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公开(公告)号：EP0710177A4
公开(公告)日：1997-01-02
申请号：EP94922596
申请日：1994-07-20
发明人： NGUYEN PHONG X , NISSEN STEVEN R
CPC分类号： H05K1/167 , H05K3/062 , H05K3/064 , H05K3/067 , H05K2201/0338 , H05K2201/0355 , H05K2203/0361 , H05K2203/0384 , H05K2203/0723 , Y10S428/901 , Y10T428/12854 , Y10T428/24917
摘要： A circuit board material (10) is disclosed which includes a support layer (12), at least one electrical resistance layer (14) having a preselected resistivity adhered to the support layer (12), a barrier layer (16) adhered to the electrical resistance layer (14), and a conductive layer (18) adhered to the barrier layer (16). The barrier layer (16) is capable of protecting the resistance layer (14) from attack by alkaline ammoniacal copper etchants. A method of producing the circuit board material (10) is also disclosed.
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公开(公告)号：EP0710177A1
公开(公告)日：1996-05-08
申请号：EP94922596.0
申请日：1994-07-20
CPC分类号： H05K1/167 , H05K3/062 , H05K3/064 , H05K3/067 , H05K2201/0338 , H05K2201/0355 , H05K2203/0361 , H05K2203/0384 , H05K2203/0723 , Y10S428/901 , Y10T428/12854 , Y10T428/24917
摘要： A circuit board material (10) is disclosed which includes a support layer (12), at least one electrical resistance layer (14) having a preselected resistivity adhered to the support layer (12), a barrier layer (16) adhered to the electrical resistance layer (14), and a conductive layer (18) adhered to the barrier layer (16). The barrier layer (16) is capable of protecting the resistance layer (14) from attack by alkaline ammoniacal copper etchants. A method of producing the circuit board material (10) is also disclosed.
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公开(公告)号：EP0710177B1
公开(公告)日：2003-05-02
申请号：EP94922596.5
申请日：1994-07-20
CPC分类号： H05K1/167 , H05K3/062 , H05K3/064 , H05K3/067 , H05K2201/0338 , H05K2201/0355 , H05K2203/0361 , H05K2203/0384 , H05K2203/0723 , Y10S428/901 , Y10T428/12854 , Y10T428/24917
摘要： A circuit board material (10) is disclosed which includes a support layer (12), at least one electrical resistance layer (14) having a preselected resistivity adhered to the support layer (12), a barrier layer (16) adhered to the electrical resistance layer (14), and a conductive layer (18) adhered to the barrier layer (16). The barrier layer (16) is capable of protecting the resistance layer (14) from attack by alkaline ammoniacal copper etchants. A method of producing the circuit board material (10) is also disclosed.
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4.发明公开
公开(公告)号：EP0380545A1
公开(公告)日：1990-08-08
申请号：EP88908520.0
申请日：1988-08-19
发明人： RICE, James, M.
CPC分类号： C25D3/562 , C23F1/02 , H01C17/16 , H05K1/167 , H05K3/067 , H05K3/384 , H05K2201/0338 , H05K2201/0355 , H05K2203/0361 , H05K2203/0392 , H05K2203/0723 , H05K2203/124 , Y10S205/92 , Y10S428/901 , Y10T428/12778 , Y10T428/24917
摘要： Matière améliorée pour plaquette de circuit imprimé composée d'une couche support, d'une couche résistance et d'une couche conductrice. La matière en question a une résistance d'environ 500 ohms par carré. La matière est obtenue en déposant la couche résistance par galvanoplastie sur la couche conductrice. La couche conductrice est activée de préférence avant que la couche résistance fasse l'objet d'un dépôt électrolytique. Cette couche conductrice est activée par contact avec un agent activant tel que le chromate de benzotriazole électrolytique ou un autre agent analogue. Un bain électrolytique préféré pour le dépôt électrolytique de la couche de résistance contient environ 0,5 parties par litre d'hypophosphite de nickel. Le bain électrolytique fonctionne à la température ambiante et est, en fait, indépendant de la température. Les plaquettes de circuit peuvent être fabriquées avec la matière en question par un processus ne comportant que deux opérations d'attaque.
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5.发明授权
公开(公告)号：EP0380545B1
公开(公告)日：1993-10-27
申请号：EP88908520.5
申请日：1988-08-19
发明人： RICE, James, M.
CPC分类号： C25D3/562 , C23F1/02 , H01C17/16 , H05K1/167 , H05K3/067 , H05K3/384 , H05K2201/0338 , H05K2201/0355 , H05K2203/0361 , H05K2203/0392 , H05K2203/0723 , H05K2203/124 , Y10S205/92 , Y10S428/901 , Y10T428/12778 , Y10T428/24917
摘要： An improved circuit board material having a support layer, an electrical resistance layer and a conductive layer. The circuit board material has a resistance of at least about 500 ohms/square. The circuit board material is formed by electro-plating the electrical resistance layer on the conductive layer. The conductive layer is desirably activated prior to electro-deposition of the electrical resistance layer thereon. The conductive layer is activated by contacting with an activating agent such as benzotriazole electrolytic chromate and the like. A preferred electro-plating bath for electro-deposition of the electrical resistance layer comprises about 0.5 mole per liters nickel hypophosphite. The disclosed electro-plating bath functions at ambient temperatures and is effectively temperature independent. Circuit boards can be formed from the circuit board material through a process involving only two etching steps.
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