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    MEHRSCHICHTKÖRPER UND VERFAHREN ZUM HERSTELLEN EINES MEHRSCHICHTKÖRPERS
    4.
    发明公开
    MEHRSCHICHTKÖRPER UND VERFAHREN ZUM HERSTELLEN EINES MEHRSCHICHTKÖRPERS 有权
    维多利亚州赫尔辛基啤酒厂

    公开(公告)号：EP2961617A1

    公开(公告)日：2016-01-06

    申请号：EP14706614.6

    申请日：2014-02-26

    申请人： PolyIC GmbH & Co. KG ,  Leonhard Kurz GmbH & Co. KG ,  OVD Kinegram AG

    发明人： FIX, Walter ,  WALTER, Manfred ,  TOMPKIN, Wayne, Robert ,  SCHILLING, Andreas ,  SCHMIDT, Klaus ,  METZGER, Jürgen

    IPC分类号： B42D15/08 ,  G06K19/067 ,  G06K19/077 ,  B42D15/00

    CPC分类号： G06K19/07754 ,  B42D15/085 ,  B42D25/355 ,  B42D2033/46 ,  G06K19/067 ,  G06K19/07722

    摘要： The invention relates to a multilayer body comprising a support and a layer which is arranged on the support and comprises an electrically conductive material in a specific arrangement. The multilayer body comprises an information region and a background region (18) which are galvanically separated from each other. Each information region is equipped with a first zone (10) which comprises an electrically conductive material, and the electrically conductive material of the first zones is connected in a conductive manner over the totality of the first zones. Each background region is equipped with a plurality of second zones which comprise an electrically conductive material and which are galvanically separated from one another. Each of the first zones (10) preferably takes up a surface area which is larger than each of the second zones by a factor of at least five. The electrically conductive material is preferably provided with an average surface coverage which varies by less than 25% over all the information regions and the background regions (18). In this manner, a homogenous appearance of the multilayer body is provided, and information provided in the information region by means of the shape, size, and/or alignment of the first zone is not visible without an aid and therefore cannot be copied.

    摘要翻译： 一种具有载体和层叠在其上的多层体，其包括在这种布置中的导电材料，其包括彼此电气分离的信息区域和背景区域（18）。 在每个信息区域中，提供具有导电材料的第一区域（10），整个导电材料与其导电连接。 在每个背景区域中，提供具有导电材料的多个第二区域，它们彼此电流分离。 每个第一区域（10）优选地占据比每个第二区域大至少五倍的表面积。 导电材料优选具有在所有信息区域和背景区域（18）上变化小于25％的平均表面覆盖率。 从而确保了多层体的均匀外观，并且由第一区域的形状，尺寸和/或对准提供的信息区域中提供的信息项目在没有帮助的情况下是不可见的，因此不能被复制。

    ORGANISCHE ELEKTRONIKSCHALTUNG
    10.
    发明公开
    ORGANISCHE ELEKTRONIKSCHALTUNG 审中-公开
    有机电子电路

    公开(公告)号：EP2399292A2

    公开(公告)日：2011-12-28

    申请号：EP10705106.2

    申请日：2010-02-16

    申请人： PolyIC GmbH & Co. KG

    发明人： ULLMANN, Andreas ,  KNOBLOCH, Alexander ,  KRUMM, Jürgen

    IPC分类号： H01L27/30 ,  H01L27/28 ,  H01L51/05 ,  H01L51/00

    CPC分类号： H01L27/283 ,  H01L51/0021 ,  H01L51/0541

    摘要： The invention relates to an organic electronic circuit (1) in the form of a multi-layered film body and to a method for the production thereof. The multi-layered film body has a substrate layer (2), a first electrically conductive functional layer (3), an electrically semi-conductive functional layer (4), an isolation layer (5) and a second electrically conductive functional layer (6). The organic electronic circuit (1) has two or more sections (20, 21). At least one first section (20) of the two or more sections (20, 21) is designed as an interconnection assembly (80). There is a plurality of structures (3a) repeating in a preferred direction in said at least one first section (20) that are each shaped in the first electrically conductive functional layer (3), that each are covered by the isolation layer (5) in a central first zone (30) and that each are not covered by the isolation layer (5) in the second zones (31, 32) arranged on both sides of the central first zone (30). At least one second section (21) of the two or more sections (20, 21) is designed as an interconnection assembly (81). A plurality of structures (3b) repeating in a preferred direction is furthermore shaped in said at least one second section (21) in the first electrically conductive functional layer (3). Said structures (3b) arranged in a central first zone (40) are covered by the electrically semi-conductive functional layer (4) and/or the isolation layer (5). Said structures (3b) in at least one second zone (41, 42) arranged neighboring a section are not covered by the isolation layer (5). The second electrically conductive functional layer (6) has at least one first region (50) wherein the second electrically conductive functional layer (6) partially covers at least one structure (3a) of the first electrically conductive functional layer (3) in the at least one section (20) designed as an interconnection assembly (80) and at least one structure (3b) of the first electrically conductive functional layer (3) in the at least one section designed as an electronic assembly (81) forming one or more electrically conductive connections (64, 65, 66). The second electrically conductive functional layer (6) has at least one second region (51) forming an electronic component wherein the second electrically conductive functional layer (6) partially covers the at least one second section (21) designed as an electronic assembly (81).