公开(公告)号：EP3378106B1

公开(公告)日：2019-10-02

申请号：EP16788373.5

申请日：2016-10-19

申请人： Lumileds Holding B.V. ,  Yu, Wen ,  Shchekin, Oleg B. ,  Wall, Franklin ,  Tai, Kuochou ,  Mala, Mohiuddin ,  Zona, Robert ,  Kmetec, Jeffrey ,  Nickel, Alexander

发明人： YU, Wen ,  SHCHEKIN, Oleg B.

IPC分类号： H01L33/38 ,  H01L27/15 ,  H01L33/62

公开(公告)号：EP3378106A1

公开(公告)日：2018-09-26

申请号：EP16788373.5

申请日：2016-10-19

申请人： Lumileds Holding B.V. ,  Yu, Wen ,  Shchekin, Oleg B. ,  Wall, Franklin ,  Tai, Kuochou ,  Mala, Mohiuddin ,  Zona, Robert ,  Kmetec, Jeffrey ,  Nickel, Alexander

发明人： YU, Wen ,  SHCHEKIN, Oleg B.

IPC分类号： H01L33/38 ,  H01L27/15 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L24/05 ,  H01L24/06 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/38 ,  H01L2224/05013 ,  H01L2924/12041

摘要： Light emitting die (300) comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (N1,P1 and N2,P2), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated (330) to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single inter-connect layer on the substrate upon which the die is mounted.