摘要:
The invention relates to a coating installation (2000) comprising a coating chamber (2001) and at least one substrate holder (2002) that is arranged in a displaceable manner inside the coating chamber (2001) to accommodate substrates (2003) that are to be coated. The coating installation (2000) also comprises a radio device with at least one first radio (2004) that is connected to the substrate holder (2002), and a second radio (2005) that is disposed at least partially outside the coating chamber (2001). A radio link for transmitting information is at least temporally disposed between the first (2004) and the second radio (2005).
摘要:
The invention provides a method and apparatus for producing uniform, isotropic stresses in a sputtered film. In the presently preferred embodiment, a new sputtering geometry and a new domain of transport speed are presented, which together allow the achievement of the maximum stress that the film material can hold while avoiding X-Y stress anisotropy and avoiding stress non-uniformity across the substrate.
摘要:
Textured coatings for implantable medical devices can be provided in metallic or polymer surface layers having surface texture factors down to nanometer and sub-nanometer levels. Implantable devices having such textured surfaces and methods of coating such devices comprises providing a substrate surface of an implantable device and forming a coating layer of the substrate surface by directing a mixture of atoms of a first type of material and a second type of material toward the substrate surface while simultaneously and collinearly bombarding the substrate surface with ions, wherein the first type of material is substantially resistant to a removal process and the second type of material is substantially susceptible to a removal process.
摘要:
A sputtering apparatus (10) is provided which is capable of forming a coating film (6) made of a metallic film on a coating surface (4) of a substrate (3) by sputtering to have such a film thickness that gradually increases or gradually decreases from its one end side to the other end side. The apparatus comprising: at least one supporting means (38) supporting at least one substrate (3) such that a coating surface (4) thereof is opposed to an emission surface (24) of a sputtering target (22) at an angle; and at least one shielding member (3,66) for preventing part of sputtering particles emitted from the emission surface from reaching the coating surface, the at least one shielding member being disposed in the vacuum chamber so as to be positioned in a space (α) between the coating surface of the at least one substrate and the emission surface of the sputtering target.
摘要:
The invention relates to a partially disposable substrate holder used in magnetic latches for securing substrates on a planetary rotating platform suspended above a coating source in a vacuum chamber of a vapor deposition system, e.g. a chemical vapor deposition (CVD) system or a physical vapor deposition (PVD) system. The substrate holder includes a reusable base formed, at least partially, from a ferro-magnetic material, which is attracted to the magnetic latch, and a disposable cover formed from a relatively inexpensive, ferromagnetic, easily formable material, which encourages adherence of coating material and has a low vapor pressure at coating temperatures.
摘要:
The invention relates to a magnetic latch for securing substrates on a planetary rotating platform suspended above a coating source in a vacuum chamber of a vapor deposition system, e.g. a chemical vapor deposition (CVD) system or a physical vapor deposition (PVD) system. The magnetic latch includes a permanent magnetic, which is moveable between a latching position, in which the permanent magnet magnetizes the latch for attracting a substrate holder, and an unlatching position, in which the permanent magnet is connected in a bypass circuit, thereby demagnetizing the latch for releasing the substrate holder.
摘要:
A wafer holder (15) including a wafer stage (1) and a wafer stage outer-ring (2) surrounding the wafer stage (1) wherein the wafer stage (1) has a diameter smaller than the diameter of a wafer (5) loaded on the wafer stage (1), the wafer stage outer-ring (2) has an inner diameter at the upper side of the outer-ring (2) which is larger than the diameter of the wafer (5) loaded on the wafer stage (1), and the upper surface of the outer-ring (2) lies above the upper surface of the wafer (5) loaded on the wafer stage (1).
摘要:
A heater for growing a thin film on substrates contained on a substrate support member (110) includes a plurality of heater elements (101). The substrate support member (110) containing the substrates is at least partially surrounded by the plurality of heater elements (101). At least two of the plurality of heater elements are moveable with respect to one another so as to provide external access to the substrate support member. An oxygen pocket is formed in one of the heater elements or a separate oxygen pocket member (108) and is used for oxidation of the film on the substrates.
摘要:
In order to simplify insertion and removal of work pieces (25, 27) in a reactor for plasma coating and to increase throughput, the invention provides for a coating device (1) comprising a reactor (18) with a movable sleeve part (19) and a base element (33), wherein at least one sealed coating chamber (15, 17) is defined between the sleeve part (19) and the base part (33) in side-by-side position, in addition to a device (2) for discharging electromagnetic energy in the at least one coating chamber (15, 17), wherein the reactor (18) has at least two coating stations (12, 14).
摘要:
Die Erfindung betrifft eine Vorrichtung (1) sowie ein Verfahren zum Halten sowie zum Drehen und/oder Wenden eines Gegenstands, insbesondere eines optischen Elements wie z.B. einer Linse (2), bei dessen Beschichtung in einer Vakuumbeschichtungsanlage. Die Vorrichtung umfasst einen individuellen Halter (3) mit dem der Gegenstand (2) gehalten wird. Erfindungsgemäß ist vorgesehen, dass dem individuellen Halter (3) wenigstens ein individueller Antrieb (9) zugeordnet ist, mit dem der individuelle Halter (3) gedreht und/oder gewendet wird.