公开(公告)号：EP3378106B1

公开(公告)日：2019-10-02

申请号：EP16788373.5

申请日：2016-10-19

申请人： Lumileds Holding B.V. ,  Yu, Wen ,  Shchekin, Oleg B. ,  Wall, Franklin ,  Tai, Kuochou ,  Mala, Mohiuddin ,  Zona, Robert ,  Kmetec, Jeffrey ,  Nickel, Alexander

发明人： YU, Wen ,  SHCHEKIN, Oleg B.

IPC分类号： H01L33/38 ,  H01L27/15 ,  H01L33/62

公开(公告)号：EP3378106A1

公开(公告)日：2018-09-26

申请号：EP16788373.5

申请日：2016-10-19

申请人： Lumileds Holding B.V. ,  Yu, Wen ,  Shchekin, Oleg B. ,  Wall, Franklin ,  Tai, Kuochou ,  Mala, Mohiuddin ,  Zona, Robert ,  Kmetec, Jeffrey ,  Nickel, Alexander

发明人： YU, Wen ,  SHCHEKIN, Oleg B.

IPC分类号： H01L33/38 ,  H01L27/15 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L24/05 ,  H01L24/06 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/38 ,  H01L2224/05013 ,  H01L2924/12041

摘要： Light emitting die (300) comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (N1,P1 and N2,P2), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated (330) to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single inter-connect layer on the substrate upon which the die is mounted.

公开(公告)号：EP3360169A1

公开(公告)日：2018-08-15

申请号：EP16767434.0

申请日：2016-09-02

申请人： Lumileds Holding B.V. ,  Fancsali, Erno ,  Guth, Gregory ,  Shchekin, Oleg B.

发明人： DIANA, Frederic S. ,  FANCSALI, Erno ,  DE SMET, Thierry ,  GUTH, Gregory ,  MARTYNOV, Yourii ,  SHCHEKIN, Oleg B. ,  BHARDWAJ, Jyoti

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0058

摘要： A method to make light-emitting diode (LED) units include arranging LEDs in a pattern, forming an optically transparent spacer layer over the LEDs, forming an optically reflective layer over the LEDs, and singulating the LEDs into LED units. The method may further include, after forming the optically transparent spacer layer and before singulating the LEDs, forming a secondary light-emitting layer that conforms to the LEDs, cutting the LEDs to form LED groups having a same arrangement, spacing the LED groups on a support, and forming the optically reflective layer in spaces between the LED groups.

公开(公告)号：EP2165373B1

公开(公告)日：2018-09-05

申请号：EP08763334.3

申请日：2008-06-13

申请人： Lumileds Holding B.V.

发明人： SHCHEKIN, Oleg B. ,  EPLER, John ,  ENG, Gregory ,  BIERHUIZEN, Serge ,  HARBERS, Gerard

IPC分类号： H01L33/46 ,  G02B6/00 ,  F21V8/00

CPC分类号： G02B6/0073 ,  H01L33/405 ,  H01L33/46 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Very thin flash modules for cameras are described that do not appear as a point source of light to the illuminated subject. Therefore, the flash is less objectionable to the subject. In one embodiment, the light emitting surface area is about 5 mm×10 mm. Low profile, side-emitting LEDs optically coupled to solid light guides enable the flash module to be thinner than 2 mm. The flash module may also be continuously energized for video recording. The module is particularly useful for cell phone cameras and other thin cameras.

公开(公告)号：EP2308107B1

公开(公告)日：2020-03-25

申请号：EP09786606.5

申请日：2009-07-15

申请人： Lumileds Holding B.V.

发明人： EPLER, John E. ,  NEFF, James G. ,  SHCHEKIN, Oleg B.

IPC分类号： H01L33/00 ,  H01L33/16 ,  H01L33/10 ,  H01L33/22 ,  H01L33/38 ,  H01L33/50 ,  H01L33/58

公开(公告)号：EP3332429A1

公开(公告)日：2018-06-13

申请号：EP16741776.5

申请日：2016-07-13

申请人： Lumileds Holding B.V. ,  Masui, Hisashi ,  Shchekin, Oleg Borisovich ,  Shimizu, Ken ,  Kosowsky, Les ,  Davis, Ken

发明人： MASUI, Hisashi ,  SHCHEKIN, Oleg B. ,  SHIMIZU, Ken ,  KOSOWSKY, Les ,  DAVIS, Ken

IPC分类号： H01L33/46 ,  H01L33/00 ,  H01L33/20 ,  H01L33/44 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54

CPC分类号： H01L33/46 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L2933/0025 ,  H01L2933/0058

摘要： A semiconductor light emitting device (100;200;300;400,400B,400C;500;600;700) may have a reflective side coating (120;220;320;420;520;620;720) disposed on a sidewall (118;215;315;415,435;515) of a semiconductor light emitting device structure. Such a device may be fabricated by dicing a semiconductor structure to separate a semiconductor light emitting device structure and then forming a reflective side coating (120;220;320;420;520;620;720) on a sidewall (118;215;315;415,435;515) of the separated semiconductor light emitting device structure.