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公开(公告)号：EP2067391A4
公开(公告)日：2014-05-07
申请号：EP07794222
申请日：2007-09-04
申请人： NANOSPACE AB
发明人： RANGSTEN PELLE , JOHANSSON HAAKAN , BEJHED JOHAN
CPC分类号： B82Y15/00 , B64G1/1078 , B64G1/26 , B64G1/401 , B81B7/0006 , B81B2207/092 , B81B2207/096 , F02K9/62 , F02K9/80 , F05D2250/82 , F05D2250/84 , Y10T29/49083 , Y10T29/49099 , Y10T29/49155 , Y10T29/49346 , Y10T29/49718 , Y10T29/49746
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公开(公告)号：EP2349916B1
公开(公告)日：2016-12-14
申请号：EP09822272.2
申请日：2009-10-19
申请人： NanoSpace AB
CPC分类号： F16K99/0001 , F16K99/0057 , F16K2099/008 , Y10T137/1812 , Y10T137/7842 , Y10T137/8122 , Y10T137/87507 , Y10T137/87555
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3.发明授权NOZZLE ARRANGEMENT FOR USE IN A GAS THRUSTER, GAS THRUSTER, METHOD FOR MANUFACTURING A NOZZLE ARRANGEMENT, METHOD FOR IN-SITU REPAIRING OF A NOZZLE ARRANGEMENT AND A METHOD FOR OPERATING A GAS THRUSTER 有权JET安排使用在气体顶起装置，气体顶起装置，制造方法喷嘴排列，方法原位JETS修理方法操作气体推力装置
公开(公告)号：EP2064436B1
公开(公告)日：2016-04-06
申请号：EP07794220.9
申请日：2007-09-04
申请人： NanoSpace AB
IPC分类号： H05K3/36 , H01L23/48 , B81B7/00 , B64G1/10 , B64G1/26 , B64G1/40 , B82Y15/00 , F02K9/62 , F02K9/80
CPC分类号： B82Y15/00 , B64G1/1078 , B64G1/26 , B64G1/401 , B81B7/0006 , B81B2207/092 , B81B2207/096 , F02K9/62 , F02K9/80 , F05D2250/82 , F05D2250/84 , Y10T29/49083 , Y10T29/49099 , Y10T29/49155 , Y10T29/49346 , Y10T29/49718 , Y10T29/49746
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公开(公告)号：EP1941197B1
公开(公告)日：2016-03-16
申请号：EP06799835.1
申请日：2006-10-04
申请人： NanoSpace AB
发明人： STENMARK, Lars , RANGSTEN, Pelle
CPC分类号： F16K17/383 , B64G1/402 , F16K17/403 , F16K99/0038 , Y10T137/0497 , Y10T137/1639 , Y10T137/1774 , Y10T137/8122 , Y10T137/8326
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公开(公告)号：EP1941197A4
公开(公告)日：2013-03-27
申请号：EP06799835
申请日：2006-10-04
申请人： NANOSPACE AB
发明人： STENMARK LARS , RANGSTEN PELLE
CPC分类号： F16K17/383 , B64G1/402 , F16K17/403 , F16K99/0038 , Y10T137/0497 , Y10T137/1639 , Y10T137/1774 , Y10T137/8122 , Y10T137/8326
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公开(公告)号：EP2349916A1
公开(公告)日：2011-08-03
申请号：EP09822272.2
申请日：2009-10-19
申请人： NanoSpace AB
CPC分类号： F16K99/0001 , F16K99/0057 , F16K2099/008 , Y10T137/1812 , Y10T137/7842 , Y10T137/8122 , Y10T137/87507 , Y10T137/87555
摘要： A micromechanical pressure relief valve arrangement (10) comprises a stack of wafers (13). An active pressure relief valve (20) is realized within the stack of wafers (13). A passive pressure relief valve (30) is also realized within said stack of wafers (13), arranged in parallel to the active pressure relief valve (20). A check valve (50), also realized within the stack of wafers (13), is arranged in series with both the active pressure relief valve (20) and the passive pressure relief valve (30).
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公开(公告)号：EP2067391A1
公开(公告)日：2009-06-10
申请号：EP07794222.5
申请日：2007-09-04
申请人： NanoSpace AB
发明人： RANGSTEN, Pelle , JOHANSSON, Håkan , BEJHED, Johan
CPC分类号： B82Y15/00 , B64G1/1078 , B64G1/26 , B64G1/401 , B81B7/0006 , B81B2207/092 , B81B2207/096 , F02K9/62 , F02K9/80 , F05D2250/82 , F05D2250/84 , Y10T29/49083 , Y10T29/49099 , Y10T29/49155 , Y10T29/49346 , Y10T29/49718 , Y10T29/49746
摘要： A wafer assembly (30) comprises a substrate (71), in turn comprising a wafer (70) or a stack of wafers. The wafer assembly (30) further comprises an electrical connection (32) arranged through at least a part of the substrate (71). The electrical connection (32) is made by low-resistance silicon. The electrical connection (32) is positioned in a hole (84) penetrating at least a part of the substrate (71). A surface (78) of the substrate (71) confining the hole (84) is electrically insulating. The electrical connection (32) has at least one protrusion (75), which protrudes transversally to a main extension (83) of the hole (84) and the protrusion (75) protrudes outside a minimum hole diameter (85), as projected in the main extension (83) of the hole (84). Preferably, the protrusion (75) is supported by a support surface (81) of the substrate (71). A manufacturing method is also disclosed.
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公开(公告)号：EP2067391B1
公开(公告)日：2017-03-01
申请号：EP07794222.5
申请日：2007-09-04
申请人： NanoSpace AB
发明人： RANGSTEN, Pelle , JOHANSSON, Håkan , BEJHED, Johan
CPC分类号： B82Y15/00 , B64G1/1078 , B64G1/26 , B64G1/401 , B81B7/0006 , B81B2207/092 , B81B2207/096 , F02K9/62 , F02K9/80 , F05D2250/82 , F05D2250/84 , Y10T29/49083 , Y10T29/49099 , Y10T29/49155 , Y10T29/49346 , Y10T29/49718 , Y10T29/49746
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公开(公告)号：EP1969269B1
公开(公告)日：2015-03-25
申请号：EP06835976.9
申请日：2006-12-28
申请人： NanoSpace AB
发明人： BEJHED, Johan , KARLSSON, Mikael
CPC分类号： F16K13/04 , B01L3/502738 , F16K31/025 , F16K99/0001 , F16K99/003 , F16K99/0044 , Y10T137/1812 , Y10T137/2196
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10.发明公开FILTER COMPRISING STACKABLE FILTER WAFERS WITH FILTERING CHANNELS ON OPPOSING SIDES OF THE WAFERS 审中-公开过滤器，包括可堆叠的过滤器滤波器和过滤器反面的过滤器通道
公开(公告)号：EP2558182A1
公开(公告)日：2013-02-20
申请号：EP11769164.2
申请日：2011-04-04
申请人： NanoSpace AB
CPC分类号： B01D29/46
摘要： A filter comprises a stack of wafers (28). Each of the wafers has a through hole (6). Edges (7) of the holes together define an internal tube. An interface (32) between adjacent wafers defines filter channels. The filter channels comprises first coarse filter channels (20), second coarse filter channels (22) and fine filter channels (26). The first coarse filter channels are open towards an outer rim (5), extend in a direction from the outer rim and are closed towards the internal tube. The second coarse filter channels are arranged in an opposite manner. The fine filter channels connect the first and second coarse filter channels. The first and second coarse filter channels extend radially (R) and the fine filter channels extend tangentially (T). The first and second coarse filter channels are defined by recesses in a surface of a first wafer and the fine filter channels are defined by recesses, each one encircling the hole, in a surface of a second wafer.
摘要翻译： 过滤器包括一叠晶片（28）。 每个晶片都有一个通孔（6）。 孔的边缘（7）一起限定内管。 相邻晶片之间的接口（32）限定过滤器通道。 过滤通道包括第一粗过滤通道（20），第二粗过滤通道（22）和精过滤通道（26）。 第一粗过滤器通道朝向外缘（5）敞开，沿着从外缘延伸的方向延伸并朝向内管闭合。 第二粗滤器通道以相反的方式排列。 细过滤器通道连接第一和第二粗过滤器通道。 第一和第二粗过滤器通道径向延伸（R），细过滤器通道沿切向（T）延伸。 第一和第二粗过滤器通道由第一晶片的表面中的凹陷限定，并且精细过滤器通道由第二晶片的表面中的凹陷限定，每个凹陷围绕孔。
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