摘要:
Diglycidyl ethers represented by general formula (I) (wherein R?1 and R2¿ are the same or different and each represents a C¿1-6? alkyl); a composition comprising the same and an epoxy resin; and a cured epoxy resin obtained by curing this composition. The diglycidyl ethers are used as a reactive diluent for epoxy resins.
摘要:
A perfluoro group-containing compound are represented by the following formula (I): -Rf- is a perfluoro group; and -A represents -OH or a group: or -C y F 2y+1 or -C z F 2z-1 and a perfluoro group-containing polymerizable compound represented by the following formula (II):
R 1 ―O―CH 2 ―CH(OH)―CH 2 ―O―Rf―B (II)
In Formula (II), -Rf- is a perfluoro group; -B is -OH or -O-CH 2 -CH(OH)-CH 2 -O-R 2 , or -C y F 2y+1 or -C z F 2z-1 ; and R 1 and R 2 each is a dehydroxyl residue of a (meth)acryloyl group-containing compound or a vinyl group-containing compound. The hardened polymer from the compound has water-repellency, oil-repellency and adhering ability.
摘要:
A stilbene type epoxy resin represented by the general formula (1) consisting of 100 mol% of the cis -isomer, or 10 mol% or more of the cis -isomer and the rest of the trans -isomer: wherein R 1 to R 8 are independently an acyclic or cyclic alkyl group having 1 to 6 carbon atoms, hydrogen atom or a halogen atom, and a production process thereof. The invention provides a stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known.
摘要:
The present invention relates to a phenolic compound of formula I:
and to an epoxy resin of the formula II:
In the above formulae I and II Ar is an aromatic moiety, L is a divalent hexanenorbornane linking moiety, L' is a divalent cycloaliphatic moiety, Gly is a glycidyl ether group, and each of m and n is a number within the range of 0 to 10. The above phenols include the product of addition reaction of phenol with a cyclohexenenorbornene compound such as 5-(3-cyclohexen-1-yl)bicyclo[2.2.1]hept-2-ene and the above epoxy resins include the glycidation product thereof. Epoxy resin compositions comprising either the above phenolic compound or the above epoxy resin have in particular low melt viscosity are useful as resinous component of high-performance electrical laminating and encapsulation formulations.
摘要:
Verfahren zur Herstellung von Anlagerungsprodukten durch Umsetzung eines Alkohols mit einer Epoxidverbindung in Gegenwart eines Katalysators, dadurch gekennzeichnet, dass man einen Alkohol der Formel I worin A einen aliphatischen, cycloaliphatischen oder araliphatischen Rest bedeutet und r für eine Zahl von 1 bis 10 steht, mit einer Mono- oder Diepoxidverbindung im Äquivalenzverhältnis von 1 :20 bis 20 :1, bezogen auf die Hydroxyl- und Epoxidgruppen, in Gegenwart einer Metallkomplexverbindung der Formel II als Katalvsator als Katalysator umsetzt, worin M ein Metall der Haupt- oder Nebengruppen des Periodensystems, L 1 und L 2 schwachgebundene, neutrale, uni- oder multidentale Liganden, L 3 ein starkgebundener, nichtaustauschbarer neutraler oder anionischer, uni- oder multidentaler Ligand, X ein Anion der folgenden Formeln BF 4 - , PF 6 - , AsF 6 - , SbF 6 - , Clo 4 - , JO 4 - , N03 oder den Sulfonatrest einer perfluorhaltigen Alkansulfonsäure, n eine Zahl von 1 bis 6, m null oder eine Zahl von 1 bis 6, k die Zahl 1 oder 2, x eine Zahl von 1 bis 1000, y null oder eine Zahl von 1 bis 1000 und z null oder eine Zahl von 1 bis 6 bedeuten.
摘要:
Macrocyclic epoxy resins comprising at least one compound of formula (I) wherein n is an integer from 3 to 10. R?1 and R3¿ are either the same or different and are selected from hydrogen, hydroxyl, alkoxy, allyloxy and epoxypropyloxy (glycidyloxy); R2 is selected from hydrogen, arylalkyl optionally substituted with halogen, alkyl optionally substituted with halogen, and aryl optionally substituted with halogen; R4 is selected from hydrogen, alkyl optionally substituted with halogen, arylalkyl optionally substituted with alkyl or halogen, and aryl optionally substituted with halogen; R5 is selected from hydrogen, aryl and alkyl; with the proviso that the resin contains on average at least one epoxy group per molecule.