公开(公告)号：EP3335079A1

公开(公告)日：2018-06-20

申请号：EP16834759.9

申请日：2016-07-27

申请人： Kateeva Inc

发明人： SHPAISMAN, Nava ,  FRENKEL, Moshe

IPC分类号： G03F1/92 ,  H05K3/06

CPC分类号： H05K3/061 ,  B41M5/0058 ,  C09D11/101 ,  C09D11/30 ,  C23F1/00 ,  C23F1/02 ,  G03F1/0023 ,  G03F7/2018 ,  H01L51/0004 ,  H01L51/0005 ,  H05K3/0002 ,  H05K3/0017 ,  H05K3/0079 ,  H05K2203/013 ,  H05K2203/0392 ,  H05K2203/0582 ,  H05K2203/1173

摘要： A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface- activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch resist mask.

公开(公告)号：EP3317724A1

公开(公告)日：2018-05-09

申请号：EP16820595.3

申请日：2016-06-30

申请人： National Research Council of Canada

发明人： ZHANG, Zhiyi ,  TAO, Ye ,  CHU, Ta-Ya ,  XIAO, Gaozhi

IPC分类号： G03F7/00 ,  B82Y30/00 ,  H01L29/772

CPC分类号： B22F7/04 ,  B22F3/105 ,  B22F3/24 ,  B22F5/00 ,  B22F2003/247 ,  B22F2003/248 ,  B22F2301/052 ,  B22F2301/10 ,  B22F2301/255 ,  B82Y20/00 ,  G03F7/2016 ,  G03F7/2022 ,  G03F7/40 ,  H01L51/0022 ,  H01L51/0023 ,  H01L51/0096 ,  H01L51/0541 ,  H01L51/0545 ,  H01L2251/301 ,  H05K1/097 ,  H05K3/06 ,  H05K3/064 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2203/013 ,  H05K2203/0548 ,  H05K2203/0766 ,  H05K2203/107 ,  H05K2203/1131

摘要： A method is disclosed for aligning layers in fabricating a multilayer printable electronic device. The method entails providing a transparent substrate upon which a first metal layer is deposited, providing a transparent functional layer over the first metal layer, depositing metal nano particles over the functional layer to form a second metal layer, exposing the metal nano particles to intense pulsed light via an underside of the substrate to partially sinter exposed particles to the functional layer whereby the first metal layer acts as a photo mask, and washing away unexposed particles using a solvent to leave partially sintered metal nano particles on the substrate.

公开(公告)号：EP2992141B1

公开(公告)日：2018-02-28

申请号：EP14721333.4

申请日：2014-04-29

申请人： Arjo Wiggins Fine Papers Limited

发明人： DEPRES, Gaël ,  VAU, Jean-Marie

IPC分类号： D21H13/40 ,  D21H17/33 ,  D21H17/34 ,  D21H19/20 ,  D21H19/72 ,  D21H19/76 ,  D21H19/78 ,  D21H21/16 ,  H05K1/03 ,  D21H19/82

CPC分类号： D21H21/16 ,  D21H13/40 ,  D21H17/33 ,  D21H17/34 ,  D21H19/20 ,  D21H19/72 ,  D21H19/76 ,  D21H19/78 ,  D21H19/824 ,  H05K1/02 ,  H05K1/0386 ,  H05K1/09 ,  H05K1/092 ,  H05K1/095 ,  H05K3/06 ,  H05K3/125 ,  H05K3/306 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/1173 ,  H05K2203/1545 ,  H05K2203/178

公开(公告)号：EP3255014A1

公开(公告)日：2017-12-13

申请号：EP17174823.9

申请日：2017-06-07

申请人： COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES

发明人： BENWADIH, Mohammed ,  ALIANE, Abdelkader

IPC分类号： B81B7/00 ,  C09D11/52 ,  H05K1/09 ,  H01Q1/38

CPC分类号： H05K3/125 ,  B05D1/02 ,  B81B7/0006 ,  B81B2207/07 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  C09D11/52 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/097 ,  H05K1/165 ,  H05K3/0014 ,  H05K2201/032 ,  H05K2201/10098 ,  H05K2203/013

摘要： Le procédé de fabrication d'un dispositif (1) comprenant une piste (3) électriquement conductrice agencée sur un support (2) comporte une étape de dépôt (E2-2) d'une solution par impression sur le support (2). Ladite solution comporte un mélange d'un solvant, d'un ensemble de particules métalliques (4) et d'un matériau métallique (5) présentant une température de fusion inférieure à celle des particules métalliques (4) de l'ensemble de particules métalliques. Le procédé prévoit une étape de fusion (E2-4, E3) du matériau métallique (5) d'où il résulte la formation d'une soudure en matériau métallique (5) entre des particules métalliques (4) de l'ensemble de particules métalliques. Après l'étape de formation (E2) de la piste (3) électriquement conductrice, le procédé comporte une étape de thermoformage (E4) d'au moins une partie du support (2).

摘要翻译： 制造包括布置在支撑件（2）上的导电轨道（3）的设备（1）的方法包括通过在支撑件（2）上进行印刷来沉积（E2-2）溶液的步骤。 所述溶液包含溶剂，一组金属颗粒（4）和熔点比该组金属颗粒（4）的熔点低的金属材料（5）的混合物 。 该方法提供金属材料（5）的熔化步骤（E2-4，E3），由该金属材料（5）的金属颗粒（4）之间形成金属材料（5）的焊缝。 金属。 在导电轨道（3）的成形步骤（E2）之后，该方法包括支撑件（2）的至少一部分的热成形步骤（E4）。

公开(公告)号：EP3235355A1

公开(公告)日：2017-10-25

申请号：EP15810772.2

申请日：2015-12-08

申请人： Tyco Electronics (Shanghai) Co. Ltd. ,  TE Connectivity Corporation

发明人： DENG, Yingcong ,  OAR, Michael A ,  RADZILOWSKI, Leonard Henry ,  XIN, Liming ,  LIU, Yun ,  ZHANG, Dandan ,  STECK, John Edward

IPC分类号： H05K3/12 ,  B41J3/407

CPC分类号： H05K3/125 ,  B41J3/4073 ,  H05K2203/013

摘要： Disclosed are 3D ink jet printing system and method. The 3D ink jet printing system comprises: a multi-freedom robot configured to grip and move a product to be printed; and an inkjet print head configured to eject a conductive ink onto a surface of the product to be printed. The surface of the product comprises a 3D surface region, and the 3D ink jet printing system is configured to print out a first conductive pattern on the 3D surface region of the product. The robot is configured to adjust a position and a posture of the product during printing, so that the produce moves along a predetermined space path relative to the inkjet print head in a state where the inkjet print head is always substantially perpendicular to a currently printed target surface region of the product.

摘要翻译： 公开了3D喷墨打印系统和方法。 该3D喷墨打印系统包括：多自由度机器人，该多自由度机器人被构造成抓取并移动待打印产品; 以及喷墨打印头，其构造成将导电墨水喷射到待打印产品的表面上。 产品的表面包括3D表面区域，3D喷墨打印系统被配置为在产品的3D表面区域上打印出第一导电图案。 机器人被构造成在打印期间调整产品的位置和姿势，使得产品在喷墨打印头总是基本上垂直于当前打印的目标的状态下沿着相对于喷墨打印头的预定空间路径移动 产品的表面区域。

公开(公告)号：EP3214142A1

公开(公告)日：2017-09-06

申请号：EP16749313.9

申请日：2016-02-12

申请人： Sekisui Chemical Co., Ltd.

发明人： TANIKAWA, Mitsuru ,  TAKAHASHI, Ryosuke ,  INOUE, Takanori ,  UEDA, Michihisa ,  YAMADA, Tasuku ,  FUJITA, Yoshito ,  WATANABE, Takashi ,  FUJITA, Yusuke

IPC分类号： C09D11/30 ,  B41M5/00 ,  H05K3/28

CPC分类号： C07C211/51 ,  C07D231/12 ,  C07D249/04 ,  C07D249/08 ,  C09D11/101 ,  C09D11/36 ,  C09D11/38 ,  H05K1/0346 ,  H05K3/287 ,  H05K2203/013

摘要： Provided is a curable composition for inkjet which can have a prolonged pot life even under an environment in an inkjet device that is warmed to 50°C or higher and which can be cured into a cured product having improved heat resistance and insulation reliability, in spite of the fact that a thermally curable compound is used in the curable composition. The curable composition for inkjet according to the present invention contains a photocurable compound, a thermally curable compound, a photopolymerization initiator and a thermal curing agent and does not contain a solvent or contains the solvent, wherein the content of the solvent in 100% by weight of the curable composition is 1% by weight or less when the curable composition for inkjet contains the solvent, the photocurable compound contains a polyfunctional compound having at least two (meth)acryloyl groups, and the thermal curing agent is an aromatic amine having at least one benzene ring and at least two amino groups.

摘要翻译： 本发明提供一种喷墨用固化性组合物，其即使在加温至50℃以上的喷墨装置的环境下也能够延长适用期，可以固化成耐热性和绝缘可靠性提高了的固化物 在可固化组合物中使用可热固化的化合物的事实。 本发明的喷墨用固化性组合物含有光固化性化合物，热固化性化合物，光聚合引发剂和热固化剂，且不含溶剂或含有溶剂，其中溶剂的含量为100重量％ 当所述喷墨用固化性组合物含有溶剂时，所述固化性组合物的含量为1重量％以下，所述光固化性化合物含有具有至少2个（甲基）丙烯酰基的多官能性化合物，所述热固化剂为至少具有 一个苯环和至少两个氨基。

公开(公告)号：EP2950144B1

公开(公告)日：2016-12-14

申请号：EP15169451.0

申请日：2015-05-27

申请人： Rohm and Haas Electronic Materials LLC

发明人： BALANTRAPU, Krishna ,  AMOS, Brian D. ,  McCAMMON, Stephen

IPC分类号： H05K3/00 ,  H05K3/28 ,  G03F7/09 ,  G03F7/035 ,  G03F7/038 ,  G03F7/11 ,  G03F7/20 ,  H05K3/34

CPC分类号： H05K3/0079 ,  G03F7/035 ,  G03F7/038 ,  G03F7/09 ,  G03F7/11 ,  G03F7/2018 ,  H05K3/0076 ,  H05K3/0082 ,  H05K3/28 ,  H05K3/3452 ,  H05K2203/013 ,  H05K2203/0585

公开(公告)号：EP1555133B1

公开(公告)日：2016-03-23

申请号：EP05000365.6

申请日：2005-01-11

申请人： manroland web systems GmbH

发明人： Schneider, Josef ,  Schönert, Michael ,  Stamme, Rainer

IPC分类号： B41J3/54 ,  B41F13/46

CPC分类号： B41J11/002 ,  B41F19/007 ,  B41J11/0015 ,  G06K19/07749 ,  H01L51/0004 ,  H05K3/125 ,  H05K3/1275 ,  H05K2203/013 ,  H05K2203/1545 ,  H05K2203/161

公开(公告)号：EP2930722A4

公开(公告)日：2015-12-09

申请号：EP13861241

申请日：2013-11-29

申请人： FUJIFILM CORP

发明人： USAMI YOSHIHISA ,  OHTA HIROSHI

IPC分类号： H01B13/00 ,  H01B5/14 ,  H05K3/10

CPC分类号： H05K1/092 ,  H05K1/0346 ,  H05K3/0091 ,  H05K3/105 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/1157 ,  Y10T428/24909

摘要： The purpose of the present invention is to provide: a process for manufacturing a conductive film, said process being capable of achieving efficient progress of reduction of a metal oxide into a metal and yielding a conductive film which exhibits excellent adhesion to a substrate; and a printed wiring board. This process includes: a step for applying a dispersion which contains metal oxide particles to a substrate to form a precursor film which contains the particles; and a step for irradiating the precursor film with a continuous-wave laser beam while scanning the laser beam relatively, and thereby reducing the metal oxide in an irradiated area to form a metal-containing conductive film. In the process, the scanning speed is 1.0 m/s or more, the laser power of the continuous-wave laser beam is 6.0 W or more, and the irradiation time per point on the surface of the precursor film is 1.0 µs or more.

公开(公告)号：EP2930722A1

公开(公告)日：2015-10-14

申请号：EP13861241.1

申请日：2013-11-29

申请人： FUJIFILM Corporation

发明人： USAMI Yoshihisa ,  OHTA Hiroshi

IPC分类号： H01B13/00 ,  H01B5/14 ,  H05K3/10

CPC分类号： H05K1/092 ,  H05K1/0346 ,  H05K3/0091 ,  H05K3/105 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/1157 ,  Y10T428/24909

摘要： The purpose of the present invention is to provide: a process for manufacturing a conductive film, said process being capable of achieving efficient progress of reduction of a metal oxide into a metal and yielding a conductive film which exhibits excellent adhesion to a substrate; and a printed wiring board. This process includes: a step for applying a dispersion which contains metal oxide particles to a substrate to form a precursor film which contains the particles; and a step for irradiating the precursor film with a continuous-wave laser beam while scanning the laser beam relatively, and thereby reducing the metal oxide in an irradiated area to form a metal-containing conductive film. In the process, the scanning speed is 1.0 m/s or more, the laser power of the continuous-wave laser beam is 6.0 W or more, and the irradiation time per point on the surface of the precursor film is 1.0 µs or more.

摘要翻译： 本发明的目的在于提供一种导电膜的制造方法，该方法能够实现金属氧化物还原成金属的有效进程，并且产生对基板具有优异粘附性的导电膜; 和印刷线路板。 该方法包括：将含有金属氧化物颗粒的分散液涂布到基材上以形成含有颗粒的前体膜的步骤; 以及在相对扫描激光束的同时用连续波激光束照射前体膜，由此还原照射区域中的金属氧化物以形成含金属导电膜的步骤。 在该过程中，扫描速度为1.0m / s或更高，连续波激光束的激光功率为6.0W或更高，并且前体膜表面上的每点的照射时间为1.0μs或更多。