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    B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES
    4.
    发明公开
    B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES 审中-公开
    胶粘剂无硬化CLASS B晶圆背面涂层

    公开(公告)号：EP2694611A1

    公开(公告)日：2014-02-12

    申请号：EP11862911.2

    申请日：2011-04-25

    申请人： Henkel Corporation

    发明人： WANG, Eric, C. ,  BECKER, Kevin, Harris ,  ZHUO, Qizhuo

    IPC分类号： C09J163/00 ,  C09J121/00 ,  C09J11/04 ,  C09J4/02

    CPC分类号： C09J163/04 ,  C08G59/08 ,  C08G59/34 ,  C08G59/68 ,  C09J4/06 ,  C09J121/00 ,  C09J163/10

    摘要： This invention is an adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler. The composition is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer (an elastomer having carbon to carbon unsaturation) and an epoxy elastomer, present in an amount within the range of 20% to 40% by weight, and preferably about 30% by weight of the adhesive composition. The epoxy resin is present in the adhesive composition in the range of 3% to 10% by weight, and preferably about 5% by weight. The reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation to react with the acrylate elastomer, providing cross-linking within the composition after cure. One or both must be able to act as a diluent or solvent for the elastomeric polymer, and together are present in the adhesive composition within the range of 35% to 50% by weight of the composition. The filler is a non-conductive filler and makes up the remainder of the composition to a total of 100% by weight.

    THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM
    6.
    发明公开
    THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, ACTIVE ESTER RESIN, SEMICONDUCTOR SEALING MATERIAL, PREPREG, PRINTED CIRCUIT BOARD, AND BUILD-UP FILM 有权
    热固性树脂组合物，其固化物，活性酯树脂，半导体密封材料，预浸料坯组装的PCB，建筑和电影

    公开(公告)号：EP2589625A1

    公开(公告)日：2013-05-08

    申请号：EP11800587.5

    申请日：2011-06-08

    申请人： DIC Corporation

    发明人： ARITA Kazuo ,  SUZUKI Etsuko

    IPC分类号： C08L63/00 ,  C08G59/62 ,  C08J5/24 ,  H01B3/40 ,  H05K1/03

    CPC分类号： C08G65/48 ,  C08G59/08 ,  C08G59/42 ,  C08G59/4223 ,  C08G59/4276 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/08 ,  C08L63/00 ,  C08L67/03 ,  C08L71/08 ,  C09D171/08 ,  H01B3/40 ,  H01B3/421 ,  H05K1/0326 ,  H05K3/323 ,  H05K3/4676 ,  H05K2201/012 ,  Y10T428/31511 ,  Y10T428/31529

    摘要： The present invention provides a thermosetting resin composition exhibiting excellent heat resistance and flame retardancy while maintaining a low dielectric constant and low dielectric loss tangent when formed into a cured product, a cured product thereof, an active ester resin which develops these properties, and a semiconductor encapsulating material, a prepreg, a circuit board, and a build-up film which are produced using the composition. A thermosetting resin composition contains an active ester resin (A) and an epoxy resin (B) as essential components, the active ester resin (A) having a resin structure which includes a polyaryleneoxy structure (I) and in which aromatic carbon atoms in a plurality of the polyaryleneoxy structures (I) are linked through a structural site (II) represented by a structural formula 1 (wherein Ar represents a phenylene group, a phenylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms, a naphthylene group, or a naphthylene group nuclear-substituted by 1 to 3 alkyl groups each having 1 to 4 carbon atoms).

    摘要翻译： 本发明提供一种热固性树脂组合物表现出优异的耐热性和阻燃性，同时保持低介电常数和低介电损耗角正切在形成的固化产物，其固化物，以活性酯树脂，其开发出合成的特性，以及半导体 封装材料，预浸料坯，电路板，并且其使用的组合物生产的积聚的电影。 的热固性树脂组合物含有的活性酯树脂（A）和环氧树脂（B）为具有树脂结构，其包括一个polyaryleneoxy结构（I）必要成分，该活性酯树脂（A）和在一个其中芳族羧酸原子 所述polyaryleneoxy结构（I）的多个被通过由结构式1（表示的结构部位（II）连接的worin氩darstellt亚苯基，亚苯基核取代被1至3的烷基基团各自具有1至4个碳原子 ，亚萘基，或亚萘基的核取代被1至3的烷基基团各自具有1至4个碳原子）。

    Printing form and process for preparing the printing form with curable composition having epoxy novolac resin
    7.
    发明公开
    Printing form and process for preparing the printing form with curable composition having epoxy novolac resin 审中-公开
    印刷形式和用于通过与环氧酚醛清漆树脂的固化性组合物的制备方法的打印形式的方法

    公开(公告)号：EP2522509A2

    公开(公告)日：2012-11-14

    申请号：EP12167676.1

    申请日：2012-05-11

    申请人： E. I. du Pont de Nemours and Company

    发明人： Adelman, Douglas, J. ,  Blankenbicker, Cara, L. ,  Davis, Andrew Patrick ,  Fones, Barbara Bobick ,  Lu, Helen Shin Min ,  Wagman, Mark Elliott

    IPC分类号： B41C1/04 ,  B41N1/06 ,  B41N1/12

    CPC分类号： B41N1/22 ,  B41C1/045 ,  B41C1/05 ,  B41N1/06 ,  B41N1/12 ,  C08G59/08 ,  C08G59/5006 ,  C08L63/04

    摘要： The invention pertains to a printing form and a process for preparing the printing form from a curable composition that includes an epoxy novolac resin having an epoxide equivalent weight of 156 to 300 g/equivalent, and an amine curing agent selected from primary amines and secondary amines, the agent having an amine equivalent weight of less than or equal to 60 g/equivalent. The process includes applying the curable composition to a supporting substrate to form a layer, curing the layer at one or more temperatures in a temperature range, and engraving to form at least one cell in the cured layer. The process prepares printing forms, particularly gravure printing forms, having a cured resin composition layer that is engravable, resistant to solvent inks and to mechanical wear, and capable of printing gravure-quality images.

    摘要翻译： 本发明涉及一种印刷形式，并且用于从可固化组合物制备的印版的方法确实包括环氧酚醛清漆树脂具有在156至300克/当量环氧化物当量，和胺固化剂的从初级cardamines和次级cardamines选择 具有胺的小于或等于60克/当量当量该试剂。 该方法包括将可固化组合物施用到支撑衬底，以形成一个层，在一个温度范围内的一个或多个温度下固化所述层，和雕刻以形成在固化层的至少一个小区。 该处理准备印版，尤其是凹版印刷的形式，具有固化树脂组合物层所做的是雕刻的，抗溶剂油墨和机械磨损，并能够印刷凹版质量的图像。

    Fuel cell separator resin composition and fuel cell separator
    9.
    发明公开
    Fuel cell separator resin composition and fuel cell separator 有权
    ator ator ator ator ator ator ator ator ator ator ator ator ator ator ator ator ator ator ator ator ator

    公开(公告)号：EP1995810A1

    公开(公告)日：2008-11-26

    申请号：EP08009512.8

    申请日：2008-05-23

    申请人： Nichias Corporation

    发明人： Murakami, Atsushi ,  Shimizu, Takayoshi

    IPC分类号： H01M8/02 ,  C08G59/68 ,  C08K3/04

    CPC分类号： H01M8/0226 ,  C08G59/08 ,  C08G59/686 ,  C08K3/04 ,  C08L63/00 ,  H01M8/0213 ,  H01M8/0221

    摘要： A fuel cell separator resin composition comprising: (A) an epoxy resin; (B) a curing agent; (C) a curing accelerator comprising a salt of a diazabicyclo compound and an organic acid; and (D) a carbon material, wherein the content of the carbon material (D) is 35 to 85% by mass based on the total amount of the composition, wherein the carbon material (D) comprises high crystalline artificial graphite having a particle size of 150 to 500 µm in an amount of 5 to 100% by mass based on the total amount of the carbon material (D), and wherein the content of the curing accelerator (C) is 1 to 20 parts by weight per 100 parts by weight of the curing agent (B).

    摘要翻译： 一种燃料电池隔板树脂组合物，其包含：（A）环氧树脂; （B）固化剂; （C）包含二氮杂双环化合物和有机酸的盐的固化促进剂; 和（D）碳材料，其中碳材料（D）的含量相对于组合物的总量为35〜85质量％，其中，碳材料（D）包含具有粒径的高结晶人造石墨 相对于碳材料（D）的总量为5〜100质量％的量为150〜500μm的固化促进剂（C）的含量相对于100重量份为1〜20重量份 固化剂（B）的重量。

    EPOXY RESIN, HARDENABLE RESIN COMPOSITION CONTAINING THE SAME AND USE THEREOF
    10.
    发明公开
    EPOXY RESIN, HARDENABLE RESIN COMPOSITION CONTAINING THE SAME AND USE THEREOF 审中-公开
    EPOXIDHARZ，HÄRTBAREHARZZUSAMMENSETZUNG DAMIT UND VERWENDUNG DAVON

    公开(公告)号：EP1852451A1

    公开(公告)日：2007-11-07

    申请号：EP06714088.9

    申请日：2006-02-20

    申请人： NIPPON KAYAKU KABUSHIKI KAISHA

    发明人： NAKANISHI, Masataka c/o Nippon Kayaku KK ,  AKATSUKA, Yasumasa c/o Nippon Kayaku KK ,  OSHIMI, Katsuhiko c/o Nippon Kayaku KK ,  SUNAGA, Takao c/o Nippon Kayaku KK

    IPC分类号： C08G59/32 ,  C08G59/50 ,  C08J5/24

    CPC分类号： C08G59/32 ,  C08G59/08 ,  C08G59/621 ,  C08G59/688 ,  C08L63/00 ,  C08L79/00 ,  C08L2666/20

    摘要： It is an object of the present invention, with respect to a phenol aralkyl type epoxy resin, to suppress any crystal precipitation, improve the quality manageability and operation efficiency at composition production and enhance the properties, including heat resistance, thereof It is also intended to provide a resin composition that even when stored in the form of a varnish for a prolonged period of time, is resistant to crystal precipitation, excelling in storage stability and operation efficiency, and that gives a hardening product of low dielectric constant and low dielectric tangent excelling in heat resistance, water resistance and flame retardance.
    There is provided an epoxy resin characterized by comprising a phenol aralkyl type epoxy resin in which a content (an area % measured by gel permeation chromatography) of a bifunctional compound is 20% or less, and provided a resin composition obtained therefrom.

    摘要翻译： 本发明的目的是提供苯酚芳烷基型环氧树脂，以抑制任何晶体沉淀，提高组合物生产中的质量管理能力和操作效率，提高包括耐热性的性能。 提供即使长时间以清漆的形式储存的树脂组合物，耐结晶沉淀，保存稳定性和操作效率优异，并且具有低介电常数和低介电切线优异的硬化产物 耐热性，耐水性和阻燃性。 提供一种环氧树脂，其特征在于包含其中通过双功能化合物的含量（通过凝胶渗透色谱法测量的面积％）为20％以下的苯酚芳烷基型环氧树脂，并提供由其获得的树脂组合物。