摘要:
A method of fabricating light-sensing devices including photodiodes monolithically integrated with CMOS devices. Several types of photodiode devices (PIN, HIP) are epitaxially grown in one single step on active areas implanted in a common semiconductor substrate, the active areas having defined polarities. The epitaxially grown layers for the photodiode devices may be either undoped or in-situ doped with profiles suitable for their respective operation. With appropriate choice of substrate materials, device layers and heterojunction engineering and process architecture, it is possible to fabricate siliconbased and germanium-based multi-spectral sensors that can deliver pixel density and cost of fabrication comparable to the state of the art CCDs and CMOS image sensors. The method can be implemented with epitaxially deposited films on the following substrates: Silicon Bulk, Thick-Film and Thin-Film Silicon-On-Insulator (SOI), Germanium Bulk, Thick-Film and Thin-Film Germanium-On-Insulator (GeOI).
摘要:
Photonic devices monolithically integrated with CMOS are disclosed, including sub-100nm CMOS, with active layers comprising acceleration regions, light emission and absorption layers, and optional energy filtering regions. Light emission or absorption is controlled by an applied voltage to deposited films on a pre-defined CMOS active area of a substrate, such as bulk Si, bulk Ge, Thick-Film SOI, Thin-Film SOI, Thin-Film GOI.
摘要:
Light sensing devices are monolithically integrates with CMOS devices on Thin-Film Silicon-On-insulator (TF-SOI) or Thin-Film Germanium-On-Insulator (TF-GeOI) substrates. Photo-diode active layers are epitaxially grown on the front-side of the substrate and after full processing of the front-side of the substrate, the substrate material is removed under the buried insulator (buried oxide). Monolithically integrated structures are then fabricated on the back of the buried oxide. The back-side is then bonded to a new substrate that is transparent to the wavelengths of interest. For example, quartz, sapphire, glass, or plastic, are suitable for the visible range. Back-side illumination of the sensor matrix is thereby allowed, with light traveling through the structures fabricated on the back of the substrate, opposite to the side on which CMOS is made.
摘要:
A method in which thin-film p-i-n heterojunction photodiodes are formed by selective epitaxial growth/deposition on pre-designated active-area regions of standard CMOS devices. The thin-film p-i-n photodiodes are formed on active areas (for example n+-doped), and these are contacted at the bottom (substrate) side by the 'well contact' corresponding to that particular active area. There is no actual potential well since that particular active area has only one type of doping. The top of each photodiode has a separate contact formed thereon. The selective epitaxial growth of the p-i-n photodiodes is modular, in the sense that there is no need to change any of the steps developed for the 'pure' CMOS process flow. Since the active region is epitaxially deposited, there is the possibility of forming sharp doping profiles and band-gap engineering during the epitaxial process, thereby optimizing several device parameters for higher performance. This new type of light sensor architecture, monolithically integrated with CMOS, decouples the photo-absorption active region from the MOSFETs, hence the bias applied to the photodiode can be independent from the bias between the source, drain, gate and substrate (well) of the MOSFETs.
摘要:
Imaging devices including a novel imaging system wherein a 2-dimensional pixel array has a diagonal dimension larger than the diameter measurement of the image circle, thereby being capable of handling rectangular images with multiple aspect ratios. These new imaging devices can be used in various electronic imaging apparatus with or without a lens system.
摘要:
In-pixel circuit architectures for CMOS image sensors are disclosed, which are suitable for avalanche photo-diodes operating either in linear or in non-linear mode. These architectures apply in particular to photo-diodes and image sensors in which CMOS devices are fabricated on thin-film silicon-on-insulator substrates.
摘要:
Several detailed layout designs are disclosed, for the monolithic integration of avalanche devices in large arrays, that can be operated as Avalanche Photo-Diodes (APDs) or Avalanche Light Emitting Diodes (ALEDs) depending only on the applied bias conditions, which can be software-controlled from peripheral circuitry. If the deposited films have direct bandgaps, then the devices can emit light even in the absence of avalanche operation. In particular, the layouts according to the invention comprise a sensor/emitter matrix achieved through the replication of basic Pixel/Lixel cells.
摘要:
A new methodology is disclosed to convert analog electric signals into digital data. The method provides a serial scheme without pre-definition of the number of bits (dynamic range). It allows digital processing of the input signal without sampling and holding of the input signal. Processing of the input signal is clock-less and asynchronously dependent on the time-evolution of the input signal itself. Thereby, a programmable, dynamic adjustment of bandwidth (product of dynamic range and speed of conversion) of the analog-to-digital conversion process can be achieved depending on the characteristics of the input signal. Dynamic adjustment of the bandwidth is accomplished by digitally controlling a 'threshold' value at the input capacitor of the comparator, which when met by the input signal, triggers a transition at the output of the comparator.
摘要:
Imaging devices including a novel imaging system wherein a 2-dimensional pixel array has a diagonal dimension larger than the diameter measurement of the image circle, thereby being capable of handling rectangular images with multiple aspect ratios. These new imaging devices can be used in various electronic imaging apparatus with or without a lens system.