摘要:
LED lighting apparatus including (a) a circuit board which has a plurality of light sources spaced thereon, (b) a heat sink to which the circuit board is thermally coupled, and (c) a securement structure which includes a rigid peripheral structure applying force along a peripheral area of the circuit board toward the heat sink to increase the thermal coupling therebetween to facilitate heat transfer from the light sources during operation. The lighting apparatus may also include an optical member with a plurality of lens portions over corresponding light sources and a peripheral region, the securement structure engaging the peripheral region which sandwiches a gasket against the heat sink. The apparatus may use manipulation involving surface convexity, such as bowing, thereby allowing the securement structure to further facilitate surface-to-surface thermal coupling between the circuit board and the heat sink.
摘要:
Embodiments of a semiconductor device having increased channel mobility and methods of manufacturing thereof are disclosed. In one embodiment, the semiconductor device includes a substrate including a channel region and a gate stack on the substrate over the channel region. The gate stack includes an alkaline earth metal. In one embodiment, the alkaline earth metal is Barium (Ba). In another embodiment, the alkaline earth metal is Strontium (Sr). The alkaline earth metal results in a substantial improvement of the channel mobility of the semiconductor device.
摘要:
A method of tuning a light-emitting diode (27) is provided, comprising the steps of: measuring the wavelength and/or radiant flux produced by the light-emitting diode, and thereafter covering the diode with an amount of phosphor (34) combined with a polymer resin (33) that produces a selected colour based upon the measured colour and the added phosphor in the resin.
摘要:
A method of forming a semiconductor device may include forming a semiconductor structure (14) on a substrate (12) wherein the semiconductor structure (14) defines a mesa (20) having a mesa surface (20A) opposite the substrate (12) and mesa sidewalls between the mesa surface and the substrate. A first passivation layer (30) can be formed on at least portions of the mesa sidewalls and on the substrate (12) adjacent the mesa sidewalls wherein at least a portion of the mesa surface (20A) is free of the first passivation layer (30) and wherein the first passivation layer (30) comprises a first material. A second passivation layer (40) can be formed on the first passivation layer (30) wherein at least a portion of the mesa surface (20A) is free of the second passivation layer (40), and wherein the second passivation layer (40) comprises a second material different than the first material. Related devices are also discussed.
摘要:
Silicon carbide channel semiconductor devices are provided which eliminate the insulator of the gate by utilizing a semiconductor gate layer and buried base regions to create a "pinched off" gate region when no bias is applied to the gate. In particular embodiments of the present invention, the semiconductor devices include a silicon carbide drift layer of a first conductivity type, the silicon carbide drift layer having a first face and having a channel region therein. A buried base region of a second conductivity type semiconductor material is provided in the silicon carbide drift layer so as to define the channel region. A gate layer of a second conductivity type semiconductor material is formed on the first face of the silicon carbide drift layer adjacent the channel region of the silicon carbide drift layer. A gate contact may also be formed on the gate layer. Both transistors and thyristors may be provided.
摘要:
A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
摘要:
Edge termination for silicon carbide devices has a plurality of concentric floating guard rings in a silicon carbide layer that are adjacent and spaced apart from a silicon carbide-based semiconductor junction. An insulating layer, such as an oxide, is provided on the floating guard rings and a silicon carbide surface charge compensation region is provided between the floating guard rings and is adjacent the insulating layer. Methods of fabricating such edge termination are also provided.
摘要:
Assume that the two groups of lighting fixtures are located in the same general area, employ daylighting, and provide light that can be sensed by each other. A first group will determine an actual lighting contribution provided by the second group and remove the actual lighting contribution provided by the second group when making daylighting decisions. As such, when the dimming level of the second group is changed, the first group will effectively ignore changes in the dimming level of the second group when making daylighting decisions, and vice versa. A group of lighting fixtures may include one or more lighting fixtures.
摘要:
An optical element for a light source and a lighting system using the optical element are disclosed. In example embodiments, the optical element includes an entry surface and an exit surface opposite the entry surface. The entry surface includes at least three subsurfaces, wherein each subsurface is disposed to receive light rays leaving light source. Each of the three subsurfaces is geometrically shaped and positioned to receive light rays entering the optical element through that subsurface in order to direct the light passing through the optical element. In some embodiments the optical element includes a concentrator lens disposed in the exit surface. The optical element can also include a mixing treatment. A lighting system can include multiple optical elements, each paired with a light source such as an LED or LED package.
摘要:
A light emitting device includes a p-type semiconductor layer, an n-type semiconductor layer, and an active region between the n-type semiconductor layer and the p-type semiconductor layer. A non-transparent feature, such as a wire bond pad, is on the p-type semiconductor layer or on the n-type semiconductor layer opposite the p-type semiconductor layer, and a reduced conductivity region is in the p-type semiconductor layer or the n-type semiconductor layer and is aligned with the non-transparent feature. The reduced conductivity region may extend from a surface of the p-type semiconductor layer opposite the n-type semiconductor layer towards the active region and/or from a surface of the n-type semiconductor layer opposite the p-type semiconductor layer towards the active region.