公开(公告)号：EP1102099A2

公开(公告)日：2001-05-23

申请号：EP00107793.2

申请日：2000-04-11

Applicant: Yazaki Corporation

Inventor： Shirakawa, Tsuguhito ,  Akeda, Nobuyuki, c/o Yazaki Parts Co., Ltd. ,  Takahashi, Toshiharu, c/o Yazaki Parts Co., Ltd.

IPC: G02B6/42 ,  G02B6/38

CPC classification number: G02B6/4293 ,  G02B6/3817 ,  G02B6/3869 ,  G02B6/3879 ,  G02B6/389 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4261 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4284 ,  G02B6/4292

Abstract: A hybrid connector consists of an electrical connector and an optical connector. The electrical connector includes a housing with a wall having a terminal mount section and an optical connector mount section and terminals bent L-shaped and inserted through the terminal mount section into the electrical housing. The optical connector includes an optical housing, and a light emitting element module and a light receiving element module, both accommodated in the optical housing. The optical housing, when assembled to the electrical housing, overlies the terminals with a spacing therebetween. A compact hybrid connector is obtained.

Abstract translation: 混合连接器由电连接器和光连接器组成。 该电连接器包括具有壁的壳体，该壁具有端子安装部分和光学连接器安装部分，并且端子弯曲成L形并且通过端子安装部分插入到电气壳体中。 光学连接器包括光学壳体，以及均容纳在光学壳体中的发光元件模块和光接收元件模块。 光学壳体在组装到电气壳体时以其间的间隔覆盖端子。 获得紧凑的混合连接器。

公开(公告)号：EP0446410B1

公开(公告)日：1999-12-22

申请号：EP90118498.6

申请日：1990-09-26

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Go, Hisao, c/o Yokohama Works of Sumitomo ,  Matsumura, Yutaka, c/o Yokohama Works of Sumitomo

IPC: G02B6/12

CPC classification number: B29C70/72 ,  G02B6/3865 ,  G02B6/4201 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4292 ,  Y10T29/49146

公开(公告)号：EP0938005A2

公开(公告)日：1999-08-25

申请号：EP99102727.7

申请日：1999-02-19

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： Moriyama, Yutaka, c/o Yokohama Works of ,  Sawada, Sosaku, c/o Yokohama Works of

IPC: G02B6/42

CPC classification number: G02B6/4292 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4244 ,  G02B6/4255 ,  G02B6/4265

Abstract: The present invention provides an optical module, in which aligning adjustment is much easier than conventional module while a high optical coupling efficiency between an optical fiber and a semiconductor device is maintained. The module comprises a structure for effectively suppressing the decrease in optical coupling efficiency caused by changes in ambient temperature. The optical module comprises an optical reflecting member having a reflecting surface with a concave surface form for optically coupling the optical fiber and the semiconductor device to each other, and a deterioration-suppressing structure in which the charge in shape of the reflecting member cause by changes in ambient temperature effectively suppresses the deterioration in optical coupling state between the optical fiber and semiconductor device due to changes in temperature or the like.

公开(公告)号：EP0787358A1

公开(公告)日：1997-08-06

申请号：EP95936160.0

申请日：1995-10-19

Applicant: TELEFONAKTIEBOLAGET LM ERICSSON

Inventor： STEIJER, Odd ,  MOLL, Hans-Christer ,  ERIKSEN, Paul ,  ENGSTRAND, Jan-Aake

IPC: B29C33 ,  B29C45 ,  G02B6 ,  H01L31

CPC classification number: B29C45/14065 ,  B29C33/0033 ,  G02B6/4201 ,  G02B6/4249 ,  G02B6/4255 ,  H01L31/0203

Abstract: In encapsulating an optocomponent with a plastics material an MT-connector compatible interface is obtained having bores (107) for guide pins in the wall of the capsule and optical connection surfaces (110). These bores (107) are obtained from mould cavity guide pins which are used for aligning the optocomponent in a mould cavity in a mould in the moulding operation of the encapsulating material on top of the component. In order to achieve a good accuracy in the positioning of the component during the moulding operation the mould guide pins are as short as possible and end directly behind the component where they are supported by projections extending from each mould half. Thus cavities (109) are created extending straight through the capsule (105) behind the component. The cavities (109) allow that the guide pin bores (107) are cleansed and that material residues are removed after the moulding operation. Further, the cavities (109) can be used for spring clamps which are used for retaining the optocomponent capsule (105) at an optical connector having a similar interface. The clamps can then have tongues which are inserted in the cavities (109) and which, in addition, can be provided with holes, through which the guide pins can be pushed to safe-guard the clamp against being lost.

公开(公告)号：EP0704731A2

公开(公告)日：1996-04-03

申请号：EP95306729.5

申请日：1995-09-25

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Furuyama, Hideto, c/o Intellectual Property Div.

IPC: G02B6/42

CPC classification number: G02B6/421 ,  G02B6/4201 ,  G02B6/4202 ,  G02B6/423 ,  G02B6/4238 ,  G02B6/4248 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4257 ,  G02B6/4267 ,  G02B6/4268 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  Y10S438/978 ,  H01L2924/00014

Abstract: An optical semiconductor module comprises an optical semiconductor element (6), an optical fiber (5), a monocrystalline substrate (1), an airtight sealing member (11, 12, 13, 14, 15 and 16) and a reinforcing body (8). Light is transmitted through the optical semiconductor element (6) and the optical fiber (5). The optical semiconductor element (6) and the optical fiber (5) are mounted on the monocrystalline substrate (1). The optical semiconductor element (6) is sealed airtight by the airtight sealing member (11, 12, 13, 14, 15 and 16). An optical axis aligning mechanism for aligning the optical axis of the optical semiconductor element (6) with the optical axis of the optical fiber (5) is arranged on the monocrystalline substrate (1). The reinforcing body (8) is welded with metal on the rear surface of the monocrystalline substrate (1).

Abstract translation: 一种光学半导体模块包括光学半导体元件（6），光纤（5），在单晶衬底（1），在气密密封部件（11，12，13，14，15和16）和一个加强体（8 ）。 光通过光半导体元件（6）和所述光纤反mitted（5）。 光半导体元件（6）和所述光纤（5）被安装在所述单晶衬底（1）。 光半导体元件（6）由气密密封部件（11，12，13，14，15和16）气密地密封。 用于对准与光纤（5）的光轴上的光半导体元件（6）的光轴的光轴取向机构被布置在所述单晶衬底（1）。 所述加固本体（8）被焊接与金属单晶基板（1）的后表面上。

公开(公告)号：EP0611971A3

公开(公告)日：1995-03-15

申请号：EP93119941.8

申请日：1993-12-10

Applicant: MOTOROLA, INC.

Inventor： Kuo, Shun-Meen ,  Chun, Christopher K.Y. ,  Lebby, Michael S.

IPC: G02B6/12 ,  B29D11/00 ,  G02B6/42 ,  G02B6/30 ,  B24B13/00 ,  G02B6/28 ,  G02B6/25 ,  G02B1/04 ,  B29C45/16

CPC classification number: G02B6/4249 ,  B29C45/16 ,  B29D11/00663 ,  G02B6/1221 ,  G02B6/138 ,  G02B6/30 ,  G02B6/42 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/4255

Abstract: A method for molding optical waveguides (600) wherein one or more optical cores (230) are molded first with an attached support structure (206). A unitary cladding layer (601) is then molded around the cores (230) and the support structure (206) is removed to provide optical inlet/outlets to the cores (230). The ends of the cores (605) where the support structure (206) is removed may require subsequent polishing. The molding compound injected into mold (100) is made of an optically transparent material, such as polymers, epoxies, plastics, polyimides, or the like that is selected to be transparent to a desired wavelength of light. Generally, refractive indexes of these optically transparent materials range from 1.4 to 1.7. Processing conditions for these materials range from 22°C to 200°C for molding temperatures and 200 pounds per square inch to 2,000 pounds per square inch for molding pressures. By injecting the molding material, represented by arrow (204), into the plurality of cavities (101), intricacies of features (104) of mold (100) are transferred to the molding compound. A subsequent curing process solidifies the molding compound, thereby permanently transferring the intricacies or a negative image of the plurality of features (104) to the solidified molding compound, and thereby generating optical elements or core regions (230).

公开(公告)号：EP0582992A1

公开(公告)日：1994-02-16

申请号：EP93112756.7

申请日：1993-08-09

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD

Inventor： Kurashima, Hiromi, c/o Yokohama Works of Sumitomo

IPC: G02B6/42

CPC classification number: G02B6/4246 ,  G02B6/4201 ,  G02B6/4255 ,  G02B6/4274 ,  G02B6/428 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optical functional element is contained in and grounded to a metal package. A grounding lead member, which is connected to a grounding lead pin forming portion via a connecting lead portion, is welded to the outer surface of the metal package either before or after resin molding.

Abstract translation: 光学功能元件容纳在金属封装中并接地。 经由连接引线部分连接到接地引脚形成部分的接地引线部件在树脂成型之前或之后被焊接到金属封装的外表面。

公开(公告)号：EP3076215A4

公开(公告)日：2017-08-02

申请号：EP14865353

申请日：2014-11-28

Applicant: OPTOMIND INC

Inventor： SON YUNG-SUNG ,  KIM BONG-CHEOL

IPC: G02B6/42 ,  G02B6/26 ,  G02B6/36

CPC classification number: G02B6/4231 ,  G02B6/32 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4249 ,  G02B6/4255 ,  G02B6/428

Abstract: An optical transceiver device includes a baseplate including a set position for mounting an optical element, an alignment plate including a mounting unit, a first and a second reference hole. The device includes an optical-fiber fixing block configured to fixedly mount at least one of a lens unit and an optical fiber optically linked with the optical element and to include a first and a second post, and a housing for enclosing the optical-fiber fixing block and alignment plate. The second post is inserted into the second reference hole in a looser manner than inserting the first post into the first reference hole, and the set position is determined by a first baseline passing through the first and the second reference hole and by a second baseline intersecting with the first baseline and positioned on opposite side of the second reference hole with respect to the first reference hole.

Abstract translation: 一种光学收发器装置包括：底板，其包括用于安装光学元件的设定位置;对准板，其包括安装单元;第一参考孔和第二参考孔。 该装置包括：光纤固定块，被配置为固定地安装与光学元件光学链接的透镜单元和光纤中的至少一个，并且包括第一和第二柱;以及壳体，用于封闭光纤固定件 块和对齐板。 以比将第一柱插入到第一参考孔中的方式更宽松的方式将第二柱插入到第二参考孔中，并且设定位置由穿过第一和第二参考孔以及通过第二基线相交的第一基线确定 与第一基线并且相对于第一参考孔定位在第二参考孔的相对侧上。

公开(公告)号：EP2040104B1

公开(公告)日：2017-08-02

申请号：EP08016298.5

申请日：2008-09-16

Applicant: YAZAKI CORPORATION

Inventor： Ozaki, Masahito

IPC: G02B6/42 ,  H05K9/00

CPC classification number: G02B6/4246 ,  G02B6/4201 ,  G02B6/4255 ,  G02B6/4261 ,  G02B6/4274 ,  G02B6/4277

Abstract: If a light-emitting side FOT 35 and a light-receiving side FOT 36 each having an optical element and a plurality of pin-like lead frames 55 is covered by a shield case 37 formed of an electrically conductive metallic plate, a ground pin 71 of the shield case 37 is positioned immediately behind a lead frame 55b which functions as a ground pin among the plurality of lead frames 55.

Abstract translation: 如果各自具有光学元件和多个销状引线框架55的发光侧FOT 35和光接收侧FOT 36被由导电金属板形成的屏蔽壳37覆盖，则接地销71 在多个引线框架55中作为接地引脚起作用的引线框架55b的正后方。

公开(公告)号：EP3018510A1

公开(公告)日：2016-05-11

申请号：EP14819310.5

申请日：2014-07-07

Applicant: Ls Mtron Ltd.

Inventor： LEE, Seung Hun ,  KIM, Young Ho ,  WOO, Kyung Nyung ,  LEE, Ick Kyun ,  PARK, Keon Cheol

IPC: G02B6/13

CPC classification number: G02B6/424 ,  G02B6/00 ,  G02B6/32 ,  G02B6/4204 ,  G02B6/4221 ,  G02B6/4227 ,  G02B6/423 ,  G02B6/4242 ,  G02B6/4255 ,  G02B6/4257 ,  G02B6/4274 ,  G02B6/43

Abstract: The present invention relates to an optical module which is modularized including an optical element and an optical transmission member for mass data high-speed transmission of a board in a device and mass data high-speed transmission between devices, and in which optical alignment is completed between the optical element and the optical transmission member in the module, thereby removing an optical alignment error occurring when mounting it on an external PCB substrate, and provides an optical module includes an optical transmission member (100), an optical element 200, a substrate 210, an electrode pad 220 between the optical element 200 and an external circuit, and optical block 300 including an optical transmission member mounting portion, wherein the optical transmission member mounting portion is formed on the optical block in an optical axis direction such that optical transmission efficiency is the maximum. In addition, a manufacturing method of the optical module includes mounting and electrically connecting the optical element 200 on one face of the substrate 210, calculating a position on a 2-dimensional plane of an optical input/output point of the optical element 200, then forming a base material of the optical block 300 to impregnate the optical element 200 onto the substrate 210, thereafter, forming the optical transmission member mounting portion 310 at the position on the 3-dimensional plane of the optical input/output point calculated in the former step on the base material, and mounting the optical transmission member 100 on the optical transmission member mounting portion 310.

Abstract translation: 本发明涉及到光模块的所有被模块化包括用于在设备之间的设备和大容量数据的高速传输的基板的大容量数据的高速传输的光传输部件的光学元件上，并且，并且其中光学对准完成 所述光学元件和所述模块中的光传输部件之间，由此在光学对准误差去除时发生上安装它到外部PCB的基板，并提供了光模块包括光学元件200，一基底的光传输部件（100） 210至电极垫220的光学元件200之间，并且连接到外部电路，并且光学块300包括上光学传输部件安装部，worin光传输构件安装部分在光轴方向上搜索该光学块上形成在没有光传输 效率为最大。 此外，该光学模块的制造方法包括：装配和电在基板210的一个面的光学元件200的连接，在计算的位置上的二维平面的光学输入的光学元件200的/输出点，然后 形成光学块300的基体材料浸渍光学元件200到基底210，之后，在形成光传输部件的位置处关于前计算的光输入/输出点的三维平面安装部310 步骤在基材上，并且安装所述光传输部件100中的光传输部件上安装部第三百一十