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    INTEGRATED LENS AND CHIP ASSEMBLY FOR A DIGITAL CAMERA
    2.
    发明公开
    INTEGRATED LENS AND CHIP ASSEMBLY FOR A DIGITAL CAMERA 审中-公开
    INTEGRIERTE LINSE UND CHIP-BAUGRUPPEFÜREINE DIGITALKAMERA

    公开(公告)号：EP1726157A2

    公开(公告)日：2006-11-29

    申请号：EP05713765.5

    申请日：2005-02-18

    申请人： Flextronics International USA Inc.

    发明人： KALE, Vidyadhar, Sitaram ,  TAM, Samuel, Waising ,  SHANGGUAN, Dongkai

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

    摘要： A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A Jens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The Jens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).

    摘要翻译： 本发明涉及一种用于制造相机模块的方法，所述方法包括以下步骤：提供包括多个印刷电路板的基板; 将多个相机集成电路芯片固定到所述基板，每个所述相机集成电路芯片固定在所述多个印刷电路板中的相应一个上; 以及在所述基板上形成多个模制品，每个所述模制品形成在所述多个印刷电路板中的相应一个和所述相机集成电路芯片的所述相应集成电路芯片中。 此外，本发明涉及一种基板，包括：多个印刷电路板; 多个相机集成电路芯片，所述多个相机集成电路芯片中的每一个固定到所述多个印刷电路板中的相应一个; 以及多个模制品，所述多个模制品中的每一个形成在所述多个印刷电路板和所述相应的相机集成电路芯片中的相应一个上。

    Method for manufacturing camera modules and substrate comprising a plurality of camera integrated circuit chips
    4.
    发明公开
    Method for manufacturing camera modules and substrate comprising a plurality of camera integrated circuit chips 审中-公开
    一种用于制造相机模块，和具有多个照相机的集成电路芯片基板的制造方法

    公开(公告)号：EP2265000A1

    公开(公告)日：2010-12-22

    申请号：EP10177430.5

    申请日：2005-02-18

    申请人： Flextronics International USA Inc.

    发明人： The designation of the inventor has not yet been filed

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

    摘要： The present invention is directed at a method for manufacturing camera modules, said method comprising the steps of providing a substrate including a plurality of printed circuit boards; affixing a plurality of camera integrated circuit chips to said substrate, each of said camera integrated circuit chips affixed on a respective one of said plurality of printed circuit boards; and forming a plurality of moldings on said substrate, each of said moldings formed on a respective one of said plurality of printed circuit boards and on said respective one of said camera integrated circuit chips.
    Further, the present invention is directed at a substrate comprising: a plurality of printed circuit boards; a plurality of camera integrated circuit chips, each of said plurality of camera integrated circuit chips affixed to a respective one of said plurality of printed circuit boards; and a plurality of moldings, each of said plurality of moldings formed over a respective one of said plurality of printed circuit boards and said respective camera integrated circuit chip.

    摘要翻译： 本发明是针对一种用于制造相机模块的方法，所述方法包括提供一个基片包括印刷电路板中的多个步骤; 固定的摄像机集成电路芯片向所述基板复数，每个所述摄像机的集成电路芯片固定在一个respectivement印刷电路板的所述多个中的一个; 以及形成在所述基板模制品的复数，每个所述模制品上形成的respectivement印刷电路板的所述多个中的一个，并在所述respectivement的所述摄像机的集成电路芯片中的一个。 此外，本发明涉及在底物，其包括：印刷电路板的多元性; 的每个固定到respectivement印刷电路板的所述多个相机一个集成电路芯片，所述多个照相机集成电路芯片一个多元化; 和模制品的模制品的复数，每个所述多个形成在respectivement印刷电路板的所述多个中的一个和集成电路芯片所述respectivement相机。

    POP UP PRISM LENS ASSEMBLY
    6.
    发明公开
    POP UP PRISM LENS ASSEMBLY 有权
    POP-UP棱镜组件

    公开(公告)号：EP1766471A2

    公开(公告)日：2007-03-28

    申请号：EP05766080.5

    申请日：2005-06-22

    申请人： Flextronics International USA Inc.

    发明人： RASCHKE, Klaus G.

    IPC分类号： G03B15/03

    CPC分类号： G03B5/00 ,  G03B17/00 ,  G03B17/04 ,  G03B17/17 ,  H04N5/2254

    摘要： A pop up prism camera (10) having a pop up prism lens assembly (11). A first lens assembly (14), a second lens assembly (18), and a prism assembly (21) are moved in relationship to a camera housing (12) controlled by a cam tube (20). The prism assembly (21) projects outside the camera housing (12) when the pop up prism camera (10) is in an operational configuration. A prism (100) of the prism assembly (21) redirects an optical path (48). A non-angled portion (44) of a first cam groove (30) causes the prism assembly (21) to remain fixed relative to the camera housing (12) while continued rotation of the cam tube (20) allows the first lens assembly (14) and the second lens assembly (18) to continue to move to accomplish a lens zoom function.

    System and method for design, procurement and manufacturing collaboration
    10.
    发明公开
    System and method for design, procurement and manufacturing collaboration 审中-公开
    系统与Verfahren zur Zusammenarbeit bei Entwurf，Materialwirtschaft und Herstellung

    公开(公告)号：EP2608246A1

    公开(公告)日：2013-06-26

    申请号：EP13159973.0

    申请日：2003-02-21

    申请人： Flextronics International USA, Inc.

    发明人： Brathwaite, Nicolas ,  Bommakanti, Ram Gopal ,  Ganapathy, Visvanathan ,  Burns, Paul ,  Maddox, Douglas ,  Durkan, Michael Anthony

    IPC分类号： H01L21/00 ,  G06F17/50 ,  G06Q99/00

    CPC分类号： G06F17/5081 ,  G06F17/50 ,  G06F17/5045 ,  G06F2217/00 ,  G06F2217/04 ,  G06F2217/74 ,  G06Q90/00 ,  G06Q99/00

    摘要： A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device's engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object. Optionally, data can be associated with the objects via links to the database. Types of engineering data that can be associated with design file objects include, but are not limited to, device footprint data, device pinout data, device physical dimension data, parametric data, and packaging data. Additionally, connection data and annotation data can be entered into the design file objects by the designer.

    摘要翻译： 一种用于设计电子组件的方法包括从设计者接收设备标准（例如，参数值，采购价值等），向数据库查询对应于设备标准的设备，查询数据库以获取采购数据和/或工程 与相应设备相关联的数据，基于采购数据将设备呈现给设计者，以及从设计者接收将所呈现设备中的一个标识为所选设备的输入。 在特定方法中，返回的设备基于一个或多个采购值（例如，制造商，价格，可用性，制造商状态等）进行排序，并以排名列表呈现给设计者。 然后将所选设备的代表物体输入到设计文件中，并且对象与设备的工程和/或采购数据相关联。 在特定实施例中，通过在工程数据中嵌入工程数据将对象与工程数据相关联。 可选地，数据可以通过到数据库的链接与对象相关联。 可以与设计文件对象相关联的工程数据的类型包括但不限于设备覆盖数据，设备引脚数据，设备物理尺寸数据，参数数据和打包数据。 另外，连接数据和注释数据可以由设计者输入设计文件对象。