公开(公告)号：EP3256285A1

公开(公告)日：2017-12-20

申请号：EP16706552.3

申请日：2016-02-10

申请人： Trumpf Laser- und Systemtechnik GmbH

发明人： WÜST, Frank Peter ,  KÖNIG, Thomas ,  BUCHBINDER, Damien ,  WAGNER, Joachim ,  BAUER, Johannes

IPC分类号： B23K26/073 ,  B22F3/105 ,  B29C67/00 ,  B23K26/342 ,  B23K26/082

CPC分类号： B23K26/342 ,  B22F3/1055 ,  B22F2003/1056 ,  B23K26/073 ,  B23K26/0736 ,  B23K26/082 ,  B29C64/153 ,  B29C64/268 ,  B33Y30/00 ,  B33Y50/00 ,  Y02P10/295

摘要： The invention relates to an irradiation apparatus (1) for a processing machine for manufacturing three-dimensional components by irradiating powder layers with a high-energy beam, in particular a laser beam (3), the irradiation apparatus (1) comprising: a beam forming device (14) for forming a beam profile (6, 6') for the high-energy beam, said beam profile having a length (L) along a first direction (X) perpendicularly to the beam axis (Z) of the high-energy beam as well as a width (B), which is shorter than the length (L), along a second direction (Y) perpendicularly to the beam axis (Z) of the high-energy beam; and a scanner device (15) for orienting the high-energy beam onto a position in a processing field (11) of the scanner device (15) in order for a powder layer (25) to be irradiated with the high-energy beam, the irradiation apparatus (1) being designed to change the length (L) and/or the width (B) of the beam profile (6, 6') of the high-energy beam in the processing field (11) in accordance with the position of the high-energy beam in the processing field (11). The invention also relates to a processing machine comprising an irradiation apparatus (1) of said type as well as a method for creating a layer or at least one section of a layer of a three-dimensional component.

公开(公告)号：EP2388103B1

公开(公告)日：2017-08-02

申请号：EP09837544.7

申请日：2009-12-04

申请人： Hamamatsu Photonics K.K.

发明人： FUKUMITSU, Kenshi ,  OISHI, Shingo ,  AOSHIMA, Shinichiro

IPC分类号： B23K26/38 ,  B23K26/03 ,  B23K26/06 ,  B23K26/073 ,  B23K26/08 ,  B23K26/40 ,  H01L21/301

CPC分类号： B23K26/0736 ,  B23K26/0057 ,  B23K26/0617 ,  B23K26/0738 ,  B23K26/08

公开(公告)号：EP2643187B1

公开(公告)日：2017-04-12

申请号：EP11776781.4

申请日：2011-10-28

申请人： Johnson Controls Metals and Mechanisms GmbH & Co. KG

发明人： BECKER, Burckhard ,  FUCHS, Peter ,  GITTERMANN, Thomas ,  SCHMIDT, Harald

IPC分类号： B60N2/07 ,  B08B7/00 ,  C21D1/09

CPC分类号： B08B7/0042 ,  B05D3/06 ,  B23K26/032 ,  B23K26/0736 ,  B23K26/0869 ,  B23K26/364 ,  B23K26/40 ,  B23K2201/006 ,  B23K2201/34 ,  B23K2203/04 ,  B23K2203/172 ,  B23K2203/50 ,  B60N2/0722 ,  C21D1/09 ,  C21D9/0068 ,  C21D2221/00

公开(公告)号：EP2599582A4

公开(公告)日：2017-01-04

申请号：EP11812314

申请日：2011-07-19

申请人： HAMAMATSU PHOTONICS KK

发明人： SHIMOI HIDEKI ,  ARAKI KEISUKE

IPC分类号： H01L21/306 ,  B23K26/00 ,  B23K26/38

CPC分类号： B23K26/40 ,  B23K26/0006 ,  B23K26/0057 ,  B23K26/006 ,  B23K26/064 ,  B23K26/0736 ,  B23K26/382 ,  B23K26/384 ,  B23K2203/50 ,  B23K2203/56 ,  H01L21/30608 ,  H01L21/76898

摘要： A substrate processing method for forming a space extending along a predetermined line in a silicon substrate includes a first step of converging a laser light which is an elliptically-polarized light having an ellipticity other than 1 at the substrate so as to form a plurality of modified spots within the substrate along the line and produce a modified region including the modified spots, and a second step of anisotropically etching the substrate so as to advance an etching selectively along the modified region and form the space in the substrate. In the first step, the light is converged at the substrate such that a moving direction of the light with respect to the substrate and a direction of polarization of the light form an angle of 45° or greater therebetween, and the modified spots are made align in one row along the line.

摘要翻译： 在硅衬底中形成沿着预定线延伸的空间的衬底处理方法包括：在衬底处会聚作为具有除了1以外的椭圆率的椭圆偏振光的激光的第一步骤，以形成多个经修改的 并且产生包含改性斑点的改性区域，以及第二步骤，各向异性地蚀刻衬底，以沿着改质区域选择性地进行刻蚀，并形成衬底中的空间。 在第一步骤中，光在基板处会聚，使得光相对于基板的移动方向和光的偏振方向在其间形成45°或更大的角度，并且将修改的光点对准 沿着一行。

公开(公告)号：EP3107680A1

公开(公告)日：2016-12-28

申请号：EP15752534.6

申请日：2015-02-20

申请人： Dmg Mori Seiki Advanced Solutions Inc.

发明人： HYATT, Gregory, A. ,  CHAPHALKAR, Nitin ,  HRANKA, Karl ,  PANZARELLA, Michael, J.

IPC分类号： B23K26/10

CPC分类号： B23K26/144 ,  B23K26/073 ,  B23K26/0732 ,  B23K26/0736 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/0876 ,  B23K26/1482 ,  B23K26/342 ,  B33Y10/00 ,  B33Y30/00

摘要： A processing head assembly is provided for use with a movable tool holder of a machine tool. The processing head assembly includes an upper processing head coupled to the movable tool holder and having a body defining a socket, and a feed powder/propellant port coupled to the body and operably coupled to a feed powder/propellant supply. The processing head assembly further includes a lower processing head having a base configured to be releasably coupled to the socket, and a nozzle coupled to the base and defining a feed powder/propellant interface configured to detachably couple to the feed powder/propellant port and a nozzle exit orifice.

摘要翻译： 提供了一种用于机床的可移动工具架的加工头组件。 处理头组件包括联接到可移动工具保持器并具有限定插座的主体的上加工头，以及联接到主体并可操作地联接到进料粉末/推进剂供应的进料粉末/推进剂口。 处理头组件还包括下处理头，其具有构造成可释放地联接到插座的基部，以及联接到基部并且限定被构造成可拆卸地联接到进料粉末/推进剂端口的进料粉末/推进剂界面的喷嘴，以及 喷嘴出口孔。

公开(公告)号：EP2965853B1

公开(公告)日：2016-09-21

申请号：EP14176292.2

申请日：2014-07-09

申请人： High Q Laser GmbH

发明人： Matylitsky, Victor V. ,  Hendricks, Frank

IPC分类号： B23K26/073 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40

CPC分类号： B23K26/53 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/0736 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56 ,  C03B33/0222 ,  C03B33/04 ,  Y02P40/57

摘要： Method for processing of material by use of a pulsed laser, comprising generating a series of ultra-short laser pulses (22),directing each laser pulse (22) to the material with defined reference to a respectively assigned processing point (26) of a processing path (25), and focussing each laser pulse (22) so that respective focal points of the focussed laser pulses (22) comprise pre-defined spatial relations to a first surface (2) of the material, wherein each emitted laser pulse (22) effects a respective crack (24) within the material. According to the invention, each laser pulse is shaped regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of asymmetric shape and defines a main extension axis (A) as to its asymmetric extension. One major crack (24) is effected by each laser pulse (22), the major crack (12,24) having a lateral extension basically oriented according to the main extension axis (A) of the respective pulse in the focal point. Furthermore, each laser pulse (22) is emitted so that the orientation of its main extension axis (A) in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path (25) at the assigned processing point (26)

公开(公告)号：EP2724993B1

公开(公告)日：2016-02-03

申请号：EP14152259.9

申请日：2010-11-24

申请人： Corning Incorporated

发明人： Li, Xinghua

IPC分类号： C03B33/033 ,  C03B33/09 ,  B23K26/073 ,  C03B33/08

CPC分类号： C03B33/091 ,  B23K26/0736 ,  C03B33/033 ,  C03B33/082 ,  Y02P40/57

公开(公告)号：EP2965853A1

公开(公告)日：2016-01-13

申请号：EP14176292.2

申请日：2014-07-09

申请人： High Q Laser GmbH

发明人： Matylitsky, Victor V. ,  Hendricks, Frank

IPC分类号： B23K26/073 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40

CPC分类号： B23K26/53 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/0736 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/56 ,  C03B33/0222 ,  C03B33/04 ,  Y02P40/57

摘要： Method for processing of material by use of a pulsed laser, comprising generating a series of ultra-short laser pulses (22),directing each laser pulse (22) to the material with defined reference to a respectively assigned processing point (26) of a processing path (25), and focussing each laser pulse (22) so that respective focal points of the focussed laser pulses (22) comprise pre-defined spatial relations to a first surface (2) of the material, wherein each emitted laser pulse (22) effects a respective crack (24) within the material. According to the invention, each laser pulse is shaped regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of asymmetric shape and defines a main extension axis (A) as to its asymmetric extension. One major crack (24) is effected by each laser pulse (22), the major crack (12,24) having a lateral extension basically oriented according to the main extension axis (A) of the respective pulse in the focal point. Furthermore, each laser pulse (22) is emitted so that the orientation of its main extension axis (A) in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path (25) at the assigned processing point (26)

摘要翻译： 一种通过使用脉冲激光来处理材料的方法，包括产生一系列超短激光脉冲（22），将每个激光脉冲（22）引导到所述材料上，所述激光脉冲定义参考分配的处理点（26） 处理路径（25），并且聚焦每个激光脉冲（22），使得聚焦的激光脉冲（22）的各个焦点包括与材料的第一表面（2）的预定的空间关系，其中每个发射的激光脉冲 22）在材料内产生相应的裂纹（24）。 根据本发明，每个激光脉冲关于其光束轮廓成形，使得由其激光脉冲在其焦点上与其传播方向垂直的横截面限定的横截面面积是不对称形状并且限定主体 延伸轴（A）对其不对称延伸。 一个主要裂纹（24）由每个激光脉冲（22）实现，主裂纹（12,24）具有根据焦点中相应脉冲的主延伸轴（A）基本取向的横向延伸。 此外，发射每个激光脉冲（22），使得其焦点中其主延伸轴线（A）的取向对应于相对于处理路径（25）的相应切线的取向的预定义取向 指定处理点（26）

公开(公告)号：EP2873481A1

公开(公告)日：2015-05-20

申请号：EP13192684.2

申请日：2013-11-13

申请人： Asahi Glass Co., Ltd.

发明人： Stura, Enrico ,  Linder, Michael

IPC分类号： B23K9/013 ,  B23K26/073 ,  B23K26/36 ,  B23K26/40 ,  C03B33/02 ,  C03B33/09 ,  C03B33/10

CPC分类号： B23K9/013 ,  B23K26/0732 ,  B23K26/0736 ,  B23K26/364 ,  B23K26/40 ,  B23K2203/50

摘要： A method and an apparatus for forming a groove in a substrate are described. The method comprises providing a substrate having a surface and providing a heating spot in a region of the surface. Heat is applied to the substrate through the heating spot. The heating spot has a first dimension in a first direction and a second dimension in a second direction perpendicular to the first direction. The first dimension is greater than the second dimension. The heating spot is moved on the surface relative to the substrate at least partially along the first direction, while applying heat to the substrate through the heating spot, such that material of the substrate previously subjected to the heating spot is lifted from the substrate.

摘要翻译： 一种用于在基片的槽的成形方法和装置进行说明。 该方法包括提供具有表面和在所述表面的一个区域中提供加热斑一个基材。 热量通过加热斑施加到基材上。 加热斑具有在第一方向和第二方向上的第二尺寸的第一维度垂直于所述第一方向。 第一尺寸比第二尺寸大。 加热点移动相对于所述基片的表面沿着所述第一方向至少部分上，同时通过加热斑将热量施加到基材，检查没有预先进行加热斑的基板的材料从基底抬起。

公开(公告)号：EP2724993A3

公开(公告)日：2014-08-20

申请号：EP14152259.9

申请日：2010-11-24

申请人： Corning Incorporated

发明人： Li, Xinghua

IPC分类号： C03B33/033 ,  C03B33/09 ,  B23K26/073 ,  C03B33/08

CPC分类号： C03B33/091 ,  B23K26/0736 ,  C03B33/033 ,  C03B33/082 ,  Y02P40/57

摘要： Methods of forming scribe vents in a strengthened glass substrate having a compressive surface layer and an inner tension layer are provided. In one embodiment, a first and second defect is formed to partially expose the inner tension layer. A first scribe vent may be generated in a first scribing direction by translating a laser beam and a cooling jet on a surface of the strengthened glass substrate at a first scribing speed. A second scribe vent intersecting the first scribe vent may be generated in a second scribing direction by translating the laser beam and the cooling jet on the surface of the strengthened glass substrate at a second scribing speed that is greater than the first scribing speed. The defects may be perpendicular to the scribing directions. In another embodiment, the first scribe vent may be fused at an intersection location prior to generating the second scribe vent.