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192 条记录 (耗时 0.015 秒)

    RESIN COMPOSITION FOR REFLECTING PLATE
    81.
    发明公开
    RESIN COMPOSITION FOR REFLECTING PLATE 无效
    树脂组合物的反射板

    公开(公告)号：EP1466944A4

    公开(公告)日：2005-01-12

    申请号：EP02738887

    申请日：2002-06-28

    申请人： OTSUKA CHEMICAL CO LTD

    发明人： TSUTSUMI HIDEYUKI ,  TABUCHI AKIRA ,  YAGI TOSHIAKI

    IPC分类号： C08K7/00 ,  C08K7/08 ,  C08K7/10 ,  C08L77/00 ,  C08L101/00 ,  G02B5/08 ,  C08L77/06 ,  C08K3/24 ,  C08K3/34 ,  C08K7/04

    CPC分类号： C08K7/08 ,  C08K7/10 ,  G02B5/08 ,  C08L77/00

    摘要： A first resin composition for a reflecting plate which comprises 30 to 95 wt % of a semi-aromatic polyamide containing an aromatic monomer unit in a content of 20 mole % or more and 5 to 70 wt % of a potassium titanate fiber and/or wollastonite; and a second resin composition for a reflecting plate for use in an ultraviolet ray producing source which comprises a thermoplastic resin and at least one inorganic compound in the form of a fiber or a small and thin plate being capable of reflecting ultraviolet rays as well as visible rays. The first and the second resin compositions can be suitably used for producing a reflecting plate which can combine high levels of various properties required for a reflecting plate, such as mechanical strength, thermal resistance, dimensional stability, light reflectivity, light shading property and the like, and a reflecting plate which has the above characteristic of the first one and also can achieve satisfactory reflectivity i.e. brightness even when used in a white LED having an ultra-red light emission element, respectively.

    POLYAMIDE RESIN COMPOSITION AND MOLDING THEREOF
    86.
    发明授权
    POLYAMIDE RESIN COMPOSITION AND MOLDING THEREOF 失效
    聚酰胺树脂组合物及成型THEREOF

    公开(公告)号：EP0741762B1

    公开(公告)日：1998-04-22

    申请号：EP95909313.9

    申请日：1995-01-25

    申请人： E.I. DU PONT DE NEMOURS AND COMPANY

    发明人： HAYASHI, Ryuichi

    IPC分类号： C08L77/00 ,  C08G69/26 ,  C08K7/08

    CPC分类号： C08K7/08 ,  C08G69/26 ,  C08G69/265 ,  C08L77/00

    摘要： A polyamide resin composition having good molding fluidity, heat and chemical resistance and dimensional stability is provided containing: (A) 30-90 weight percent, based on components (A) and (B), of a polyamide resin containing (i) 10-99 weight percent, based on components (i) and (ii) of an aromatic polyamide containing a carboxylic acid component derived from terephthalic acid or a mixture of terephthalic and isophthalic acid in which the isophthalic acid constitutes 40 mole percent or less of the mixture, and an aliphatic diamine component derived from a mixture of hexamethylene diamine and 2-methylpentamethylene diamine; and (ii) 1-90 weight percent, based on components (i) and (ii), of at least one polyamide selected from the group consisting of polyamides containing repeat units derived from alipathic dicarboxylic acids and alipathic diamines and polyamides containing repeat units derived from aliphatic aminocarboxylic acids; and (B) 10-70 weight percent, based on components (A) and (B), of an inorganic filler.

    MINERAL FILLED COPOLYAMIDE COMPOSITIONS
    87.
    发明授权
    MINERAL FILLED COPOLYAMIDE COMPOSITIONS 失效
    矿物填充的共聚酰胺组合物

    公开(公告)号：EP0696304B1

    公开(公告)日：1998-03-04

    申请号：EP94915412.4

    申请日：1994-04-28

    申请人： E.I. DU PONT DE NEMOURS AND COMPANY

    发明人： WISSMANN, Rolf, Bernhard

    IPC分类号： C08L77/00 ,  C08K7/08 ,  C08K3/34 ,  C08G69/26

    CPC分类号： C08K3/34 ,  C08G69/265 ,  C08K7/08 ,  C08L77/00

    摘要： According to the present invention there is provided a polymeric composition comprising: (a) a first polyamide prepared from an aromatic carboxylic acid component and an aliphatic diamine component, the aliphatic diamine component being a mixture of hexamethylene diamine and 2-methyl 1,5-pentamethylene diamine; (b) a second polyamide selected from an aliphatic polyamide, a semiaromatic polyamide, or mixtures or blends thereof; and (c) a mineral filler. These polymeric compositions have a Tg of about 117 °C or less. These compositions provide a Tcc of about 145 °C to 160 °C. Molded articles made from these compositions have a good surface appearance.

    摘要翻译： 根据本发明，提供了一种聚合物组合物，其包含：（a）由芳族羧酸组分和脂族二胺组分制备的第一聚酰胺，所述脂族二胺组分是六亚甲基二胺和2-甲基1,5-戊二胺的混合物， 五亚甲基二胺; （b）选自脂族聚酰胺，半芳族聚酰胺或其混合物或共混物的第二种聚酰胺; 和（c）矿物填料。 这些聚合物组合物的Tg约为117℃或更低。 这些组合物提供约145℃至160℃的Tcc。 由这些组合物制成的模塑制品具有良好的表面外观。

    POLYAMIDE RESIN COMPOSITION AND MOLDING THEREOF
    90.
    发明公开
    POLYAMIDE RESIN COMPOSITION AND MOLDING THEREOF 失效
    聚酰胺树脂组合物及成型THEREOF

    公开(公告)号：EP0741762A1

    公开(公告)日：1996-11-13

    申请号：EP95909313.0

    申请日：1995-01-25

    申请人： E.I. DU PONT DE NEMOURS AND COMPANY

    发明人： HAYASHI, Ryuichi

    IPC分类号： C08K3 ,  C08G69 ,  C08K7 ,  C08L77

    CPC分类号： C08K7/08 ,  C08G69/26 ,  C08G69/265 ,  C08L77/00

    摘要： A polyamide resin composition having good molding fluidity, heat and chemical resistance and dimensional stability is provided containing: (A) 30-90 weight percent, based on components (A) and (B), of a polyamide resin containing (i) 10-99 weight percent, based on components (i) and (ii) of an aromatic polyamide containing a carboxylic acid component derived from terephthalic acid or a mixture of terephthalic and isophthalic acid in which the isophthalic acid constitutes 40 mole percent or less of the mixture, and an aliphatic diamine component derived from a mixture of hexamethylene diamine and 2-methylpentamethylene diamine; and (ii) 1-90 weight percent, based on components (i) and (ii), of at least one polyamide selected from the group consisting of polyamides containing repeat units derived from alipathic dicarboxylic acids and alipathic diamines and polyamides containing repeat units derived from aliphatic aminocarboxylic acids; and (B) 10-70 weight percent, based on components (A) and (B), of an inorganic filler.