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    A heat transfer unit
    51.
    发明公开
    A heat transfer unit 失效
    Vorrichtung zurWärmeübertragung

    公开(公告)号：EP0767415A3

    公开(公告)日：1999-05-06

    申请号：EP96307020.6

    申请日：1996-09-26

    Applicant: NCR International, Inc.

    Inventor： Aguilera, Rafael E.

    IPC: G06F1/20

    CPC classification number: G02F1/133382 ,  F28D15/0266 ,  F28D2021/0029 ,  F28F3/025 ,  G06F1/203 ,  G06F2200/201

    Abstract: In a laptop computer (10), CPU-generated heat is thermally conducted passively to a radiator-like element (80) disposed behind the LCD (70), which uses the heat to warm the LCD (70). The CPU (20) is surrounded by a liquid-tight housing (40) containing a biphase coolant (130). A first tube (110) in fluid communication with an outlet port (160) in the housing (40) conveys heat-vaporized coolant to an input port (90) on the radiator (80). The coolant flows through a plurality of columns (240) formed in the radiator-like element (80), transferring heat and condensing in the process. The transferred heat is radiated to the LCD (70), which is desirably warmed in the process. The condensed coolant is conducted from an outlet port (100) in the radiator-like element (80) through a second tube (120) to an input port (50) in the housing (40). A pressure sensor (220) may be included to provide a coolant pressure drop signal that can be used to shutdown the CPU (20) in the event of a coolant leak.

    Abstract translation: 在笔记本电脑中，CPU产生的热被热传导到设置在LCD背后的散热器状元件，其使用热量来加热LCD。 CPU由包含双相冷却液的液密壳体包围。 与壳体中的出口流体连通的第一管将热汽化的冷却剂输送到散热器上的输入端口。 冷却剂流过形成在散热器状元件中的多个塔，在该过程中传热和冷凝。 转移的热量被辐射到LCD，在该过程中期望温暖。 冷凝的冷却剂从散热器状元件中的出口通过第二管传导到壳体中的输入端口。 可以包括压力传感器以提供可用于在冷却剂泄漏的情况下关闭CPU的冷却剂压降信号。

    EXPANDABLE REFRIGERATED ENCLOSURE FOR COMPUTER BOARDS
    52.
    发明授权
    EXPANDABLE REFRIGERATED ENCLOSURE FOR COMPUTER BOARDS 失效
    扩展冷冻资格的住房电脑线路板

    公开(公告)号：EP0550654B1

    公开(公告)日：1996-10-23

    申请号：EP91918349.1

    申请日：1991-09-16

    Applicant: FALLIK, Joel

    Inventor： FALLIK, Joel

    IPC: H05K7/20 ,  H05K5/00 ,  H05K7/00

    CPC classification number: G06F1/20 ,  G06F2200/201

    Abstract: Expandable enclosures (10, 12) for computer circuit boards include thermoelectric cooling (22) for temperature control and are sealed to exclude dust and liquids. Expansion sections (14A, 14B) to house additional circuit boards are inserted between stacked sections with data and power interconnections between sections. The stacked configuration permits expansion of board capacity without increasing the lateral dimensions, or footprint, of the enclosure. Related components may also be housed.

    Cooling system of electronic computer
    53.
    发明公开
    Cooling system of electronic computer 失效
    Elektronisches-电脑Kühlsystem。

    公开(公告)号：EP0489326A2

    公开(公告)日：1992-06-10

    申请号：EP91120034.3

    申请日：1991-11-25

    Applicant: HITACHI, LTD.

    Inventor： Ohashi, Shigeo ,  Nakajima, Tadakatsu ,  Kuwahara, Heikichi ,  Hatada, Toshio ,  Matsushima, Hitoshi ,  Sato, Motohiro ,  Inouye, Hiroshi ,  Ohba, Takao ,  Yamagiwa, Akira

    IPC: G06F1/20 ,  H05K7/20

    CPC classification number: H05K7/208 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20809

    Abstract: An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members (4, 41) for thermally connecting semiconductor devices (1) whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards (2) onto which the semiconductor devices (1) and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing (5). Or, the circuit boards (2) and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members (4, 41) is obtained.

    Abstract translation: 一种电子计算机冷却系统，具有用于冷却电子计算机的冷却装置和用于将通过冷却升高其运行速度的半导体装置（1）冷却到冷却装置的低温源的冷却构件（41,41）。 安装构成电子计算机的半导体装置（1）等的电路板（2），冷却装置等冷却装置紧密地封闭在单个壳体（5）中。 或者，电路板（2）和冷却装置分别紧密地封闭在分离的可拆卸的壳体中。 因此，可以获得通过使用冷却部件（41,41）可靠地冷却期望的半导体器件的结构。

    Cooling system
    54.
    发明公开
    Cooling system 失效
    Kühlsystem。

    公开(公告)号：EP0444570A2

    公开(公告)日：1991-09-04

    申请号：EP91102729.0

    申请日：1991-02-25

    Applicant: FUJITSU LIMITED

    Inventor： Yamamoto, Haruhiko ,  Fujisaki, Akihiko

    IPC: G06F1/20

    CPC classification number: G06F1/206 ,  G06F2200/201

    Abstract: A cooling system comprising an airtight box (3) which accommodates a cooling module (2) and an electronic device (1) which is cooled by the cooling module and has a door (3B) which is opened when attending to maintenance of parts within the airtight box, a dew condensation preventing unit (8, 9) for absorbing humidity within the airtight box and/or replacing air or gas within the airtight box when operated, a coolant supply unit (4) for recirculating a coolant (5) between the coolant supply unit and the cooling module, and a controller (10) for operating the coolant supply unit and the dew condensation preventing unit in response to a first instruction signal (F1) which instructs a cooling operation, and for stopping the coolant supply unit in response to a second instruction signal (F2) which instructs the maintenance of the parts within the airtight box, where only one of the first and second instruction signals exists at one time. The controller (10) includes a circuit part (101) responsive to the second instruction signal for supplying an operating signal (S5) to the electronic device to operate the electronic device for a predetermined time, so that the electronic device rises to a predetermined temperature (To) due to heat generated by the electronic device itself.

    Abstract translation: 一种冷却系统，包括容纳冷却模块（2）的气密盒（3）和由所述冷却模块冷却的电子装置（1），并且具有门（3B），所述门在所述门 气密箱，用于吸收气密箱内的湿度和/或在操作时更换气密箱内的空气或气体的防凝露单元（8,9）;冷却剂供应单元（4），用于使冷却剂 冷却剂供应单元和冷却模块;以及控制器（10），用于响应于指示冷却操作的第一指令信号（F1）和用于使冷却剂供应单元停止的操作，冷却剂供应单元和防凝结单元 响应于第二指令信号（F2），其指示在一个时间内仅存在第一和第二指令信号中的一个的气密箱内的部件的维护。 控制器（10）包括响应于第二指令信号的电路部分（101），用于向电子设备提供操作信号（S5）以在预定时间内操作电子设备，使得电子设备升高到预定温度 （To）由于电子设备本身产生的热量。

    Cooling apparatus
    55.
    发明公开
    Cooling apparatus 失效
    冷却装置

    公开(公告)号：EP0379211A3

    公开(公告)日：1990-10-10

    申请号：EP90101085.0

    申请日：1990-01-19

    Applicant: NEC CORPORATION

    Inventor： Matsuo, Yoichi

    IPC: F25D17/02 ,  F25D19/04 ,  H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/208 ,  F25D17/02 ,  F25D19/04 ,  G06F1/20 ,  G06F2200/201

    Abstract: A cooling apparatus (1) includes a main inlet (86) connected to a return tube (85) of a main apparatus (80) to be cooled for receiving coolant from the main apparatus. A main heat exchanger unit (10) connected to the main inlet (86) cools the heated coolant. The main heat exchanger (10) has the capacity for cooling only heat generated by the main apparatus (80). A main outlet (81) is connected to the main apparatus (80) for supplying coolant to the main apparatus. An assistant tube (7) is provided for receiving additional coolant from outside of the cooling apparatus (1), the additional coolant being stored within the cooling apparatus. An optional outlet (91) is connected to a coolant receptacle in the cooling apparatus to supply coolant to an optional apparatus (90).

    ELECTRONIC DEVICE FOR LIQUID IMMERSION COOLING AND COOLING SYSTEM USING SAME
    57.
    发明公开
    ELECTRONIC DEVICE FOR LIQUID IMMERSION COOLING AND COOLING SYSTEM USING SAME 审中-公开

    公开(公告)号：EP3379375A1

    公开(公告)日：2018-09-26

    申请号：EP15908713.9

    申请日：2015-11-16

    Applicant: Exascaler Inc.

    Inventor： SAITO, Motoaki

    IPC: G06F1/20

    CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K7/20236 ,  H05K7/20781

    Abstract: Provided is an electronic device immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in each of a plurality of housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface, and a plurality of slots disposed above the one or more substrate groups, and arranged onto the metal board in parallel, each of which allows a power unit to be housed. The third circuit board is disposed so that the slots are interposed between the third circuit board and the metal board, and the network cable sockets are arranged in parallel on one side of the third circuit board, located at an opening side of the slots.

    ELECTRONIC DEVICE COOLING SYSTEM
    58.
    发明公开
    ELECTRONIC DEVICE COOLING SYSTEM 审中-公开

    公开(公告)号：EP3376339A1

    公开(公告)日：2018-09-19

    申请号：EP15908300.5

    申请日：2015-11-11

    Applicant: Exascaler Inc.

    Inventor： SAITO, Motoaki

    IPC: G06F1/20 ,  H05K7/20

    CPC classification number: F28F19/00 ,  F28F2265/16 ,  F28F2265/30 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20 ,  H05K7/20236 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20763

    Abstract: A cooling system 400 configured to directly cool an electronic device immersed in a coolant includes a cooling tank 50 containing the coolant C, and a leakage receiving portion 21 disposed between the cooling tank 50 and a floor surface 32 so as to receive the coolant L leaked from the cooling tank 50. The cooling tank 50 includes a lower structure 53 fixed to the floor surface 32, an upper structure 51 having the electronic device immersed in the coolant C, and a seismic isolation device 55 disposed between the lower structure 53 and the upper structure 51. It is possible to provide the cooling system which is highly durable against externally exerted strong impact and vibration caused by such disaster as earthquake.

    HEAT TRANSFER DEVICE
    59.
    发明授权
    HEAT TRANSFER DEVICE 有权

    公开(公告)号：EP2807531B1

    公开(公告)日：2018-06-27

    申请号：EP13741406.6

    申请日：2013-01-17

    Applicant: Microsoft Technology Licensing, LLC

    Inventor： RUBENSTEIN, Brandon A.

    IPC: G06F1/20 ,  H01L23/427 ,  H05K7/20

    CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat transfer device is described. In one or more implementations, a device includes a housing that is moveable through a plurality of orientations involving at least two dimensions during usage, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a plurality of heat pipes configured to transfer heat using thermal conductivity and phase transition from the heat-generating device, the plurality of heat pipes arranged to provide generally uniform heat transfer from the heat-generating device during movement of the housing through the plurality of orientations.

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