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公开(公告)号：EP4462945A1
公开(公告)日：2024-11-13
申请号：EP24172184.4
申请日：2024-04-24
摘要： Systems and methods can advantageously provide a protocol. A device using the protocol can include circuitry device configured to provide at least one frame while a connection is being established. The frame includes data indicating that the device is capable of a data management multilink (DMML) operation. In some examples, the frame is provided according to an 802.11 protocol.
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公开(公告)号：EP4125242B1
公开(公告)日：2024-11-13
申请号：EP22185445.8
申请日：2022-07-18
发明人： SINHA, Santanu
IPC分类号： H04L12/18 , H04L49/201
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5.发明公开
公开(公告)号：EP4456437A1
公开(公告)日：2024-10-30
申请号：EP24172155.4
申请日：2024-04-24
发明人： Mikhemar, Mohyee , Lin, Alvin Lai , Sayed, Ahmed , Chen, Wei-Hong , Srinivasan, Sudharshan , Behzad, Arya , Blanksby, Andrew J. , Sowlati, Tirdad
IPC分类号： H04B1/00
摘要： A device includes a port and a transformer. The transformer includes a first coil that has a first node and a second node and a second coil that is coupled to the output port. The device also includes a pulse generator coupled to the first node to generate two or more pulses with a first period on the first node and a delay module that is coupled between the second node of the first coil and the pulse generator. The delay module is generates a time delay to the two or more pulses of the pulse generator before the two or more pulses are delivered to the second node. The second coil provides a signal at the port.
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公开(公告)号：EP4336056B1
公开(公告)日：2024-10-30
申请号：EP23190928.4
申请日：2023-08-10
发明人： Wieland, Achim , Gerisch, Thomas , Pehl, Christian
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公开(公告)号：EP4450298A1
公开(公告)日：2024-10-23
申请号：EP22907318.4
申请日：2022-12-07
发明人： CHAYA, Takamitsu , OZAKI, Makoto
摘要： Provided is a pneumatic tire that can provide high-speed durability, high-speed steering stability, and shock burst resistance in a highly compatible manner while reducing the number of carcass layers to reduce a tire weight. In the pneumatic tire including one carcass layer (4) and a tread portion (1) made up of a cap tread layer (11) and an under tread layer (12), an under tread layer (11) is made up of a rubber composition having hardness at 20°C ranging from 60 to 65, tensile stress at 100% elongation at 100°C ranging from 2.0 MPa to 4.0 MPa, and a product of tensile strength at 100°C and an elongation at break at 100°C of 2000 or more, the carcass layer (4) is made of an organic fiber cord having an elongation ratio under a load of 1.5 cN/dtex on an inner circumferential side of a belt layer ranging from 5.5% to 8.5% and an elongation at break ranging from 20% to 30%, and a product A = D × Ec of a fineness based on corrected mass D per carcass cord and an insertion count Ec is set to from 1.8 × 10 5 dtex/50 mm to 3.0 × 10 5 dtex/50 mm.
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公开(公告)号：EP4449685A1
公开(公告)日：2024-10-23
申请号：EP22840399.4
申请日：2022-11-21
申请人： VMware LLC
IPC分类号： H04L41/0266 , H04L41/082 , H04L41/085 , H04L41/0895 , H04L41/00 , H04L41/044 , G06F9/50 , H04L41/046
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9.发明公开
公开(公告)号：EP4446887A1
公开(公告)日：2024-10-16
申请号：EP24167546.1
申请日：2024-03-28
申请人： VMware LLC
发明人： Urmese, Nidhin , Radev, Ivaylo Radoslavov , Gorai, Krishnendu , Gorthi, Narasimha Gopal , Badavanahalli Nagaraja Gupta, Rashmi
IPC分类号： G06F9/455
摘要： An example method of enabling a virtual infrastructure management (VIM) appliance for lifecycle management includes: identifying, by a cloud platform executing in a public cloud, a manager VIM appliance for the VIM appliance, the manager VIM appliance and the VIM appliance executing in at least one on-premises data center of an on-premises environment; obtaining information related to a management cluster having the manager VIM appliance and a virtual machine (VM) executing the VIM appliance; creating and applying, by the cloud platform in response to the information, a desired state for both the manager VIM appliance and the VIM appliance; and updating the cloud platform with a topology of the manager VIM appliance and the VIM appliance in the management cluster.
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公开(公告)号：EP4444047A1
公开(公告)日：2024-10-09
申请号：EP24164724.7
申请日：2024-03-20
发明人： WANG, JyunMin , FUNG, James , ZHOU, Brance , LI, Stella , WEI, Vivi , DUAN, Cain , XIE, Melody , ZHOU, Lucas
CPC分类号： H05K3/0047 , H05K3/0055 , H05K2203/079620130101 , H05K2201/207220130101 , H05K2203/118420130101 , H05K1/0298 , H05K2203/07220130101 , H05K2203/030720130101 , H05K2201/0956320130101 , H05K3/002 , H05K2201/0961820130101 , H05K2201/0950920130101 , H05K2201/0985420130101 , H05K3/421 , H05K1/115
摘要： The present application provides a component carrier and a method of manufacture the same, the component carrier, comprising: a stack with a plurality of electrically insulating layer structures and one or more electrically conductive layer structures ,
the one or more electrically conductive layer structures comprise two opposed conductive surfaces ;
a plurality of first vias , formed at a front side of the stack , the plurality of first vias is connected to one of the two opposed conductive surfaces through a respective first baseline etch surface ; and
a plurality of second vias , formed at a back side of the stack, the front side is opposed to the back side , wherein the plurality of second vias is connected to the other one of the two opposed conductive surfaces through a respective second baseline etch surface .
The total area defined by the first baseline etch surfaces is higher than the total area defined by the second baseline etch surfaces and the depth of at least one of the first baseline etch surfaces is lower than the depth of at least one of the second baseline etch surfaces.
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