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349 条记录 (耗时 0.016 秒)

    Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
    63.
    发明公开
    Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board 有权
    与输送器真空层压装置和用于施加干膜抗蚀剂法在印刷电路板

    公开(公告)号：EP1078734A3

    公开(公告)日：2002-07-17

    申请号：EP00306950.7

    申请日：2000-08-14

    申请人： Shipley Company LLC

    发明人： Keil, Charles R. ,  Novello, Osvaldo

    IPC分类号： B32B31/20

    CPC分类号： B29C43/56 ,  B29C43/32 ,  B29C2043/561 ,  B32B37/0007 ,  B32B2309/68 ,  B32B2457/08 ,  H05K3/0079 ,  Y10T156/1092

    摘要： An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under heat, vacuum and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (136) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum laminator (18) comprising heated upper and lower platens (96,94) adapted to be moved into sealing engagement to form a vacuum lamination chamber (16), and disposed between the platens are two independent belt conveyor systems (20,22) that act as heat shields to prevent the printed circuit board and the loosely applied dry film from being heated up too rapidly in the vacuum chamber by the residual heat given off by the upper and lower platens before the film can be completely evacuated. This prevents premature tacking of the dry film to the board and enables all of the air entrapped between the film and the board surface to be drawn off before the application of heat and mechanical pressure, so as to ensure complete conformance of the dry film around the circuit traces and surface contours.

    Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
    64.
    发明公开
    Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board 有权
    与输送器真空层压装置和用于施加干膜抗蚀剂法在印刷电路板

    公开(公告)号：EP1078734A2

    公开(公告)日：2001-02-28

    申请号：EP00306950.7

    申请日：2000-08-14

    申请人： Shipley Company LLC

    发明人： Keil, Charles R. ,  Novello, Osvaldo

    IPC分类号： B32B31/20

    CPC分类号： B29C43/56 ,  B29C43/32 ,  B29C2043/561 ,  B32B37/0007 ,  B32B2309/68 ,  B32B2457/08 ,  H05K3/0079 ,  Y10T156/1092

    摘要： An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under heat, vacuum and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (136) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum laminator (18) comprising heated upper and lower platens (96,94) adapted to be moved into sealing engagement to form a vacuum lamination chamber (16), and disposed between the platens are two independent belt conveyor systems (20,22) that act as heat shields to prevent the printed circuit board and the loosely applied dry film from being heated up too rapidly in the vacuum chamber by the residual heat given off by the upper and lower platens before the film can be completely evacuated. This prevents premature tacking of the dry film to the board and enables all of the air entrapped between the film and the board surface to be drawn off before the application of heat and mechanical pressure, so as to ensure complete conformance of the dry film around the circuit traces and surface contours.

    摘要翻译： 和装置的改进的方法也以直线系统连续自动操作，描述了用于在热，真空和机械压力的干膜光致抗蚀剂形成层施加到印刷电路板（136）并已经由松散预层压 应用干的薄膜于此致抗蚀剂作为借此可以没有截留的空气气泡和紧密符合提出的电路迹线和所述印刷电路板的不规则的表面轮廓的层叠体获得的板的表面的范围内离散的切割片材。 展出的是一个传送带式真空层压机（18），其包括加热的上压板和下压板（96,94）angepasst被移动到密封接合，以形成一个真空层压腔室（16），和设置在所述压板之间是两个独立的皮带输送机系统（20 ，22）做了充当热屏蔽以防止在印刷电路板和所述松散应用干电影从由上下压盘放出的薄膜可以完全呼叫真空管之前的余热被加热太迅速在真空室中。 这防止了干膜到板的过早粘结，并启用所有膜和基板表面之间截留的空气的热和机械压力的施加之前被排出，以便确保干完全贴合薄膜围绕 电路迹线和表面轮廓。

    Resist removing apparatus
    67.
    发明公开
    Resist removing apparatus 失效
    设备光刻胶剥离

    公开(公告)号：EP0774694A3

    公开(公告)日：1998-10-28

    申请号：EP96118376

    申请日：1996-11-15

    申请人： NITTO DENKO CORP

    发明人： YAMAMOTO MASAYUKI ,  MATSUSHITA TAKAO

    IPC分类号： B08B7/00 ,  G03F7/42 ,  H01L21/027 ,  H05K3/00

    CPC分类号： B08B7/0028 ,  G03F7/427 ,  H05K3/0079 ,  Y10T156/1189

    摘要： A resist removing apparatus for removing unnecessary resist patterns from articles such as semiconductor substrates efficiently by using adhesive tape. A tape applicator unit is movable horizontally to apply the adhesive tape in strip form to a wafer supported on an applicator table. Then, a set of the tape applicator unit and a tape separator unit and a set of the applicator table and a separator table are moved horizontally relative to each other to shift the separator table under the wafer supported through the adhesive tape. A next wafer is transported to and placed on the applicator table in an unloaded state. The tape applicator unit and tape separator unit are moved horizontally and simultaneously to apply the adhesive tape to the wafer on the applicator table and separate the adhesive tape from the wafer on the separator table at the same time.

    Photoresist layer supporting film and photoresist film laminate
    68.
    发明公开
    Photoresist layer supporting film and photoresist film laminate 失效
    Fotoresistschichttragender Film und Laminat des Photoresists und Films

    公开(公告)号：EP0809151A1

    公开(公告)日：1997-11-26

    申请号：EP97303214.7

    申请日：1997-05-12

    申请人： TEIJIN LIMITED

    发明人： Kudo, Takafumi ,  Yoshida, Tetsuo ,  Minamihira, Yukihiko ,  Masaoka, Kazutaka ,  Tanaka, Youji ,  Kimura, Noriyo

    IPC分类号： G03F7/09 ,  G03F7/16

    CPC分类号： G03F7/09 ,  G03F7/16 ,  G03F7/161 ,  H05K3/0079 ,  H05K3/4644

    摘要： A photoresist layer supporting film is (A) formed from a polymer composition comprising (i) 55 to 100 % by weight of a copolyester containing ethylene terephthalate units as a main recurring unit and having a melting point of 210 to 250°C and (ii) 0 to 45 % by weight of polybutylene terephthalate or a copolyester containing butylene terephthalate units as a main recurring unit and having a melting point of not lower than 180°C and (B) has a plane orientation coefficient of 0.08 to 0.16. Since this supporting film is excellent in substrate shape follow-up properties and resolution, it is suitable for the preparation of a photoresist film laminate by laminating a protective film and a photoresist layer on the surface thereof.

    摘要翻译： 光致抗蚀剂层支撑膜是由聚合物组合物形成的（A），其包含（i）55-100重量％的含有对苯二甲酸乙二醇酯单元作为主要重复单元并且熔点为210-250℃的共聚酯和（ii ）0〜45重量％的聚对苯二甲酸丁二醇酯或含有对苯二甲酸丁二醇酯单元的共聚酯作为主要重复单元，熔点不低于180℃，（B）的平面取向系数为0.08〜0.16。 由于该支撑膜的基板形状跟随性和分辨率优异，因此适用于通过在其表面上层压保护膜和光致抗蚀剂层来制备光致抗蚀剂膜层压体。

    Liquid photoimageable resist
    70.
    发明公开
    Liquid photoimageable resist 失效
    Flüssiger光刻胶

    公开(公告)号：EP0706091A1

    公开(公告)日：1996-04-10

    申请号：EP95115322.0

    申请日：1995-09-28

    申请人： HERCULES INCORPORATED

    发明人： Loo, Dekai ,  Mayes, Richard T.

    IPC分类号： G03F7/031

    CPC分类号： H05K3/0079 ,  G03F7/031 ,  H05K3/0076 ,  H05K2203/0759 ,  H05K2203/1105

    摘要： A liquid applied photoresist composition is disclosed which exhibits a favorable balance of photospeed and overall physical properties. The photoresist composition includes a binder, a multifunctional monomer, a photoinitiator, and a solvent. The photoinitiator is present in the photoresist in an amount of greater than about 10% by weight of the photoresist without solvent. The photoresist when applied is relatively resistant to blocking when applied to a substrate.
    A process for producing a negative resist image on a surface using the photoresist is also disclosed.

    摘要翻译： 公开了一种液体涂敷的光致抗蚀剂组合物，其表现出良好的感光平衡和整体物理性能。 光致抗蚀剂组合物包括粘合剂，多官能单体，光引发剂和溶剂。 光致抗蚀剂中存在的光引发剂的量大于不含溶剂的光致抗蚀剂的约10重量％。 施加时的光致抗蚀剂在施加到基底上时相对于阻挡相对抗性。 还公开了使用光致抗蚀剂在表面上制备负性抗蚀剂图像的方法。