摘要:
Under one aspect, a method for processing a thin film includes generating a first set of shaped beamlets from a first laser beam pulse, each of the beamlets of the first set of beamlets having a length defining the y-direction, a width defining the x-direction, and a fluence that is sufficient to substantially melt a film throughout its thickness in an irradiated film region and further being spaced in the x-direction from adjacent beamlets of the first set of beamlets by gaps; irradiating a first region of the film with the first set of shaped beamlets to form a first set of molten zones which laterally crystallize upon cooling to form a first set of crystallized regions including crystal grains that are substantially parallel to the x-direction and having a length and width substantially the same as the length .and width of each of the shaped beamlets and being separated from adjacent crystallized regions by gaps substantially the same as the gaps separating the shaped beamlets; generating a second set of shaped beamlets from a second laser beam pulse, each beamlet of the second set of beamlets having a length, width, fluence, and spacing that is substantially the same as the length, width, fluence, and spacing of each beamlet of the first set of beamlets; and continuously scanning the film so as to irradiate a second region of the film with the second set of shaped beamlets to form a second set of molten zones that are displaced in the x-direction from the first set of crystallized regions, wherein at least one molten zone of the second set of molten zones partially overlaps at least one crystallized region of the first set of crystallized regions and crystallizes upon cooling to form elongations of crystals in said at least one crystallized region.
摘要:
A method for processing a silicon thin film into a polycrystalline silicon thin film comprising the steps of: (a) generating a sequence of excimer laser pulses, each having a substantially predetermined size; (b) masking a laser pulse in the sequence with a mask having one or more slits having a predetermined width to generate one or more first laser beamlets corresponding to the laser pulse, such that each beamlet has a shape defined by a length corresponding to the predetermined laser pulse size and a width corresponding to the slit width; (c) irradiating a silicon thin film with the one or more first laser beamlets to effect melting of a first portion of the thin film corresponding to the shape of the one or more laser beamlets; (d) translating at least one of the thin film and the excimer laser pulses relative to each other so that one or more laser beamlets corresponding to a second laser pulse is incident on a second location of the thin film; and (e) after step (d), irradiating a second portion of the thin film with the one or more second laser beamlets corresponding to the second pulse to effect melting of the second portion at the second film location, wherein the second portion partially overlaps the first portion. Each of the irradiated portions is melted through a thickness of the thin film. A lateral growth is effectuated in each molten portion of the thin film.
摘要:
A method for processing a silicon thin film into a polycrystalline silicon thin film comprising the steps of: (a) generating a sequence of excimer laser pulses, each having a substantially predetermined size; (b) masking a laser pulse in the sequence with a mask having one or more slits having a predetermined width to generate one or more first laser beamlets corresponding to the laser pulse, such that each beamlet has a shape defined by a length corresponding to the predetermined laser pulse size and a width corresponding to the slit width; (c) irradiating a silicon thin film with the one or more first laser beamlets to effect melting of a first portion of the thin film corresponding to the shape of the one or more laser beamlets; (d) translating at least one of the thin film and the excimer laser pulses relative to each other so that one or more laser beamlets corresponding to a second laser pulse is incident on a second location of the thin film; and (e) after step (d), irradiating a second portion of the thin film with the one or more second laser beamlets corresponding to the second pulse to effect melting of the second portion at the second film location, wherein the second portion partially overlaps the first portion. Each of the irradiated portions is melted through a thickness of the thin film. A lateral growth is effectuated in each molten portion of the thin film.
摘要:
Provided are a semiconductor device including an active area which is defined as high and low mobility areas and a thin film transistor having the semiconductor device. The mobility of the active area can be lowered to a level enough to satisfy the requirement of the semiconductor device. The lowering of the mobility of the active area can contribute to reducing mobility deviation between semiconductor devices. As a result, the quality of a flat panel display adopting a large-scale semiconductor device can be greatly improved.
摘要:
A laser beam (102) of 350-800 nm wavelength generated by a pulsed laser (101) is shaped into a line beam (300) of width (W0) and length (L0). The resulting beam (300) is emitted onto a film material (201) of amorphous or polycrystalline silicon on a substrate (203) for a heat treatment.
摘要:
A thin film pattern substrate on which a thin film pattern is formed by placing a functional liquid on the substrate, the thin film pattern includes a first domain area into which the functional liquid is infused and a second domain area on which the functional liquid infused into the first domain area flows, wherein the first domain area includes a plurality of linear patterns the width of which is narrower than the width of the first domain area, and the linear patterns forming the second domain area are connected to at least one of the plural linear patterns that constitute the first domain area.
摘要:
Provided are a semiconductor device including an active area which is defined as high and low mobility areas and a thin film transistor having the semiconductor device. The mobility of the active area can be lowered to a level enough to satisfy the requirement of the semiconductor device. The lowering of the mobility of the active area can contribute to reducing mobility deviation between semiconductor devices. As a result, the quality of a flat panel display adopting a large-scale semiconductor device can be greatly improved.
摘要:
The present invention is characterized in that by laser beam being slantly incident to the convex lens, an aberration such as astigmatism or the like is occurred, and the shape of the laser beam is made linear on the irradiation surface or in its neighborhood. Since the present invention has a very simple configuration, the optical adjustment is easier, and the device becomes compact in size. Furthermore, since the beam is slantly incident with respect to the irradiated body, the return beam can be prevented.
摘要:
Provided is a flat panel display in which no stripes appear on a screen, thereby improving image quality. The flat panel display has a matrix-type array of sub-pixels, each of which includes a driving thin film transistor, a first electrode driven by the driving thin film transistor, and a second electrode driving a light emission unit together with the first electrode. The driving thin film transistor includes semiconductor channels which are derived from a semiconductor layer. Heterogeneous straight lines are separated from each other on the semiconductor layer. An imaginary line connecting the semiconductor channels of one column is not parallel to the heterogeneous straight lines.
摘要:
A method of fabricating a TFT using dual or multiple gates, and a TFT having superior characteristics and uniformity by providing a method of fabricating a TFT using dual or multiple gates by calculating the probability including Nmax, the maximum number of crystal grain boundaries in active channel regions according to the length of the active channels, and adjusting a gap between the active channels capable of synchronizing the number of the crystal grain boundaries in each active channel region of the TFT using the dual or multiple gates in the case where Gs, the size of crystal grains of polycrystalline silicon forming a TFT substrate, θ angle in which "primary" crystal grain boundaries are inclined at a direction perpendicular to an active channel direction of the gates, the width of the active channels and the length of the active channels are determined.