Etching rate determining method and apparatus
    52.
    发明公开
    Etching rate determining method and apparatus 失效
    Verfahren und Vorrichtung zur Bestimmung derÄtzgeschwindigkeit。

    公开(公告)号:EP0531149A2

    公开(公告)日:1993-03-10

    申请号:EP92308042.8

    申请日:1992-09-04

    CPC分类号: C23F1/00 G01N7/18

    摘要: The etching ability of an etchant for a metal part is monitored by accurately measuring the etching rate with a relatively simple arrangement. The etching rate is determined by channelling a portion of the etchant from an etching tank (4) to a reaction chamber (1), etching a specimen (8) of the same material as the metal part with the etchant portion in the reaction chamber (1), collecting hydrogen gas generated during etching of the specimen, measuring the time taken until a predetermined quantity of hydrogen gas is generated, and computing the etching rate from the measured time.

    摘要翻译: 通过以相对简单的布置精确测量蚀刻速率来监测金属部件的蚀刻剂的蚀刻能力。 蚀刻速率通过将蚀刻剂的一部分从蚀刻槽(4)引导到反应室(1)来确定,蚀刻具有与反应室中的蚀刻部分相同的材料的样品(8) 收集在样品蚀刻期间产生的氢气,测量产生预定量的氢气所需的时间,并从测量的时间计算蚀刻速率。