公开(公告)号：EP4420200A1

公开(公告)日：2024-08-28

申请号：EP22840385.3

申请日：2022-11-18

申请人： Kollmorgen Corporation

发明人： BREWSTER, Jeffery Todd ,  ANDERSON William Edward, IV ,  WOOD, Tyler William ,  CANTANDO, Elizabeth

IPC分类号： H01R13/58 ,  H05K1/02 ,  H01R12/77 ,  H05K5/00 ,  H05K3/34 ,  H05K3/30 ,  H05K7/06 ,  H05K7/12 ,  H02G3/32

CPC分类号： H05K2201/207220130101 ,  H05K2201/1035620130101 ,  H05K3/3405 ,  H05K1/0271 ,  H05K2201/0906320130101 ,  H05K3/301 ,  H05K2201/1060620130101 ,  H02G3/32

公开(公告)号：EP4397142A2

公开(公告)日：2024-07-10

申请号：EP22762156.2

申请日：2022-08-29

申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO

发明人： HARKEMA, Stephan ,  TEUNISSEN, Jean-Pierre ,  RENTROP, Cornelis Hermanus Arnoldus ,  DE KOK, Margaretha Maria

IPC分类号： H05K3/22 ,  H05K3/28

CPC分类号： H05K2201/207220130101 ,  H05K2203/17820130101 ,  H05K2203/17620130101 ,  H05K3/22 ,  H05K2203/078320130101 ,  H05K2203/132720130101 ,  H05K2203/132220130101 ,  H05K3/284 ,  H05K2203/131620130101 ,  H05K1/0393 ,  H05K1/119 ,  H05K2203/07420130101 ,  H05K2203/074620130101 ,  H05K2203/076320130101 ,  H05K2201/0906320130101 ,  H05K3/0014 ,  H05K1/0284 ,  H05K2201/010820130101 ,  H05K2201/011220130101 ,  H05K2201/1010620130101 ,  H05K2201/1011320130101 ,  H05K2201/1012820130101 ,  H05K2201/0993620130101

公开(公告)号：EP4444047A1

公开(公告)日：2024-10-09

申请号：EP24164724.7

申请日：2024-03-20

申请人： AT&S (Chongqing) Company Limited

发明人： WANG, JyunMin ,  FUNG, James ,  ZHOU, Brance ,  LI, Stella ,  WEI, Vivi ,  DUAN, Cain ,  XIE, Melody ,  ZHOU, Lucas

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00

CPC分类号： H05K3/0047 ,  H05K3/0055 ,  H05K2203/079620130101 ,  H05K2201/207220130101 ,  H05K2203/118420130101 ,  H05K1/0298 ,  H05K2203/07220130101 ,  H05K2203/030720130101 ,  H05K2201/0956320130101 ,  H05K3/002 ,  H05K2201/0961820130101 ,  H05K2201/0950920130101 ,  H05K2201/0985420130101 ,  H05K3/421 ,  H05K1/115

摘要： The present application provides a component carrier and a method of manufacture the same, the component carrier, comprising: a stack with a plurality of electrically insulating layer structures and one or more electrically conductive layer structures ,
the one or more electrically conductive layer structures comprise two opposed conductive surfaces ;
a plurality of first vias , formed at a front side of the stack , the plurality of first vias is connected to one of the two opposed conductive surfaces through a respective first baseline etch surface ; and
a plurality of second vias , formed at a back side of the stack, the front side is opposed to the back side , wherein the plurality of second vias is connected to the other one of the two opposed conductive surfaces through a respective second baseline etch surface .
The total area defined by the first baseline etch surfaces is higher than the total area defined by the second baseline etch surfaces and the depth of at least one of the first baseline etch surfaces is lower than the depth of at least one of the second baseline etch surfaces.

公开(公告)号：EP4356695A1

公开(公告)日：2024-04-24

申请号：EP22737402.2

申请日：2022-06-15

申请人： Rolls-Royce Deutschland Ltd & Co KG

发明人： BUCHERT, Stanley ,  WALTRICH, Uwe

IPC分类号： H05K3/28

CPC分类号： H05K3/28 ,  H05K2201/0914520130101 ,  H05K2201/076120130101 ,  H05K2201/207220130101

公开(公告)号：EP3096592B1

公开(公告)日：2024-09-04

申请号：EP15737145.1

申请日：2015-01-14

IPC分类号： H05K3/34 ,  H05K1/02 ,  H05K3/10 ,  H05K3/00 ,  H05K3/18

CPC分类号： H05K2201/0901820130101 ,  H05K2201/0911820130101 ,  H05K2203/056820130101 ,  H05K3/105 ,  H05K3/182 ,  H05K3/3452 ,  H05K2201/207220130101 ,  H05K2203/10720130101 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/341 ,  Y02P70/50

公开(公告)号：EP4397141A1

公开(公告)日：2024-07-10

申请号：EP22773410.0

申请日：2022-08-30

申请人： Heraeus Electronics GmbH & Co. KG

发明人： AN, Shouming ,  WANG, Rong ,  LIU, Erwei ,  SHEN, Fangzhong

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/38 ,  H05K1/02 ,  H05K3/12 ,  H05K3/14

CPC分类号： H05K1/0373 ,  H05K1/097 ,  H05K3/107 ,  H05K3/386 ,  H05K3/388 ,  H05K3/389 ,  H05K3/1208 ,  H05K3/1216 ,  H05K3/14 ,  H05K3/1283 ,  H05K1/0212 ,  H05K2201/021520130101 ,  H05K2201/207220130101 ,  H05K2201/025720130101 ,  H05K2203/119420130101 ,  H05K2203/12120130101

公开(公告)号：EP4300576A3

公开(公告)日：2024-06-26

申请号：EP23209817.8

申请日：2017-12-22

申请人： At&S (China) Co., Ltd.

发明人： TAY, Seok Kim (Annie) ,  TUOMINEN, Mikael Andreas ,  BAFTIRI, Artan

IPC分类号： H05K1/18 ,  H05K1/02 ,  H01L23/538 ,  H01L23/48 ,  H05K3/30 ,  H05K3/46 ,  C09J7/00

CPC分类号： H05K1/0204 ,  H05K1/185 ,  H05K3/4652 ,  H05K2201/1041620130101 ,  H05K2201/207220130101 ,  H05K2201/20920130101 ,  H05K2203/06320130101 ,  C09J7/00 ,  H05K2201/02620130101 ,  H05K2201/032320130101 ,  H05K2203/019120130101 ,  C09J2203/32620130101 ,  H05K2201/0912720130101 ,  H01L2224/1820130101 ,  H01L23/49822 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/49894 ,  C09J2301/3120200801

摘要： A component carrier (106), comprising a stack (116) comprising at least one electrically conductive layer structure (114) and/or at least one electrically insulating layer structure (112), a sheet (100) with nano- and/or microstructures (102) and arranged on and/or in the stack (116), said sheet (100) comprising or consisting of copper.

公开(公告)号：EP4364244A1

公开(公告)日：2024-05-08

申请号：EP22743757.1

申请日：2022-06-29

申请人： AGC Glass Europe

发明人： BUI-VAN, Hà ,  SCHNÖRCH, Peter ,  SARKIS, Remi ,  DERUETTE, Raphaël

IPC分类号： H01R4/28 ,  H05K3/32 ,  H01R12/63 ,  H01R9/05 ,  H01Q1/38 ,  H01Q1/12

CPC分类号： H01R2201/0220130101 ,  H01R9/0515 ,  H01R12/63 ,  H01R4/28 ,  H05K3/325 ,  H01Q1/38 ,  H05K3/4676 ,  H05K1/189 ,  H05K2201/207220130101 ,  H05K2201/1035620130101 ,  H05K2201/0980920130101