公开(公告)号：EP3094483B1

公开(公告)日：2023-10-11

申请号：EP14830690.5

申请日：2014-12-17

发明人： FAOTTO, Ugo

IPC分类号： B32B5/18 ,  B32B15/08 ,  E04B1/74 ,  E04B1/76

公开(公告)号：EP4250890A1

公开(公告)日：2023-09-27

申请号：EP21894511.1

申请日：2021-11-09

申请人： TOPPAN INC.

发明人： AOKI, Atsuko ,  KONDO, Shinpei

IPC分类号： H05K9/00 ,  B32B7/025 ,  B32B15/04 ,  B32B15/08 ,  B32B27/18 ,  H01Q17/00

摘要： There is provided a thin electromagnetic wave attenuation film capable of attenuating electromagnetic waves having frequencies in millimeter-wave bands. The present invention provides an electromagnetic wave attenuation film including a dielectric substrate having a front surface and a rear surface, a thin-film conductive layer disposed on the front surface, and a planar inductor or a lamination layer disposed on the rear surface, wherein the thin-film conductive layer includes a plurality of metal plates, and values of natural logarithms obtained by normalizing a thickness T of the metal plates by a skin depth d thereof are in predetermined numerical ranges within a predetermined frequency range. The electromagnetic wave attenuation film is used in the predetermined frequency range, and may have a structure in which the front surface of the dielectric substrate has asperities which include at least two first regions as concavities located at a relatively low level, and a second region located at a relatively high level; the thin-film conductive layer includes a plurality of metal plates arranged in the at least two first regions; the at least two first regions are discretely arranged; and the second region is located between the two first regions. A top coat layer may be provided on the thin-film conductive layer.

公开(公告)号：EP4245522A1

公开(公告)日：2023-09-20

申请号：EP22740272.4

申请日：2022-01-27

申请人： Mutsuki Electric Co., Ltd.

发明人： SAI, Seiichi

IPC分类号： B32B15/08

摘要： A metal-resin joined body having a high joining strength is obtained. The metal-resin joined body of the invention is a metal-resin joined body 10 including a metal member 30 made of a metal and a resin member 20 made of a thermoplastic resin, in which a resin joint surface 22 of the resin member 20 is joined to a metal joint surface 32 of the metal member 30. The metal member 30 includes an anchor portion 34 protruding from the metal joint surface 32. The anchor portion 34 includes an aggregate 38 of a plurality of metal particles 36, and a plurality of voids 40 formed between the plurality of metal particles 36. The plurality of voids 40 are connected inside the anchor portion 34 and are connected from a surface of the anchor portion 34 to the inside of the anchor portion 34.

公开(公告)号：EP3287547B1

公开(公告)日：2023-09-13

申请号：EP16783149.4

申请日：2016-04-19

发明人： INOUE Goro ,  SUGITA Haruka ,  OKUMURA Hiroshi

IPC分类号： C23F1/28 ,  B32B15/08 ,  C08L101/00 ,  B29C45/14 ,  B32B38/10 ,  C25D5/48 ,  C23C18/16 ,  C23C18/38 ,  B29K705/12 ,  B32B38/00 ,  B29K705/10 ,  C25D3/12 ,  C25D3/30 ,  C25D3/34 ,  C25D3/46 ,  C25D3/54

公开(公告)号：EP3467038B1

公开(公告)日：2023-09-06

申请号：EP17806662.7

申请日：2017-05-30

发明人： TONOUCHI, Shunsuke ,  SHIMADA, Tomokazu ,  DANJOUBARA, Kazutoshi ,  FUKUDA, Tomio ,  KAKITANI, Minoru

IPC分类号： B32B5/28 ,  B32B15/08 ,  B32B15/088 ,  C08G73/00 ,  C08J5/24 ,  C08L15/00 ,  C08L35/06 ,  H05K1/03 ,  C08G73/12 ,  C08L79/08

公开(公告)号：EP3439869B1

公开(公告)日：2023-09-06

申请号：EP17711670.4

申请日：2017-03-21

发明人： PENNING, Jan Paul ,  OOSTERMAN, Daniel Roy

IPC分类号： B32B15/08 ,  B32B37/20 ,  B32B37/15

公开(公告)号：EP3160734B1

公开(公告)日：2023-09-06

申请号：EP15814784.3

申请日：2015-06-29

发明人： FATHI, Zakaryae ,  BOURKE, Frederic A. Jr. ,  WALDER, Harold

IPC分类号： C09J5/02 ,  B32B25/14 ,  B32B25/12 ,  B32B25/10 ,  B32B15/08 ,  B32B7/06 ,  B32B5/02 ,  B32B7/12 ,  C09J121/00 ,  C09J107/00 ,  C09J4/00 ,  C08F2/48 ,  C09J7/10 ,  H01L23/00

公开(公告)号：EP2961801B1

公开(公告)日：2023-08-23

申请号：EP14757422.2

申请日：2014-02-21

发明人： VIRKAR, Ajay ,  YANG, Xiqiang ,  LI, Ying-Syi ,  MCKEAN, Dennis ,  LEMIEUX, Melburne, C.

IPC分类号： C09D11/52 ,  B82Y30/00 ,  B32B15/02 ,  B32B15/08 ,  B32B15/18 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  H03K17/96 ,  H05K1/09 ,  G06F3/044 ,  B32B27/40 ,  H05K3/02 ,  H05K3/06 ,  H05K3/12

公开(公告)号：EP4223503A1

公开(公告)日：2023-08-09

申请号：EP21875443.0

申请日：2021-09-24

申请人： Toray Industries, Inc. ,  Du Pont-Toray Co., Ltd.

发明人： MITSUOKA Hideto ,  KIYAMA Hiroshi ,  KIMOTO Yukitane ,  MACHIDA Hideaki ,  OKUI Masakazu

IPC分类号： B32B5/28 ,  B29B11/16 ,  B29C70/16 ,  B32B15/08 ,  B32B27/34 ,  B29K105/06 ,  B29L9/00

摘要： Provided are: a molding base material characterized by having at least a fiber-reinforced resin prepreg layer, a fiber paper layer, and a partition layer interposed between the prepreg layer and the fiber paper layer; a molded product obtained using the same; and a production method therefor. The present invention makes it possible to achieve high thermal resistance and heat insulation as well as improved overall space efficiency and weight reduction in a fiber-reinforced resin molded product.

公开(公告)号：EP4216347A1

公开(公告)日：2023-07-26

申请号：EP21898513.3

申请日：2021-11-19

申请人： LG Energy Solution, Ltd.

发明人： KIM, Yong

IPC分类号： H01M50/129 ,  H01M50/105 ,  H01M50/131 ,  B32B7/022 ,  B32B15/08

摘要： The present invention relates to a pouch film for a secondary battery and a method for manufacturing the pouch film, wherein a stretchable auxiliary layer of a multi-layered structure in which a plurality of layers having different elongation rates are bonded in included, so that stress at the interface of each layer is relieved and the moldability of a pouch is improved during pouch molding, and the risk of breakage of a pouch is significantly reduced and defect rates are reduced in a pouch manufacturing process, thereby reducing manufacturing costs.
The pouch film for a secondary battery according to the present invention is a pouch film for a secondary battery for manufacturing a pouch-type battery case and includes a sealant layer formed as the innermost layer, a surface protection layer formed as the outermost layer, a gas barrier layer laminated between the sealant layer and the surface protection layer, and a stretchable auxiliary layer laminated between the gas barrier layer and the surface protection layer, and formed by bonding a plurality of layers having different elongation rates.