductor element, and makes a bonding step simple and easy; a tape for wafer processing; a method for producing a bonded body; a bonded body; and a pasted body.
Disclosed is a bonding film 13 for bonding a semiconductor element 2 and a substrate 40, the bonding film having an electroconductive bonding layer 13a formed by molding an electroconductive paste including metal fine particles (P) into a film form; and a tack layer 13b having tackiness and laminated on the electroconductive bonding layer 13a, wherein the tack layer 13b includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer 13a, and the metal fine particles (M) have a melting point of 250°C or lower.

公开(公告)号：EP3950150A1

公开(公告)日：2022-02-09

申请号：EP20781854.3

申请日：2020-03-12

Applicant: Daiwa Can Company

Inventor： KANAMORI Shinichirou ,  SHIRATORI Seimei

IPC: B05D5/06 ,  B05D5/10 ,  B05D7/24 ,  B32B27/32 ,  B65D65/42 ,  C09J11/04 ,  C09D201/00 ,  C09J201/00 ,  C09D7/61 ,  C09J7/35 ,  B32B3/30

Abstract: The present invention is a liquid-repellent heat sealable film which exhibits excellent liquid repellency and excellent heat sealability, while having durability, and which is provided with a resin layer that is formed on at least one surface of a base material by means of coating, and a large number of oxide fine particles that are adhering to the surface of the resin layer. The resin layer has a recessed and projected structure that is formed by a plurality of particulate resins having heat scalability, said particulate resins being joined with each other and also joined with the base material, while maintaining the shape of particles; and the oxide fine particles are adhering to the surfaces of the particulate resins and are exposed to the outside without being buried in the resins.

公开(公告)号：EP3940036A2

公开(公告)日：2022-01-19

申请号：EP21184411.3

申请日：2021-07-08

Applicant: Asahi Kasei Kabushiki Kaisha

Inventor： TANIGUCHI, Naoki ,  TSUJI, Mikako

IPC: C09J11/08 ,  C09J153/00 ,  C09J201/00

Abstract: Problem to be solved:
Provided is a material for a pressure-sensitive adhesive which has a high adhesive strength and is capable of forming a pressure-sensitive adhesive layer excellent in film appearance.
Solution:
The material for a pressure-sensitive adhesive contains composition C in a particulate form including thermoplastic elastomer A, and composition F in a particulate form including thermoplastic elastomer D and tackifier E, wherein the condition (2) is satisfied, an adhesive strength of the material for a pressure-sensitive adhesive is larger than that of the composition C and the composition F, wherein x represents a mass ratio (thermoplastic elastomer(s) / thermoplastic elastomer(s) + tackifier(s)) of the material for a pressure-sensitive adhesive; α represents a mass ratio (thermoplastic elastomer(s) / thermoplastic elastomer(s) + tackifier(s)) of the composition C; and β represents a mass ratio (thermoplastic elastomer(s) / thermoplastic elastomer(s) + tackifier(s)) of the composition F, and the material for a pressure-sensitive adhesive satisfies the expression (1) and the condition (13): β a ratio of the total mass of the tackifier(s) to the total mass of the thermoplastic elastomer(s) in the composition F is more than 1.5 and 3.0 or less; a ratio of the MFR value of the composition F to the MFR value of the composition C is 10 or more and 100 or less.

公开(公告)号：EP3932692A1

公开(公告)日：2022-01-05

申请号：EP20763075.7

申请日：2020-02-25

Applicant: ENEOS Corporation

Inventor： MATSUO Yusuke ,  CHINO Keisuke

IPC: B60C1/00 ,  C09J11/04 ,  C09J11/06 ,  C08K5/548 ,  C08L21/00 ,  C09J201/00 ,  C07F7/18 ,  C08K3/013

Abstract: [Problem to be Solved]
To provide a sulfur-containing silane compound for obtaining a cross-linked product which does not generate poor dispersion or adhesion between an organic polymer material and an inorganic material and exhibits excellent viscoelastic properties or adhesive properties, or a composition comprising the same.
[Means for solving the problem]
A sulfur-containing silane compound represented by formula (1):

wherein R 1 , R 2 , and R 3 each independently represents a hydrocarbon group optionally containing an oxygen atom or a nitrogen atom, or a hydrogen atom;
L represents a hydrocarbon group optionally containing at least one hetero atom selected from the group consisting of nitrogen, oxygen, and sulfur;
a is an integer of 0 or 1;
b is an integer of 0 or 1;
c is each independently an integer of 0 or 1;
d is each independently an integer of 0 or 1;
e is an integer from 0 to 5;
R 4 , R 5 , R 6 , and R 7 represent hydrogen, or one of R 4 or R 5 and R 6 or R 7 may form a cross-linked structure represented by -(CH 2 ) f -, and f is an integer from 1 to 5;
R 8 , R 9 , R 10 and R 11 represent hydrogen, or one of R 8 or R 9 and R 10 or R 11 may form a cross-linked structure represented by -(CH 2 ) g -, and g is an integer from 1 to 5;
R 16 is a hydrogen atom, a methyl group or an alkyl group having 2 to 8 carbons, and R 17 is a hydrogen atom, a methyl group or an alkyl group having 2 to 10 carbons, where R 12 and R 13 bond to each other via sulfur of 1 to 10 atoms to form a ring, and R 14 , R 15 , and R 18 are hydrogen atoms, or R 14 and R 15 bond to each other via sulfur of 1 to 10 atoms to form a ring, and R 12 , R 13 , and R 18 are hydrogen atoms.

公开(公告)号：EP3928977A1

公开(公告)日：2021-12-29

申请号：EP20759093.6

申请日：2020-02-14

Applicant: NITTO DENKO CORPORATION ,  Kyushu University, National University Corporation

Inventor： HONDA Satoshi ,  KOSAKA Naofumi ,  MASUDA Shotaro ,  YASUI Atsushi ,  AGO Hiroki ,  KAWAHARA Kenji ,  OYAMA Shun

IPC: B32B9/00 ,  C09J201/00 ,  B32B37/02 ,  B32B37/16 ,  B32B37/26 ,  C09J7/38

Abstract: The present invention relates to a laminate including a two-dimensional material and an adhesive sheet having a base material and an adhesive layer whose adhesive force decreases due to ultraviolet rays or heat, in which an adhesive force A at 25°C of the adhesive layer before the ultraviolet rays or heat applies, to a silicon wafer is 1.0 N/20 mm to 20.0 N/20 mm when the adhesive layer is subjected to 180° peeling at a tensile speed of 300 mm/min, and a surface roughness of an adhesive surface of the adhesive layer after the ultraviolet rays or heat has been applied is 0.01 µm to 8.00 µm.