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公开(公告)号：EP2267737A2
公开(公告)日：2010-12-29
申请号：EP10004839.6
申请日：2005-07-05
发明人： Mruz, John
CPC分类号： G06F17/30572 , G06F17/30554 , H01G4/005 , H01G4/248 , H01G4/30 , H01G4/38 , H01G4/40 , Y10S707/99931
摘要： An electronic component, comprising a RF component, preferably a multilayer capacitor, an inductor, a resistor, a filter, a transmission line or a plurality of transmission lines, and a pair of low-loss conductors, wherein each of said pair of low-loss conductors surrounds said RF component on four sides and is co-terminal with said RF component on a remaining two sides, preferably with a gap formed between said pair of low- loss conductors creating a low-loss capacitor.
摘要翻译： 一种电子部件，包括RF部件，优选多层电容器，电感器，电阻器，滤波器，传输线或多条传输线，以及一对低损耗导体，其中， 损耗导体在四个侧面上围绕所述RF部件，并且在剩余的两侧上与所述RF部件共同端子，优选地在所述一对低损耗导体之间形成间隙，形成低损耗电容器。
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公开(公告)号：EP2710675A1
公开(公告)日：2014-03-26
申请号：EP12779436.0
申请日：2012-05-04
发明人： GROSSBACH, Robert , MRUZ, John
CPC分类号： H01F41/0612 , H01F17/04 , H01F27/06 , H01F2005/006 , H01G4/40 , H01P5/087 , H04B1/71635 , H05K1/0243 , Y10T29/4902 , Y10T29/49071
摘要： An ultra-wideband assembly in an electrical circuit having a circuit board with a conductive micro-strip line is provided. The assembly includes a non-conductive tapered core having an outer surface, a distal end, and a proximate end. The distal end is being larger than proximate end. The assembly includes a conductive wire having a proximate end and a distal end and being wound about at least a portion of the non-conductive tapered core. The proximate end of the conductive wire extends away from the proximate end of the non- conductive tapered core and is being conductively coupled to the micro-strip line of the circuit board. The distal end of the conductive wire extends away from the distal end of the non-conductive tapered core. The conductive wire contacts at least a portion of the outer surface of the non-conductive tapered core. The assembly includes a supporting bracket coupled to the non-conductive tapered core. The bracket includes a base portion and a core attachment portion. The base portion is being conductively coupled to the circuit board. The core attachment portion is being coupled to the distal end of the non-conductive tapered core and is further being conductively coupled to the distal end of the conductive wire. While being coupled to the non-conductive tapered core, the supporting bracket is configured to dispose the non-conductive tapered core at a predetermined angle to the circuit board.
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公开(公告)号：EP0835516B1
公开(公告)日：2006-08-16
申请号：EP96912432.0
申请日：1996-03-22
发明人： MONSORNO, Richard
CPC分类号： H01G4/255 , H01G4/06 , Y10T29/435
摘要： A capacitor (10) includes a planar electrode layer (12) which is mounted between a pair of dielectric layers (14, 16). The electrode layer (12) generally is centered with respect to the dielectric layers (14, 16), and one of the dielectric layers has a pair of spaced-apart leads (18, 20). The electrode layer (12) is buried within the dielectric layers (14, 16) on which the leads are mounted, and the leads (18, 20) allow the development of a selected value of capacitance between the leads (18, 20).
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公开(公告)号：EP2267737A3
公开(公告)日：2012-10-17
申请号：EP10004839.6
申请日：2005-07-05
发明人： Mruz, John
CPC分类号： G06F17/30572 , G06F17/30554 , H01G4/005 , H01G4/248 , H01G4/30 , H01G4/38 , H01G4/40 , Y10S707/99931
摘要： An electronic component, comprising a RF component, preferably a multilayer capacitor, an inductor, a resistor, a filter, a transmission line or a plurality of transmission lines, and a pair of low-loss conductors, wherein each of said pair of low-loss conductors surrounds said RF component on four sides and is co-terminal with said RF component on a remaining two sides, preferably with a gap formed between said pair of low- loss conductors creating a low-loss capacitor.
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公开(公告)号：EP0835516A1
公开(公告)日：1998-04-15
申请号：EP96912432.0
申请日：1996-03-22
发明人： MONSORNO, Richard
IPC分类号： H01G4
CPC分类号： H01G4/255 , H01G4/06 , Y10T29/435
摘要： A capacitor (10) includes a planar electrode layer (12) which is mounted between a pair of dielectric layers (14, 16). The electrode layer (12) generally is centered with respect to the dielectric layers (14, 16), and one of the dielectric layers has a pair of spaced-apart leads (18, 20). The electrode layer (12) is buried within the dielectric layers (14, 16) on which the leads are mounted, and the leads (18, 20) allow the development of a selected value of capacitance between the leads (18, 20).
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